North America Regional Standards
Committee (NA RSC)
Report to the ERSC
April 2014
NARSC Report - April 2014
Outline
•
•
•
•
•
Current Structure of NA Standards Committees
NARSC Spring 2014 Meeting
Upcoming Events
Overall TC/WG Updates
Regional Staff Contact Information
NARSC Report - April 2014
Current Structure of the NARSC [1/2]
NARSC
New!
New!
Automated Test Equip
Ajay Khoche (Khoche Consulting)
Compounds
Jim Oliver (Northrup Grumman)
Russ Kremer (Freiberger)
EHS (NA)
Chris Evanston (Salus)
Sean Larsen (LAM Research AG)
Bert Planting (ASML)
Facilities
Steve Lewis (DPS Engineering)
Chair: Jackie Ferrell (ISMI)
Chair: Sean Larsen (LAM Research AG)
Vice-Chair: David Busing (Consultant)
Vice-Chair: Brian Rubow (Cimetrix)
Gases
Tim Volin (Parker Hannifin)
Mohamed Saleem (Fujikin)
Wes Erck (W.Erck & Associates)
Rick Silver (NIST)
PIC
Jack Ghiselli (Consultant)
Lance Rist (Industry Consultant)
Brian Rubow (Cimetrix)
Mutaz Haddadin (Intel)
Matt Fuller (Entegris)
Liquid Chemicals
Frank Flowers (FMC)
Frank Parker (ICL Performance)
MEMS / NEMS
FPD (NA)
Metrics
David Bouldin (Fab Consulting)
Mark Frankfurth (Cymer)
NARSC Report - April 2014
Traceability
Win Baylies (BayTech Group)
Yaw Obeng (NIST)
Information & Control
Win Baylies (BayTech Group)
Janet Cassard (NIST)
Bill Colbran (Engenuity)
Microlithography
Photovoltaic (PV)
Win Baylies (BayTech Group)
James Moyne (Applied Materials)
PV - Materials
Lori Nye (Brewer Science)
John Valley (Sun Edison)
Silicon Wafer
Noel Poduje (SMS)
Dinesh Gupta (STA)
Mike Goldstein (Intel), vice-chair
HB-LED
Iain Black (Philips)
Chris Moore (---)
Mike Feng (Silian)
New!
Bill Quinn (WEQ Consulting)
3DS-IC
Chris Moore (---)
Sesh Ramaswami (AMAT)
Urmi Ray (Qualcomm)
Rich Allen (SEMATECH)
Technical Architects
Board (TAB)
James Moyne (AMAT)
Yaw Obeng (NIST)
Current Structure of the NARSC [2/2]
NARSC
Chair: Jackie Ferrell (ISMI)
Chair: Sean Larsen (LAM Research AG)
Vice-Chair: David Busing (Consultant)
Vice-Chair: Brian Rubow (Cimetrix)
EHS WG (Korea)
FPD (Korea)
EHS (Taiwan)
PV (China)
Seoung Jong Ko (SK Hynix)
Kwansik Kim (Samsung Elec.)
