North America Regional Standards
Committee (NA RSC)
Report to the ERSC
October 2014
NARSC Report - October 2014
Outline
•
•
•
•
•
Current Structure of NA Standards Committees
NARSC SEMICON West 2014 Meeting
Upcoming Events
Overall TC/WG Updates
Regional Staff Contact Information
NARSC Report - October 2014
Current Structure of the NARSC [1/2]
NARSC
New!
New!
New!
Automated Test Equip
Ajay Khoche (Khoche Consulting)
Compounds
Jim Oliver (Northrup Grumman)
Russ Kremer (Freiberger)
EHS (NA)
Chris Evanston (Salus)
Sean Larsen (LAM Research AG)
Bert Planting (ASML)
Facilities
Steve Lewis (DPS Engineering)
Chair: Sean Larsen (LAM Research AG)
Chair: Steve Lewis (DPS Engineering)
Vice-Chair: David Busing (Consultant)
Vice-Chair: Brian Rubow (Cimetrix)
Microlithography
Traceability
Wes Erck (W.Erck & Associates)
Rick Silver (NIST)
Win Baylies (BayTech-Resor)
Yaw Obeng (NIST)
Gases
Tim Volin (Parker Hannifin)
Mohamed Saleem (Fujikin)
Information & Control
Jack Ghiselli (Consultant)
Lance Rist (Industry Consultant)
Brian Rubow (Cimetrix)
Liquid Chemicals
Frank Flowers (FMC)
Frank Parker (ICL Performance)
New!
Bill Colbran (Engenuity)
NARSC Report - October 2014
HB-LED
Iain Black (Philips)
Mike Feng (Silian)
Chris Moore (BayTech-Resor)
Bill Quinn (WEQ Consulting)
Photovoltaic (PV)
Win Baylies (BayTech-Resor)
James Moyne (Univ of Michigan)
PV - Materials
MEMS / NEMS
Win Baylies (BayTech-Resor)
FPD (NA)
PIC
Stefan Radloff (Intel)
Matt Fuller (Entegris)
New!
Lori Nye (Brewer Science)
John Valley (Sun Edison)
Hugh Gotts (Air Liquide)
Metrics
David Bouldin (Fab Consulting)
Mark Frankfurth (Cymer)
Silicon Wafer
Noel Poduje (SMS)
Dinesh Gupta (STA)
Mike Goldstein (Intel), vice-chair
3DS-IC
Sesh Ramaswami (AMAT)
Urmi Ray (Qualcomm)
Rich Allen (SEMATECH)
Chris Moore (BayTech-Resor)
Technical Architects
Board (TAB)
James Moyne (Univ of Michigan)
Yaw Obeng (NIST)
Current Structure of the NARSC [2/2]
NARSC
Chair: Sean Larsen (LAM Research AG)
Chair: Steve Lewis (DPS Engineering)
Vice-Chair: David Busing (Consultant)
Vice-Chair: Brian Rubow (Cimetrix)
New!
EHS WG (Korea)
FPD (Korea)
EHS (Taiwan)
PV (China)
Seoung Jong Ko (SK Hynix)
Kwansik Kim (Samsung Elec.)
Jong Seo Lee (Samsung Display)
Il-Ho Kim (LMS)
Shuh-Woei Yu (SAHTECH)
Fang-Ming Hsu (TSMC)
Guangchun Zhang (Suntech)
Jun Liu (China Electronics
Standardization Institute)
HB-LED WG (Korea)
FPD Metrology (Korea)
FPD (Taiwan)
Hyung-Soo Park (SEMES)
Jong Hyeob Baek (KOPTI)
Jong Seo Lee (Samsung Display)
Il-Ho Kim (LMS)
Tzeng-Yow Lin (ITRI)
Jia-Ming Liu (TDMDA)
Gases & Liquid
Chemical WG (Korea)
Facilities (Korea)
I&C (Taiwan)
Kwang Sun Kim (KUT)
Insoo Cho (Shinsung ENG)
Robert Chien (TSMC)
TBD (---)
I&C (Korea)
Chulhong Ahn (SK Hynix)
Gunwoo Lee (Miracom)
Hyungsu Kim (Consultant)
New!
