John H. Lau has been a Senior Technical Advisor of ASM since July 2014. Prior to that,
he was a Senior Scientist/MTS at Hewlett-Packard Laboratory/Agilent in California, US for
more than 25 years. With more than 37 years of R&D and manufacturing experience, he
has authored more than 435 peer-reviewed technical publications, 30 issued and pending
patents, and 20 textbooks on 3D IC integration and packaging, 3D MEMS packaging, and
reliability of 2D and 3D IC interconnects.