Jong Seo Lee (Samsung Display)
Il-Ho Kim (LMS)
Shuh-Woei Yu (SAHTECH)
Fang-Ming Hsu (TSMC)
Guangchun Zhang (Suntech)
Jun Liu (China Electronics
Standardization Institute)
HB-LED WG (Korea)
FPD Metrology (Korea)
FPD (Taiwan)
Hyung-Soo Park (SEMES)
Jong Hyeob Baek (KOPTI)
Jong Seo Lee (Samsung Display)
Il-Ho Kim (LMS)
Tzeng-Yow Lin (ITRI)
Jia-Ming Liu (TDMDA)
Facilities (Korea)
I&C (Taiwan)
Kwang Sun Kim (KUT)
Insoo Cho (Shinsung ENG)
Robert Chien (TSMC)
I&C (Korea)
Chulhong Ahn (SK Hynix)
Gunwoo Lee (Miracom)
Hyungsu Kim (Samsung SDS)
Photovoltaic (Taiwan)
B.N. Chuang (CMS/ITRI)
J.S. Chen (TeraSolar)
Ray Sung (UL Taiwan)
3DS-IC (Taiwan)
Tzu-Kun Ku (ITRI)
Wendy Chen (King Yuan
Electronics)
NARSC Report - April 2014
Regional Committees
&
Working Groups
NARSC Meeting Information
• Last Meeting
– March 30 for NA Spring 2014 Meetings
San Jose, California
• Next Meeting
– July 6 for SEMICON West 2014
San Francisco, California
NARSC Report - April 2014
NARSC Spring 2014 Meeting
• Meeting Highlights
– Approved formation of the China HB-LED TC Chapter
• EHS-related discussions removed from scope until there is clarity
on where such discussions would be addressed
– Endorsed formation of the PV Systems Global Technical
Committee as well as the China PV Systems TC Chapter
• To be submitted for ISC approval
• Materials and components removed from scope
• EHS-related discussions removed from scope until there is clarity
on where such discussions would be addressed
• NARSC to work on a proposal for SEMI to expand the scope of
its Standards Program
NARSC Report - April 2014
NARSC Spring 2014 Meeting
• Leadership Changes
– NARSC Co-chair
• Steve Lewis (DPS Engineering) has been appointed as new NARSC co-chair
• Jackie Ferrell (SEMATECH) stepped down
– NARSC Vice-chair
• Brian Rubow (Cimetrix) has been appointed as NARSC vice-chair
• David Busing (consultant) has been appointed as NARSC vice-chair
• Mark Crockett (MEMSMART) stepped down
– NARSC Member-at-Large (MAL)
• Jackie Ferrell (SEMATECH) has been appointed as NARSC MAL
• Frank Flowers (Peroxychem) has been appointed as NARSC MAL
– NA HB-LED
• Mike Feng (Silian) has been appointed as new HB-LED co-chair
• David Reid (Silian) stepped down
NARSC Report - April 2014
NA Standards Spring 2014 Meetings
March 31 – April 3
• Most Standards meetings were
held at SEMI Headquarters (San
Jose, CA)
–
–
–
–
–
–
–
3DS-IC
EHS
Facilities & Gases
Information & Control
Metrics
NARSC
PV Materials
NARSC Report - April 2014
• Intel (Santa Clara)
hosted
– PIC
– Silicon Wafer
SEMI thanks Intel for
hosting these meetings.
Upcoming NA Meetings – 2014
Event Name
Event Type
Date/Venue
March 31 – April 3, 2014
SEMI HQ in San Jose, California
NA Standards Spring 2014
Meetings
Standards Meetings
NA Compound Semiconductor
Materials TC Meeting 2014
CS MANTECH
NA Standards Meetings at
SEMICON West 2014
Standards Meetings
July 7-10, 2014
San Francisco, California
NA Standards Fall 2014
Meetings
Standards Meetings
November 3-6, 2014
SEMI HQ in San Jose, California
NARSC Report - April 2014
COMPLETED
May 21, 2014
Sheraton Denver Downtown Hotel, Denver, Colorado
NA Standards Meetings at
SEMICON West 2014 (July 6-10)
Sunday
6
Monday
Tuesday
7
Wednesday
8
9
Thursday
10
Friday
11
Saturday
12
3DS-IC
NARSC
EH&S
Schedule
at-a-glance
Facilities & Gases
HB-LED
Information & Control
Liquid Chemicals
MEMS/NEMS
Metrics
Microlithography
PV/PV Materials
Physical Interfaces & Carriers
Silicon Wafer
Traceability
San Francisco
Marriott Marquis
Hotel
Overall TC/WG Updates
(from NA Spring 2014 Meetings)
• NA 3DS-IC
– Last meeting: April 1, 2014
– Approved Ballots
• Doc. 5693, New Standard: Guide for Describing Silicon Wafers for Use as 300 mm Carrier
Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process
• Doc. 5694, New Standard: Guide for Describing Materials Properties for a 300 mm 3DS-IC
Wafer Stacks
• Doc. 5695, New Standard: Guide to Describing Materials Properties for Intermediate Wafers
for Use in a 300 mm 3DS-IC Wafer Stack
– New Activity
• New Standard: Specification of Glass Interposers (#TBA)