Yong Ji (Guizhou Haotian
Optoelectronics Technology)
Weizhi Cai
(San’an Optoelectronics)
Photovoltaic (Taiwan)
B.N. Chuang (CMS/ITRI)
J.S. Chen (TeraSolar)
Ray Sung (UL Taiwan)
3DS-IC (Taiwan)
Tzu-Kun Ku (ITRI)
Wendy Chen (King Yuan
Electronics)
NARSC Report - October 2014
HB-LED (China)
Regional Committees
&
Working Groups
NARSC Meeting Information
• Last Meeting
– July 6 for SEMICON West 2014
San Francisco, California
• Next Meeting
– November 2 for NA Fall 2014 Meetings
San Jose, California
NARSC Report - October 2014
NARSC SEMICON West 2014 Meeting
• NARSC Working Session
– Agenda:
• Discussed balloting change to document title
• Studied Regulations SC adjudication proposal (option 4)
• Reviewed China PV Systems proposal
• Recognition
– Jackie Ferrell, previous NARSC
co-chair, was recognized for her
outstanding dedication in the
SEMI Standards Program
NARSC Report - October 2014
NARSC SEMICON West 2014 Meeting
• Leadership Changes
– MEMS / NEMS
• Janet Cassard (NIST) stepped down
– PV Materials
• Hugh Gotts (Air Liquide) has been appointed cochair
– PIC
• Stefan Radloff (Intel) has been appointed cochair
• Mutaz Haddadin (Intel) stepped down
NARSC Report - October 2014
NA Standards Meetings at
SEMICON West 2014 (July 6-10)
Sunday
6
Monday
Tuesday
7
8
Wednesday
9
Thursday
10
Friday
11
Saturday
12
3DS-IC
NARSC
EH&S
Schedule
at-a-glance
Facilities & Gases
HB-LED
Information & Control
Liquid Chemicals
MEMS/NEMS
Metrics
PV Materials
Physical Interfaces & Carriers
Silicon Wafer
Traceability
NARSC Report - October 2014
San Francisco
Marriott Marquis
Hotel
Standards Workshop at
SEMICON West 2014 (July 9)
Sun
6
Mon
7
Tue
8
Wednesday
9
Thu
10
Fri
11
Sat
12
Wafer Geometry Control for Advanced
Semiconductor Manufacturing
July 9, 2014
1:30pm-4:30pm
San Francisco Marriott Marquis
Room: Golden Gate C2
• Important developments and future needs in wafer geometry for advanced
semiconductor manufacturing.
• Presenters from IBM, Intel as well as key equipment companies.
• Proposals discussed during this workshop will be considered for
standardization by the Advanced Wafer Geometry TF under the Silicon
Wafer Committee.
