GD650HFT170P1S IGBT Module STARPOWER IGBT SEMICONDUCTOR GD650HFT170P1S Molding Type Module 1700V/650A 2 in one-package General Description STARPOWER IGBT Power Module provides ultra low conduction loss as well as short circuit ruggedness. They are designed for the applications such as wind and solar power. Features Low VCE(sat) trench IGBT technology 10μs short circuit capability Low inductance case VCE(sat) with positive temperature coefficient Low inductance case Fast & soft reverse recovery anti-parallel FWD High power and thermal cycling capability Typical Applications Auxiliary Inverters High Power Converters UPS Wind and Solar Power Traction Drives ©2011 STARPOWER Semiconductor Ltd. 9/13/2011 1/6 Preliminary GD650HFT170P1S IGBT Module Absolute Maximum Ratings TC=25℃ unless otherwise noted Symbol VCES VGES IC ICM IF IFM PD Tjmax Tstg VISO Mounting Torque Description Collector-Emitter Voltage Gate-Emitter Voltage Collector Current @ TC=25℃ @ TC=100℃ Pulsed Collector Current tp=1ms Diode Continuous Forward Current @ TC=100℃ Diode Maximum Forward Current tp=1ms Maximum Power Dissipation @ Tj=175℃ Maximum Junction Temperature Storage Temperature Range Isolation Voltage RMS,f=50Hz,t=1min Power Terminal Screw:M4 Power Terminal Screw:M8 Mounting Screw:M5 GD650HFT170P1S 1700 ±20 950 650 1300 Units V V 650 A 1300 3817 175 -40 to +125 4000 1.8 to 2.1 8.0 to 10 3.0 to 5.0 A W ℃ ℃ V A A N.m N.m Electrical Characteristics of IGBT TC=25℃ unless otherwise noted Off Characteristics Symbol V(BR)CES ICES IGES Parameter Collector-Emitter Breakdown Voltage Collector Cut-Off Current Gate-Emitter Leakage Current Test Conditions Min. Typ. Max. 1700 Tj=25℃ Units V VCE=VCES,VGE=0V, Tj=25℃ VGE=VGES,VCE=0V, Tj=25℃ 5.0 mA 400 nA On Characteristics Symbol VGE(th) VCE(sat) Parameter Gate-Emitter Threshold Vol tage Collector to Emitter Saturation Voltage Test Conditions IC=24.0mA,VCE=VGE, Tj=25℃ IC=650A,VGE=15V, Tj=25℃ IC=650A,VGE=15V, Tj=125℃ ©2011 STARPOWER Semiconductor Ltd. 9/13/2011 Min. Typ. Max. Units 5.2 5.8 6.4 V 1.90 2.35 V 2.30 2/6 Preliminary GD650HFT170P1S IGBT Module Switching Characteristics Symbol td(on) tr td(off) tf Eon Eoff td(on) tr td(off) tf Eon Eoff Cies Coes Cres Parameter Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Input Capacitance Output Capacitance Reverse Transfer Capacitance ISC SC Data RGint LCE Internal Gate Resistance Stray Inductance Module Lead Resistance, Terminal To Chip RCC’+EE’ Test Conditions Min. VCC=900V,IC=650A, RGon=1.0Ω, RGoff=2.7Ω, VGE=±15 V, Tj=25℃ VCC=900V,IC=650A, RGon=1.0Ω, RGoff=2.7Ω, VGE=±15 V, Tj=125℃ VCE=25V,f=1MHz, VGE=0V tP≤10μs,VGE=15 V, Tj=125℃,VCC=1000 V, VCEM≤1700V Typ. 303 87 867 130 Max. Units ns ns ns ns 140 mJ 170 mJ 325 108 1083 217 ns ns ns ns 210 mJ 250 mJ 52.9 2.20 nF nF 1.75 nF 2400 A 1.7 18 Ω nH 0.30 mΩ Electrical Characteristics of Diode TC=25℃ unless otherwise noted Symbol VF Qr IRM Erec Parameter Diode Forward Vol tage Recovered Charge Peak Reverse Recovery Current Reverse Recovery Energy Test Conditions Tj=25℃ IF=650A Tj=125℃ Tj=25℃ Tj=125℃ IF=650A, Tj=25℃ VR=900V, RGon=1.0Ω, Tj=125℃ VGE=-15V Tj=25℃ Tj=125℃ ©2011 STARPOWER Semiconductor Ltd. 9/13/2011 Min. Typ. 1.80 1.90 150 250 680 750 74.5 155 3/6 Max. 2.25 Units V μC A mJ Preliminary GD650HFT170P1S IGBT Module Electrical Characteristics of NTC TC=25℃ unless otherwise noted Symbol R25 ∆R/R P25 B25/50 Parameter Rated Resistance Deviation of R100 Power Dissipation Test Conditions TC=100℃,R100=493Ω B-value R2=R25exp[B25/50(1/T21/(298.15K))] Min. Typ. 5.0 Max. -5 3375 5 Units kΩ % 20.0 mW K Thermal Characteristics Symbol RθJC RθJC RθCS Weight Parameter Junction-to-Case (per IGBT) Junction-to-Case (per Diode) Case-to-Sink (Conductive grease applied) Weight of Module ©2011 STARPOWER Semiconductor Ltd. 9/13/2011 Typ. Max. 39.3 74.8 4.5 825 4/6 Units K/kW K/kW K/kW g Preliminary GD650HFT170P1S IGBT Module Equivalent Circuit Schematic Package Dimensions Dimensions in Millimeters ©2011 STARPOWER Semiconductor Ltd. 9/13/2011 5/6 Preliminary GD650HFT170P1S IGBT Module Terms and Conditions of Usage The data contained in this product datasheet is exclusively intended for technically trained staff. you and your technical departments will have to evaluate the suitability of the product for the intended application and the completeness of the product data with respect to such application. This product data sheet is describing the characteristics of this product for which a warranty is granted. Any such warranty is granted exclusively pursuant the terms and conditions of the supply agreement. There will be no guarantee of any kind for the product and its characteristics. Should you require product information in excess of the data given in this product data sheet or which concerns the specific application of our product, please contact the sales office, which is responsible for you (see www.powersemi.cc), For those that are specifically interested we may provide application notes. Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact the sales office, which is responsible for you. Should you intend to use the Product in aviation applications, in health or live endangering or life support applications, please notify. If and to the extent necessary, please forward equivalent notices to your customers. Changes of this product data sheet are reserved. ©2011 STARPOWER Semiconductor Ltd. 9/13/2011 6/6 Preliminary