– Upcoming Ballots
• New Standard: Guide for Describing Silicon Wafers for Use in a 300 mm 3DS-IC Wafer Stack
[#5173E]
• New Standard: Terminology for Through Glass Via and Blind Via in Glass Geometrical
Metrology [#5447A]
• New Standard: Guide for Measuring Warp, Bow and TTV on Silicon and Glass Wafers
Mounted on Wire Grids by Automated Non-Contact Scanning using Laser Scanning
Interferometry [#5506]
NARSC Report - April 2014
Overall TC/WG Updates
• NA Automated Test Equipment (ATE)
– No update
• NA Compound Semiconductor Materials
– Last meeting: November 15, 2013
• Teleconference and web meeting only
• Agenda: Current progress report from task forces
– Issued Ballots (C2-14)
• New Standard: Specification for Round, Polished GaN Wafers (#4979)
• Line Item Revision to M9.7, Specification for Round 150 mm
Diameter Polished Monocrystalline Gallium Arsenide Wafers (Notched)
(#5593)
NARSC Report - April 2014
Overall TC/WG Updates
(from NA Spring 2014 Meetings)
• NA Environmental Health and Safety (EHS)
– Last meeting: April 4, 2014
– No ballots reviewed
– Leadership / Task Force Changes
• S2 Fail-Safe Fault-Tolerant TF has been disbanded.
• Eric Sklar (Safety Guru, LLC) has been appointed as new Fire Protection TF co-leader
– Completed S2 to Machinery Directive Mapping TF draft to be distributed to
EHS TC membership for review and inputs.
– Upcoming 5-Year Review
• S5 (Sizing and Identifying Flow Limiting Devices for Gas Cylinder Valves) reapproval ballot to
be issued after NA Fall 2014 meetings
• S27 (Contents of EHS Evaluation Reports) reapproval ballot to be issued after NA Fall 2014
meetings
– New Activities
• Line Item Revision to S10, Safety Guideline for Risk Assessment and Risk Evaluation Process
(#TBA)
NARSC Report - April 2014
Overall TC/WG Updates
(from NA Spring 2014 Meetings)
• NA Environmental Health and Safety (EHS), cont’d
– Upcoming Ballots
• S2 Line Item Revisions
– Delayed revisions related to work at elevated locations and design
criteria for platforms, steps, and ladders [#4449C]
– Delayed revisions related to chemical exposure [#4683]
– Delayed revisions related to fire protection [#5591]
– Delayed revisions related to non-ionizing radiation [#5625]
• S2/S22 Line Item Revisions
– Delayed revision related to programmable safety circuits [#4316K]
• S22 (Electrical Safety) Line Item Revisions
– Delayed revision related to IEC 60204-33 alignment [#5649A]
• S8 (Ergonomics) Line Item Revisions
– Delayed revisions on multiple topics [#5009C]
NARSC Report - April 2014
Overall TC/WG Updates
(from NA Spring 2014 Meetings)
• NA Facilities & Gases
– Last meeting: April 1, 2014
– TF / Leadership Change
• Jeff Christain (Wika) and Joyce Chen (UCT) have been appointed as Pressure
Measurement TF co-leaders
– Approved Documents
• Revision to C3.32 (Chlorine, 99.996% Quality) [#5672]
• Revision to C3.37 (Hexafluoroethane, 99.97% Quality) [#5674]
• Line Item Revisions to E6 (equipment installation), E54.18 (vacuum pump device), E54.22
(vacuum pressure gauges), F79 (gas compatibility with Si), F105 (metallic material
compatibility) [#5669]
• Withdrawal of E52 (Practice for Referencing Gases, Gas Mixtures and Vaporizable Materials
Used in Digital Mass Flow Controllers) [#5668]
– New Activity – Reapprovals for:
• F19 (Surface Condition of the Wetted Surfaces of Stainless Steel Components),
• F73 (SEM Evaluation of Wetted Surface Condition of Stainless Steel Components),
• F77 (Electrochemical Critical Pitting Temperature Testing of Alloy Surfaces Used in Corrosive
Gas Systems)
NARSC Report - April 2014
Overall TC/WG Updates
• NA HB-LED
– Last meeting: February 25, 2014
– Approved Ballots
• Line Item Revisions to HB1, Specifications for Sapphire Wafers Intended for Use for
Manufacturing High Brightness-Light Emitting Diode Devices [#5684]
– Withdrawn SNARF
• New Standard, Guide for Measuring Surface Roughness of Sapphire Wafers for HB-LED
Applications (#5630)
– SNARF withdrawn since there is already an existing Document addressing the same topic.
