SIPLACE Press News
SIPLACE @ SMT Hybrid & Packaging
April 16 – 19, 2013
Hall 7, Booth 204
ASM Assembly Systems at the SMT Hybrid Packaging 2013 show
New SIPLACE machines and premium solutions for electronics
production
With new SIPLACE placement machines and many software innovations, ASM
Assembly Systems shines with many fresh releases from the segments of
hardware, software and services at the SMT Hybrid & Packaging 2013. At Booth
7-204, the SIPLACE team will present innovations from both ends of its platform
spectrum: With the SIPLACE X3 S, it unveils the latest generation of the
successful SIPLACE X high-end platform, while the SIPLACE D1i is a new
solution for the more price-sensitive SMT production segment. Also new is the
SIPLACE Very High Force Head for placement forces of up to 70 newtons. The
SIPLACE team will demonstrate its lead in the areas of software and workflow
support for materials management with an extensive package of powerful
solutions around SIPLACE Facts, including inventory management and MSD
handling. Another machine will attract lots of attention as well: With its MCM12,
ASM will use the 2013 SMT Hybrid Packaging show to position itself as the
world’s only supplier for frontend, backend and final assembly processes in the
electronics industry.
With the SIPLACE X3 S, ASM Assembly Systems is rolling out the latest generation of
its successful high-end platform. The new machine doesn’t just set new speed records,
but is significantly more flexible than previous models, thanks to its interchange-able
gantries that allow users to scale the machine’s performance in accordance with
changing requirements. The very compact machine (1.9 x 2.6 meters) can handle
PCBs with dimensions of up to 560 x 650 millimeters (W x L).
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The SIPLACE D1, on the other hand, is particularly interesting for the price-sensitive
segment of the market and for electronics producers who are looking for an affordable
yet technologically advanced placement solution as an addition to an existing SIPLACE
line or an entry point into the SIPLACE world. The platform is also interesting because
its software is compatible with the SIPLACE Pro station software, the SiCluster setup
optimization software and many other market-leading SIPLACE software solutions.
Placement head for automotive applications
A demo line featuring the most successful SIPLACE platform SIPLACE SX-Series will
also demonstrate the new SIPLACE Very High Force Head. It is able to handle
connectors and other components with high placement forces of up to 70 newtons.
With this head, users can place snap-in or lock-in components as part of the SMT
process – particularly since the SIPLACE Smart Pin Support provides a fully automated
solution for placing support pins that prevent PCBs from warping. The same SX line will
also feature the SIPLACE Glue Feeder and the new SIPLACE Waffle Pack Changer
(WPC).
Material management: Reduce downtime, increase efficiency
With its intelligent software solutions for NPI and setup processes that have already
delivered significant productivity improvements for many customers, the SIPLACE
team has made lots of headlines in the electronics manufacturing industry in recent
years. Now the company’s engineers are tackling the subject of material management.
The reason: On many factory floors, missing parts, lack of transparency, non-reelbased component availability checks or delayed material provisions lead to
unscheduled downtimes. With SIPLACE Facts, ASM Assembly Systems is now able to
offer customers a complete and paperless material management solution that was
designed especially for the electronics production environment. Its five modules (Facts
Incoming, Facts Warehouse, Facts Material Control, Facts Order Management and
Facts MSD) cover all processes from goods receiving to MSD handling. The solution
can be further enhanced with software solutions such as SIPLACE LED Pairing and
SIPLACE Press Office
Susanne Oswald
Rupert-Mayer-Strasse 44, D-81350 Munich, Germany
Tel.: +49 89 20800-26439; Fax: -24260
E-mail: susanne.oswald@asmpt.com
Internet: www.siplace.com
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SIPLACE Traceability as well as SIPLACE Alternative Components and SIPLACE
Alternative Tracks.
LEDs from wafer to brightness class management
Electronics manufacturers who handle upstream processes like the production of
multichip or LED modules in addition to component placement applications would also
be well advised to visit ASM at Booth 7-204. With its MCM12, the company will show a
solution for multichip modules that integrates die attach, flip chip, chip stacking and
bonding processes in a single unit. The necessary components can be fed from wafers
with a diameter of up to 12 inches as well as from tape feeders and trays.
For more information about the SMT Hybrid Packaging 2013 and the company, visit
www.siplace.com/smtshow2013.
At the SMT Hybrid & Packaging – which has established itself as an important spring trade show for the
European market – the SIPLACE team presents new placement lines, heads and much more.
For more Information, visit www.siplace.com/smtshow2013.
SIPLACE Press Office
Susanne Oswald
Rupert-Mayer-Strasse 44, D-81350 Munich, Germany
Tel.: +49 89 20800-26439; Fax: -24260
E-mail: susanne.oswald@asmpt.com
Internet: www.siplace.com
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ASM Assembly Systems
At the beginning of 2011, the SIPLACE team (formerly Siemens Electronics Assembly Systems)
became a business unit of ASM Pacific Technology and operates now as ASM Assembly
Systems. With its SIPLACE machines and innovative manufacturing concepts, ASM Assembly
Systems GmbH & Co. KG is the world’s leading manufacturer of surface mount technology
(SMT) placement machines and solutions. From the company’s start in 1985 through 2012,
almost 35,000 placement machines have been installed at more than 350 customers worldwide.
Electronics manufacturers in all industries such as telecommunications, automotive, IT,
consumer electronics and automation use and depend on SIPLACE’s broad portfolio of
solutions and services.
For more information about ASM Assembly Systems (SIPLACE), visit www.siplace.com.
ASM Pacific Technology
As a subsidiary of ASM International, which has its headquarters in Almere, Netherlands, ASM
Pacific Technology (ASMPT), Singapore, has developed in only a few years into the world’s
leading supplier of chip assembly, bonding and packaging systems and solutions. The ASMPT
Group produces and markets machines for front-end and back-end chip assembly and
semiconductor packaging. The company has plants in Hong Kong, China, Singapore and
Malaysia, and since January 1, 2011 in Germany. ASMPT has been listed on the Hong Kong
Stock Exchange since 1989.
ASMPT is one of the stocks in the Hang Seng HK MidCap Index under the Hang Seng
Composite Index, the Hang Seng Information Technology Industry Index, and the Hang Seng
Hong Kong 35 Index.
For more information about ASMPT, visit www.asmpacific.com
Please direct reader inquiries to:
ASM Assembly Systems GmbH & Co. KG
Susanne Oswald
E-mail: susanne.oswald@asmpt.com
SIPLACE Press Office
Susanne Oswald
Rupert-Mayer-Strasse 44, D-81350 Munich, Germany
Tel.: +49 89 20800-26439; Fax: -24260
E-mail: susanne.oswald@asmpt.com
Internet: www.siplace.com
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