NARSC Report - October 2014
Standards Updates at
SEMICON West 2014
Tuesday, July 8
Wednesday, July 9
Thursday, July 10
Challenges, Innovations and Drivers in
Metrology
• Metrics Activities
Tuesday, July 8, 2014
9:00am-12:00pm
Moscone North, Hall E, Room 130
Embracing what's NEXT – Devices &
Systems for Big Data, Cloud and IoT
• 3DS-IC Activities
Tuesday, July 8, 2014
1:30pm-4:30pm
Moscone North, Hall E, Room 131
NARSC Report - October 2014
Subcomponent Supply Chain
Challenges for 10 nm and
Beyond
• Facilities & Gases Update
Wednesday, July 9, 2014
10:30am-12:30pm
Disruptive Compound
Semiconductor
Technologies
• Compound Semiconductor
Materials Update
Thursday, July 10, 2014
10:30am-12:50pm
SEMI Standards
Awards & Networking Event
Tuesday, July 8
SEMI International Standards
Excellence Award
─ inspired by Karel Urbanek
David Bouldin
(Fab Consulting)
Merit Award
Dan Chlus (IBM)
Mike Czerniak (Edwards)
Lance Rist (RistTex)
Leadership Award
Matt Fuller (Entegris)
Honor Award
Lori Nye (Brewer Science)
Corporate Device Member Award
Pinyen Lin (G450C)
Kwangwook Lee (G450C)
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA 3DS-IC
– Last meeting: July 8, 2014
– Approved Ballots
• Doc. 5447A, New Standard: Terminology for Through Glass Via and Blind Via
in Glass Geometrical Metrology
– New Activity
• New Auxiliary Information: Round Robin Study of Method for Measurement
of Voids in Bonded Wafer Pairs of Silicon Wafers (#5766)
– Supporting SEMI Draft Document 5270, Guide for Measuring Voids in Bonded Wafer Stacks
– Issued Ballots (C6-14)
• New Standard: Guide for Measuring Voids in Bonded Wafer Stacks [#5270]
• New Standard: Guide for Measuring Flatness and Shape of Low Stiffness Wafers
[#5506A]
• Revision to SEMI 3D4, Guide for Metrology for Measuring Thickness, Total
Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks
[#5616]
NARSC Report - October 2014
Overall TC/WG Updates
• NA Automated Test Equipment (ATE)
– Future Standards activities anticipated from SEMI CAST
(Collaborative Alliance for Semiconductor Test) Special Interest
Group, as early as Fall 2014.
– Activities will focus on next generation standard test data
format and test cell communication.
• NA Compound Semiconductor Materials
– Upcoming meetings
• Fall 2014 (TBA) – Teleconference and web meeting only
• May 2015 (CS MANTECH Conference in Scottsdale, Arizona)
– Issued Ballots (C2-14)
• New Standard: Specification for Polished Monocrystalline C-Plane Gallium
Nitride Wafers [#4979A]
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA Environmental Health and Safety (EHS)
– Last meeting: July 10, 2014
– Approved Documents
• Doc. 5591 (LI 2 & 4 only), S2 revisions related fire protection
• Doc. 5718 (LIs 1, 2 & 4 only), S10 revisions
• Doc. 4966, New Auxiliary Information: S2 Mapping into the EU
Machinery Directive (2006/42/EC)
– New Task Forces
• Energetic Material EHS TF
– Leaders: Steve Trammell (SEMATECH), Andy McIntyre (EORM)
• S7 TF
– Leader: Chris Evanston (Salus)
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA Environmental Health and Safety (EHS), cont’d
– New Activities
• New Standard: EHS Guideline for Use of Energetic Materials in
Semiconductor R&D and Manufacturing Processes (#5761)
• Line Item Revisions to SEMI S7, Safety Guideline for Evaluating
Personnel and Evaluating Company Qualifications (#5760)
– Issued Ballots (C5/C6-2014)
• S1 Line Item Revisions [#5623]
• S2 Line Item Revisions
– Delayed revisions related to chemical exposure [#4683D]
– Delayed revisions related to fire protection [#5591A]
• S7 Line Item Revisions [#5760]
• S10 Line Item Revisions [#5718A]
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA Facilities & Gases
– Last meeting: July 8, 2014
– Approved Documents
• Doc. 5712, F73 revision, Test Method for Scanning Electron
Microscopy (SEM) Evaluation of Wetted Surface Condition of Stainless
Steel Components
• Doc. 5445, F60 revision, Test Method for ESCA Evaluation of Surface
Composition of Wetted Surfaces of Passivated 316L Stainless Steel
Components
– Issued Ballots (C6-14)
• Revision of SEMI C3.12, Specification for Ammonia (NH3) in
Cylinders, 99.998% Quality [#5671A]
• Revision of SEMI C3.34, Specification for Disilane (Si2H6) in Cylinders,