– TF Leadership Changes
• HB-LED Wafer TF / Impurities & Defects TF
– Julie Chao (Silian) and David Joyce (GT Advanced Technologies) stepped down
• HB-LED Wafer TF
– Win Baylies (BayTech) was appointed as new TF leader
• Patterned Sapphire Substrate (PSS) TF
– Matt Novak (Bruker Nano) and Nigel Mason (LayTec) stepped down
– Win Baylies (BayTech) was appointed as new TF leader
NARSC Report - April 2014
Overall TC/WG Updates
(from NA Spring 2014 Meetings)
• NA Information & Control (I&C)
– Last meeting: April 3, 2014
– Approved Ballots
• Doc. 5650, Line Item Revisions to E133 (Process Control Systems)
• Doc. 5678, Reapprovals for E39/E39.1 (Object Services Standard)
• Doc. 5680, Reapproval for E148 (Time Synchronization &
Definition of TS-Clock Object)
– New Activity
• Revisions to E133/E133.1 (PCS) [#TBA]
– This will be a major revision
– Scope: alignment with XML guidelines document | schema changes |
technical changes to clarify implementation of PCS analysis engine type |
remove “Provisional” in E133.1
NARSC Report - April 2014
Overall TC/WG Updates
(from NA Spring 2014 Meetings)
• NA Information & Control (I&C), cont’d
– Revised SNARF
• (#5589) Revisions to E5, E30, E30.1, E40.1, E82, E87.1, E88, E90.1,
E91, E94.1, E109, E109.1, E116.1, E122, E122.1, E123, E123.1, E138,
E153
(remove references and content related to SML and SML Notation)
– Updated list of standards to be revised by this SNARF to: E5, E40.1, E90.1,
E94.1, E109, E106.1, and E116.1
– SECS Message Language (SML) Copyright
• SEMI instructed the committee to discontinue any additional
discussion with regard to the disposition of SML-related content in
the previously identified SEMI Standards. More analysis is needed with
regard to the SML copyright matter and any additional discussions will
occur between SEMI and its legal counsel.
