DEK & SIPLACE Press News
Munich, 25th March 2015
DEK and SIPLACE at Nepcon Shanghai
Smart-factory solutions “made in Germany” clear the
way to Industry 4.0
Technology leader ASM Assembly Systems explicitly puts its presence at
Nepcon Shanghai (April 21-23, 2015) under the motto of Industry 4.0. At booth
C-1H01, the company will exhibit the powerful printing and placement platforms
of its DEK and SIPLACE brands, and a large section of the booth will show a
“smart factory”. At various stations for smart planning, smart NPI, smart
changeover and smart material logistics, ASM will show solutions that let users
network, automate, support and control electronics manufacturing processes.
ASM will further underscore its technological leadership position with topics like
0201 (metric) placement, flexible setup concepts, and chip assembly directly
from the wafer. A high-speed line consisting of a DEK Gemini printer and a
SIPLACE X4iS placement machine will demonstrate live what the global leader in
placement performance has to offer. With its E by SIPLACE, ASM will also
present at booth C-1G01 a newly developed solution for mid-speed applications
that comes by default with features like placement force sensors and highprecision drives and sets new standards in quality and performance with
innovations like combi-heads and a high-end digital vision system.
“Industry 4.0 is no abstract concept of the future for us, because we are already
working on concrete implementations for today’s electronics production. In our Smart
Factory section, visitors will see how electronics manufacturers can produce with
significantly more speed, reliability and efficiency by networking their material flows
with the SIPLACE Material Manager. And in areas dedicated to smart NPI, smart
changeover and smart planning we will show how our experts are optimizing not just
printing and placement, but all support processes for modern production lines. We
have a clear roadmap to Industry 4.0 that helps us and our customers around the world
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to turn their operations into smart SMT factories step-by-step,” explains Günter Lauber,
CEO of ASM Assembly Systems.
A large portion of the DEK and SIPLACE booth will be dedicated to the “smart SMT
factory”. Various workstations will provide visitors with a look at fully networked
electronics production. With the SIPLACE Material Manager, ASM will present a
modular software solution for paperless workflows that makes the shop floor fully
transparent and raises it to the level required for Industry 4.0 applications. Other new
products like the SIPLACE Material Tower and the SIPLACE Active Feeder Rack are
further examples of SIPLACE’s dedication to the Industry 4.0 concept. The SIPLACE
Material Tower is an automated and MSD-capable component storage system that is
fully integrated into the SIPLACE Material Manager. The compact cabinet holds up to
900 reels and optimizes the component supply process for lines and kitting areas in the
smart factory. The SIPLACE Active Feeder Rack cuts down on trip frequencies and
distances and reduces manual operations in logistics and setup processes. At the push
of a button, operators can see which materials will still be needed by upcoming jobs or
which feeders must be installed for the next setup. This saves on time, avoids mistakes
and reduces material travel considerably.
Benchmarks in speed, accuracy and flexibility
Powerful DEK printers and SIPLACE placement platforms provide the basis for the
smart SMT factory, which is why the booth will feature a high-speed line with a DEK
Gemini printer and a SIPLACE S4iS placement machine. For more flexible production
environments, a SIPLACE SX placement machine and a DEK Horizon 03iX printer will
be shown.
Another highlight
An SMT line equipped with a DEK Gemini printer and SIPLACE X4i and SIPLACE X3
placement machines will demonstrate the placement of 0201 (metric) components,
while process experts will explain to visitors the intricacies involved in the handling of
these super-small components. In addition, advanced DEK technologies such as the
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SIPLACE Press Office
Susanne Oswald
Rupert-Mayer-Strasse 44, D-81350 Munich, Germany
Tel.: +49 89 20800-26439; Fax: -24260
E-mail: susanne.oswald@asmpt.com
Internet: www.siplace.com
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area ratio rule-breaker ProActiv, VectorGuard High Tension stencils and high–
performance understencil chemistries and fabrics will show how they support
electronics manufacturers on their move to the smart SMT factory.
E by SIPLACE for mid-speed applications
With its E by SIPLACE, ASM is addressing the market for mid-speed applications. The
new platform shines with outstanding specifications in terms of placement speed and
quality. They are made possible by features that used to be unavailable in this
segment: high-precision linear drives, flexible E-feeders, a high-end vision system,
placement sensors even in the standard version, powerful high-speed heads, and
innovative combi-heads that allow even a single-gantry machine to handle a broad
spectrum of components in collect-and-place and pick-and-place mode.
ASM has a clear roadmap to Industry 4.0 that helps electronics manufacturers around the world to turn
their operations into smart SMT factories step-by-step.
www.dek.com
www.siplace.com
SIPLACE Press Office
Susanne Oswald
Rupert-Mayer-Strasse 44, D-81350 Munich, Germany
Tel.: +49 89 20800-26439; Fax: -24260
E-mail: susanne.oswald@asmpt.com
Internet: www.siplace.com
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About The SMT Solutions Segment of ASMPT
With the integration of DEK into ASM Pacific Technology (ASMPT) in July 2014, ASM Assembly
Systems consists of the Printing Solutions Division (DEK) and the Placement Solutions Division
(SIPLACE). ASM Assembly Systems develops and distributes best-in-class DEK printers,
stencils and printing accessories for the SMT, semiconductor and solar markets, as well as
best-in-class SIPLACE SMT placement solutions. Both Divisions leverage the power of ASM’s
development capabilities to deliver significant competitive advantages to customers. By sharing
its knowledge and expertise, the SMT Solutions Segment of ASM provides electronics
manufacturing companies worldwide with more effective process integration technology and
optimized workflows.
For more information about DEK Printing Solutions, visit www.dek.com
For more information about SIPLACE Placement Solutions, visit www.siplace.com
ASM Pacific Technology Limited
ASM Pacific Technology (ASMPT) has been listed on the Hong Kong Stock Exchange since
1989. The ASMPT Group develops systems and solutions for semiconductor production and
packaging as well as surface mount technology applications. The company has plants in Hong
Kong, China, Singapore, Malaysia and Germany.
ASMPT is currently one of the constituent stocks on the Hang Seng HK MidCap Index under the
Hang Seng Composite Index, the Hang Seng Information Technology Industry Index, the Hang
Seng Hong Kong 35 index and the Hang Seng Global Composite Index.
For more information about ASMPT, visit www.asmpacific.com
Please direct reader inquiries to:
ASM Assembly Systems GmbH & Co. KG
Susanne Oswald
E-mail: susanne.oswald@asmpt.com
www.dek.com
www.siplace.com
SIPLACE Press Office
Susanne Oswald
Rupert-Mayer-Strasse 44, D-81350 Munich, Germany
Tel.: +49 89 20800-26439; Fax: -24260
E-mail: susanne.oswald@asmpt.com
Internet: www.siplace.com
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