ASM Press News
ASM @ Productronica,
November 10 – 13, 2015
Stand A3.377
Productronica 2015 - Innovative coating
DEK Nano Ultra stencils push limits for ultra-fine-pitch
applications
The new DEK Nano Ultra stencils deliver significantly improved printing results for
ultra-fine-pitch applications thanks to their innovative coating. The result: up to 40
percent more transfer efficiency for ultra-fine apertures with area ratios of less than
0.6. This minimizes misprints and reduces cleaning costs and cycles while improving
process stability, productivity and quality. More information about DEK Nano Ultra
stencils and other DEK printing technologies for demanding applications is available
at the Productronica 2015 show (Booth A3-377) or online at www.dek.com.
“Because of its reduced transfer efficiency, high-quality printing for ultra-fine-pitch devices
requires frequent understencil cleaning,” explains Jim Williams, Director of DEK Process
Support Products at ASM. “However, electronics manufacturers want to reduce these costs
and improve the quality and stability of their printing process for these modern applications.
DEK Nano Ultra stencils master these challenges and push the traditional limits in printing.”
Unlike traditional wipe-on stencil coatings, ASM coats its DEK Ultra Nano stencils via a spray
technique that deposits a durable 2 µm to 4 µm thick coating on the underside and aperture
walls of the stencil. Extensive tests have shown that the underside coating improves and
accelerates the cleaning process, while the aperture wall coating improves the transfer
efficiency of the solder paste significantly. Inspections under the microscope show cleanly
delimited deposits that are even and sufficiently large.
Significantly improved transfer efficiency
Compared to untreated stencils, DEK Nano Ultra stencils deliver 10 to 40 percent more
transfer efficiency for area ratios between 0.6 and 0.5. In addition to improving the print
quality, the DEK Nano Ultra coating reduces the costs for cleaning and consumables. And as
the printer’s cycle time decreases, the line’s overall throughput and productivity increases.
For the first time, printing processes for ultra-fine-pitch applications become more reliable
and efficient at the same time. Nano Ultra was developed and is licensed from FCT
companies, by ASM Assembly Systems, Printing Solutions Division. DEK Nano Ultra is only
available in Europe.
For more information about DEK Nano Ultra and other ASM products, visit us at our booth
A3.377
at
the
Productronica
show
or
online
at
www.asm-smt-
solutions.com/productronica2015.
The new DEK Nano Ultra stencils deliver significantly improved printing results for ultra-fine-pitch applications
thanks to their innovative coating.
ASM SMT Solutions Global Press Office
Susanne Oswald
Rupert-Mayer-Strasse 44, D-81379 München
Tel.: +49 89 20800-26439; Fax: -24260
E-mail: susanne.oswald@asmpt.com
The SMT Solutions segment of ASM Pacific Technology
Since the acquisition of printing specialist DEK and its integration into ASM Pacific Technology
(ASMPT) on July 2, 2014, ASM Assembly Systems has been operating as ASMPT’s SMT Solutions
segment consisting of the Printing Solutions Division (DEK) and the Placement Solutions Division
(SIPLACE).
SMT Solutions develops and sells best-in-class DEK printers for the SMT, semiconductor and solar
markets as well as best-in-class SIPLACE SMT placement solutions. Both divisions use the ASMPT
organization to let their customers enjoy significant competitive benefits. ASMPT’s SMT Solutions
segment shares and expands its expertise with electronics manufacturers and partners all over the
world. Its goal is to improve its customers’ workflows and use new technologies to advance process
integration in the industry.
For more informationen about SIPLACE, visit www.siplace.com.
For more informationen about DEK, visit www.dek.com
ASM Pacific Technology Limited
ASM Pacific Technology (ASMPT) has been listed on the Hong Kong Stock Exchange since 1989.
The ASMPT Group develops systems and solutions for semiconductor production and packaging as
well as surface mount technology applications. The company has plants in China (incl. Hong Kong),
Singapore, Malaysia, the Netherlands, Germany, and the United Kingdom.
ASMPT is currently one of the constituent stocks on the Hang Seng HK MidCap Index under the Hang
Seng Composite Index, the Hang Seng Information Technology Industry Index, the Hang Seng Hong
Kong 35 index and the Hang Seng Global Composite Index.
For more information about ASMPT, visit www.asmpacific.com
Please direct reader inquiries to:
Global ASM Press Office
ASM Assembly Systems,
Susanne Oswald
E-mail: susanne.oswald@asmpt.com
Tel.: +49 89 20800-26439
ASM SMT Solutions Global Press Office
Susanne Oswald
Rupert-Mayer-Strasse 44, D-81379 München
Tel.: +49 89 20800-26439; Fax: -24260
E-mail: susanne.oswald@asmpt.com