NARSC Report - April 2014
Overall TC/WG Updates
(from NA Spring 2014 Meetings)
• NA Information & Control (I&C), cont’d
– Upcoming Ballots
• Line Item Revisions to E120, E120.1, E125, E125.1, E128, E132,
E132.1, E134, E134.1, E138, E145, and E164 (address issues identified
in DDA TF, minor/technical changes) [#5507A]
• Revisions to E5, E90, and E90.1 (Provide generalized support for
multiple substrate groups {e.g., HB-LED}) [#5508]
• Revisions to E5, E40.1, E90.1, E94.1, E109, E106.1, and E116.1
(remove references and content related to “SML” and “SML
Notation) [#5589A]
• Revision to E30 + New Complementary File: SECS-II Equipment Data
Template [#5619A]
• Revision to E5 + New Complementary File: SECS-II Message Notation
using XML [#5620]
• Revision to E164 (Correct the reported issues in the E164
Complementary Files and Various Materials) [#5677]
• Revisions to E133 and E133.1 (process control systems) [#TBA]
NARSC Report - April 2014
Overall TC/WG Updates
(from NA Spring 2014 Meetings)
• NA Liquid Chemicals
– Last meeting: April 1, 2014
– Approved Ballots
• Doc. 5638A, Revision to C18 (acetic acid)
• Doc. 5640A, Revision to C23 (buffered oxide etchants)
– New Activity + Submit for ballot
• Reapproval of C10 (Guide for Determination of Method Detection Limits)
• Reapproval of C64 (SEMI Statistical Guidelines for Ship To Control)
• Reapproval of F48 (Test Method for Determining Trace Metals in Polymer Materials)
– Additional Upcoming Ballots
• Revision to F39 (chemical blending systems) [#5528]
• Revision to C35 (nitric acid) [#5642A]
• New Standard: Test Method for Determining Roughness Of Polymer Surfaces Used In
Ultrapure Water and Liquid Chemical Distribution Systems By Contact Profilometry [#5675]
• New Standard: Test Method for Determining Ion Exchange Resin Contamination Contribution
in High Purity Applications [#5621]
NARSC Report - April 2014
Overall TC/WG Updates
• NA MEMS / NEMS
– Last meeting: October 28, 2013
– Next meeting: July 7 at SEMICON West 2014
NARSC Report - April 2014
Overall TC/WG Updates
(from NA Spring 2014 Meetings)
• NA Metrics
– Last meeting: April 2, 2014
– Approved Ballots
• Doc. 5340, Revision to E10, Specification for Definition and
Measurement of Equipment Reliability, Availability, and Maintainability
(RAM) and Utilization
• Doc. 5341, Revision to E79, Specification for Definition and
Measurement of Equipment Productivity and for Reconciliation with
SEMI E10
NARSC Report - April 2014
Overall TC/WG Updates
• NA Microlithography
– Last meeting: July 9, 2013
• Did not meet during NA Fall 2013 meetings
– Next meeting @ SEMICON West 2014
NARSC Report - April 2014
Overall TC/WG Updates
(from NA Spring 2014 Meetings)
• NA PV Materials
– Last meeting: April 2, 2014
– Leadership and TF Changes
• Hugh Gotts (Air Liquide) was nominated as TC Chapter chair
• PV Electrical & Optical Properties Measurement TF
– Remaining activities will be transferred to Int'l PV Analytical Test
Methods TF
– Approved Ballot
• Doc. 5608, Line-item Revision to SEMI PV13, Test Method for
Contactless Excess-Charge-Carrier Recombination Lifetime
Measurement in Silicon Wafers, Ingots, and Bricks Using an EddyCurrent Sensor
– To add literature citations for methods to determine Fe concentrations
based on PV13 measurement results
NARSC Report - April 2014
Overall TC/WG Updates
(from NA Spring 2014 Meetings)
• NA Physical Interfaces & Carriers (PIC)
– Last meeting: April 2, 2014
– Leadership Changes
• Stefan Radloff (Intel) has been nominated as TC Chapter co-chair
• Mutaz Haddadin (Intel) stepped down as TC Chapter co-chair
– Approved Documents
• Doc. 5676, Line Item Revisions to SEMI E83, Specification for PGV
Mechanical Docking Flange
• Revision (updates) to AUX23, Overview Guide to SEMI Standard for 450
mm Wafers
– New Activity
• Reapproval for E72, Specification and Guide for 300 mm Equipment
Footprint, Height, and Weight
NARSC Report - April 2014
Overall TC/WG Updates
(from NA Spring 2014 Meetings)
• NA Silicon Wafer
– Last meeting: April 1, 2014
– TF Changes
• Int'l Advanced Surface Inspection TF has been changed to Int'l Automated Advance Surface
Inspection TF
– Approved Documents
• Doc. 5663, Reapproval of M58, Test Method for Evaluating DMA Based Particle Deposition
Systems and Processes
• Doc. 5665, Line Item Revision of MF26, Test Method for Determining the Orientation of a
Semiconductive Single Crystal
– Line Item 1: Delete Note 1 and correct Equations 8 and 9
– Revised SNARFs
• (#5404) Reapproval of MF657, Test Method for Measuring Warp and Total Thickness
Variation on Silicon Wafers by Noncontact Scanning. Changed to withdrawal
• (#5604) Revision to M1. Changed to line item revisions to M1 (addition of notchless 450
mm wafers)
• (#5313) Line Item Revision of MF1535, Test Method for Carrier Recombination Lifetime in
Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave
Reflectance. Changed to revision to MF1535.
