SIPLACE Press News
SMT Hybrid Packaging 2012
Munich, May 8, 2012
Flexible like a feeder
SIPLACE Gluefeeder delivers significant cost and process benefits for
selective gluing
With the new SIPLACE Gluefeeder, ASM Assembly Systems is presenting a
completely new solution for dual-sided boards and other applications requiring
the selective gluing and fastening of SMT components at this year's SMT Hybrid
Packaging Nuremberg trade show (Hall 7 Booth 204). Unlike other gluing
systems, the SIPLACE Gluefeeder is not permanently integrated into the
placement machine or screen printer, but can be flexibly set up like any other
feeder. During the placement process, the head guides the components over the
dispenser where a program-controlled precision jet applies precise glue dots to
them before they are affixed to the board. The SIPLACE Gluefeeder delivers a
whole series of benefits: Since the dispenser can be set up virtually anywhere,
products requiring glued components can now be produced on different lines.
Since the glue is applied to the components and not to the board, no
cumbersome cleaning process is needed when something goes wrong. And the
costs drop, because the Gluefeeder eliminates the need to invest in expensive
gluing stations. For more information, please visit ww.siplace.com/SMT2012.
Particularly with dual-sided boards, large components often cause problems because
they can easily fall off or slip during the second pass through the reflow oven. To keep
this from happening, modern factories affix such components with adhesive. In the
past, special gluing stations or adhesive dispensing systems were used for this
purpose which were permanently integrated into screen printers or placement
machines. With the SIPLACE Gluefeeder, the SIPLACE team now presents a totally
new process approach and an innovative solution for selective gluing that eliminates
the serious deficiencies and commercial risks of traditional glue dispensing systems.
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Flexible like a feeder
The SIPLACE Gluefeeder does not become a permanent part of the placement
machine, but is set up on the feeder table as needed, just like a regular feeder. With
this approach, it converts any modern SIPLACE placement machine into a gluing
station. Instead of being able to process products requiring gluing only a few lines
which are equipped with special and expensive gluing stations, the SIPLACE
Gluefeeder enables electronics manufacturers to use any line and plan in a more
flexible and utilization-oriented manner. If multiple components need to be glued, the
gluing performance is easily scalable by simply adding more Gluefeeders. Another
advantage: While fixed glue dispensing systems often lead to a permanent reduction in
the placement machine's performance, the SIPLACE Gluefeeder slows it down only
slightly when it is used and not at all when no gluing is needed.
Jet dispenser applies glue selectively and upward
Most traditional glue dispensing systems apply the glue downward and over a large
area directly to the PCB. The SIPLACE Gluefeeder works very differently: Using a
modern jet dispenser, it rapidly "shoots" minute glue droplets upward and with
exceptional accuracy onto the component to be affixed. To get the glue treatment, the
component is simply moved across the SIPLACE Gluefeeder after having been picked
up by the placement head. By turning the glue application around, the SIPLACE
engineers developed additional cost and process benefits: Instead of requiring special
vision systems, the glue application can now be checked with the placement machine's
regular cameras. If the system detects a flaw, it simply discards the component and
repeats the process. Thus even a faulty glue application costs less than with traditional
systems, where the entire board must be either discarded or cleaned at great expense.
Improved process reliability
At the same time, the SIPLACE Gluefeeder reduces the error rate, because all the data
regarding PCBs, components and fiducials is readily available, and with the jet
dispenser the glue application can be controlled much more accurately than before –
with traditional tools and placement programs. The Gluefeeder even handles deformed
SIPLACE Press Office
Susanne Oswald
Rupert-Mayer-Strasse 44, D-81350 Munich, Germany
Tel.: +49 89 20800-26439; Fax: -24260
E-mail: susanne.oswald@asmpt.com
Internet: www.siplace.com
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PCBs – unlike traditional screen-based glue dispensing systems. And the programming
is also a lot faster, because all the pertinent data is already in the system.
For electronics manufacturers who need to selectively glue individual components, the
SIPLACE Gluefeeder thus opens up an entire set of new options and significant cost
and process benefits. SIPLACE will demonstrate the new Gluefeeder "live" at this
year's SMT Hybrid Packaging trade show in Nuremberg, Germany (Hall 7 Booth 204).
For more information, visit www.siplace.com/SMT2012.
Unlike other gluing systems, the SIPLACE Gluefeeder is not permanently integrated into the placement
machine or screen printer, but can be flexibly set up like any other feeder.
For more Information, visit www.siplace.com.
ASM Assembly Systems
At the beginning of 2011, the SIPLACE team (formerly Siemens Electronics Assembly Systems)
became a business unit of ASM Pacific Technology and operates now as ASM Assembly
Systems. With its SIPLACE machines and innovative manufacturing concepts, ASM Assembly
SIPLACE Press Office
Susanne Oswald
Rupert-Mayer-Strasse 44, D-81350 Munich, Germany
Tel.: +49 89 20800-26439; Fax: -24260
E-mail: susanne.oswald@asmpt.com
Internet: www.siplace.com
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Systems GmbH & Co. KG is the world’s leading manufacturer of surface mount technology
(SMT) placement machines and solutions. Since its beginnings in 1985, the company has
installed almost 25,000 placement machines at over 2,500 customers all over the world.
Electronics manufacturers in all industries such as telecommunications, automotive, IT,
consumer electronics and automation use and depend on SIPLACE's broad portfolio of
solutions and services.
For more information about ASM Assembly Systems (SIPLACE), visit www.siplace.com.
ASM Pacific Technology
As a subsidiary of ASM International, which has its headquarters in Almere, Netherlands, ASM
Pacific Technology (ASMPT), Singapore, has developed in only a few years into the world’s
leading supplier of chip assembly, bonding and packaging systems and solutions. The ASMPT
Group produces and markets machines for front-end and back-end chip assembly and
semiconductor packaging. The company has plants in Hong Kong, China, Singapore and
Malaysia, and since January 1, 2011 in Germany. ASMPT has been listed on the Hong Kong
Stock Exchange since 1989.
ASMPT is one of the stocks in the Hang Seng HK MidCap Index under the Hang Seng
Composite Index, the Hang Seng Information Technology Industry Index, and the Hang Seng
Hong Kong 35 Index.
For more information about ASMPT, visit www.asmpacific.com
Send reader inquiries to:
ASM Assembly Systems GmbH & Co. KG
Susanne Oswald
Email: susanne.oswald@asmpt.com
SIPLACE Press Office
Susanne Oswald
Rupert-Mayer-Strasse 44, D-81350 Munich, Germany
Tel.: +49 89 20800-26439; Fax: -24260
E-mail: susanne.oswald@asmpt.com
Internet: www.siplace.com
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