NARSC Report - April 2014
Overall TC/WG Updates
(from NA Spring 2014 Meetings)
• NA Silicon Wafer, cont’d
– New Activities
• Line Item Revision of M1, Specifications for Polished Single Crystal Silicon Wafers,
to correct references to test methods for measurement of front surface chemistry
(#5701)
• Line Item Revision to M68, Practice for Determining Wafer Near-Edge Geometry
from a Measured Height Data Array using a Curvature Metric, ZDD (#5702)
• New Standard: Guide for Carrier Recombination Lifetime Measurements in
Electronic Grade Silicon (#5703)
• Reapproval of M43, Guide for Reporting Wafer Nanotopgraphy (#5704)
• Reapproval of M67, Practice for Determining Wafer Near-Edge Geometry from a
Measured Thickness Data Array Using the ESFQR, ESFQD, and ESBIR Metrics
(#5705)
• Reapproval of M70, Practice for Determining Wafer-Near-Edge Geometry Using
Partial Wafer Site Flatness (#5706)
• Revision of M40, Guide for Measurement of Roughness of Planar Surfaces on
Silicon Wafers with title change to Guide for Measurement of Roughness of Planar
Surfaces on Polished Wafers (#5707)
NARSC Report - April 2014
Overall TC/WG Updates
(from NA Spring 2014 Meetings)
• NA Silicon Wafer, cont’d
– Upcoming Ballots
•
•
•
•
•
M1 rev (notchless wafers) [#5604]
MF928 rev (edge contour) [#5666]
M35 rev (Si wafer surface features, automated inspection) [#5662]
M40 rev (roughness measurement of planar surface) [#5077]
MF1390 rev (measuring bow/warp, automated noncontact
scanning) [#5539]
• MF657 withdrawal (measuring warp/TTV, noncontact scanning)
[#5404]
NARSC Report - April 2014
Overall TC/WG Updates
• NA Traceability
– Last meeting: July 11, 2013
• Did not meet during NA Fall 2013 and NA Spring 2014
meetings
– Next meeting: SEMICON West 2014
NARSC Report - April 2014
NA Standards Staff Changes
North America
Paul Trio
Headquarters
Michael Tran
Kevin Nguyen
3DS-IC
ATE
EHS
Information & Control
NARSC
Compounds
Facilities
FPD
Gases
HB-LED
Liquid Chemicals
MEMS / NEMS
Metrics
Microlithography
PIC
Traceability
Silicon Wafer
PV/PV Materials
NA Operations
Meetings & Events Planning
Standards Programs/STEPs/WS
CAST SIG
Test Vision
Member Outreach
Sales Development
NA Standards Membership
NA Standards Web
HQ Operations
Standards Ballots
Regs SC
A&R SC
Regional Support
NARSC Report - April 2014
Regional Staff
Contact Information
Name
Paul Trio
E-mail
ptrio@semi.org
Phone
+1.408.943.7041
Office Address
NARSC Report - April 2014
3081 Zanker Road
San Jose, CA 95134
U.S.A.
Thank you!
NARSC Report - April 2014