97% Quality [#5673A]
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA HB-LED
– Last meeting: July 10, 2014
– New Task Force
• HB-LED Test Methods TF
– New Activities
• New Standard: Test Method for Measurement of Saw Marks on
Crystalline Sapphire Wafers Using Optical Probes (#5747)
• New Standard: Test Method for Measurement of Thickness and Shape of
Crystalline Sapphire Wafers Using Optical Probes (#5748)
• New Standard: Test Method for Measurement of Waviness of Crystalline
Sapphire Wafers Using Optical Probes (#5749)
– Issued Ballot (C6-14)
• Line item revisions to HB1, Specifications for Sapphire Wafers Intended
for Use for Manufacturing High Brightness-Light Emitting Diode Devices
[#5741]
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA Information & Control (I&C)
– Last meeting: July 9, 2014
– Approved Ballot
• Doc. 5507, Line Item Revisions to SEMI E132-0310E2, Specification
for Equipment Client Authentication and Authorization
– Line Item 1: E132 Session Termination Errors
– New Activities
• Revision to SEMI E132, Specification for Equipment Client Authentication
and Authorization. Adding EDA freeze versions to E132 (#5762)
• Reapproval for SEMI E30.5, Specification for Metrology Specific
Equipment Model (MSEM) (#5763)
• Reapprovals for SEMI E130, Specification for Prober Specific Equipment
Model for 300 mm Environment (PSEM300) and SEMI E130.1,
Specification for SECS-II Protocol for Prober Specific Equipment Model for
300 mm Environment (PSEM300) (#5764)
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA Information & Control (I&C), cont’d
– Revised SNARFs
• (#5618) New Standard: Preservation of Recipe Integrity
– Updates to rationale and scope
• (#5619) New Standard: Specification for SECS Equipment Data
Dictionary (SEDD)
– Changed from E30 revision + New Complementary File
• (#5620) New Standard: Specification for SECS-II Message Notation
(SMN)
– Changed from E5 revision + New Complementary File
– Revised TFOF
• Energy Saving Equipment Communication TF – updated charter
and scope for phase 2 of work
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA Information & Control (I&C), cont’d
– Issued Ballots (C6-14)
• Revision to Add a New Subordinate Standard Specification for
Sensor/Actuator Network Specific Device Model of a Generic Equipment
Add-On Sensor (ADDON) to SEMI E54, Sensor/Actuator Network Standard
[#5274C]
• Line Revisions to SEMI E90, Specification for Substrate Tracking; SEMI
E90.1, Specification for SECS-II Protocol Substrate Tracking; and SEMI E5,
SEMI Equipment Communications Standard 2 Message Content (SECS-II)
[#5508]
– Add Batch Object SEMI E90 & E90.1 and a New Material Format in SEMI E5
• New Standard: Specification for Preservation of Recipe Integrity (PRI)
[#5618]
• New Standard: Specification for SECS Equipment Data Dictionary (SEDD)
[#5619A]
• New Standard: Specification for SECS-II Message Notation (SMN)
[#5620A]
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA Liquid Chemicals
– Last meeting: July 8, 2014
– Approved Ballots
• Doc. 5708, Reapproval of SEMI C10, Guide for Determination of Method
Detection Limits
• Doc. 5709, Reapproval of SEMI C64, SEMI Statistical Guidelines for Ship to
Control
• Doc. 5710, Reapproval of SEMI F48, Test Method for Determining Trace Metals
in Polymer Materials
– Issued Ballots (C5/C6-2014)
• New Standard: Test Method for Determining the Quality of Ion Exchange Resin
Used in Polish Applications of Ultrapure Water System [#5621A]
• Revision to SEMI F39, Guideline for Chemical Blending Systems with title change to:
Guide for Chemical Blending Systems [#5528]
• Revision to SEMI C31, Specification for Methanol [#5641]
• New Standard: Test Method for Determining Roughness Of Polymer Surfaces Used
In Ultrapure Water and Liquid Chemical Distribution Systems By Contact
Profilometry [#5675A]
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA MEMS / NEMS
– Last meeting: July 7, 2014
– Leadership Changes
• Steve Martell (Sonoscan) was appointed cochair
– Withdrawn SNARF
• {#4820} Specification for MEMS Reliability Design, Materials
Selection, Process and Testing Method
– Approved transfer of the following Standards to the 3DSIC Committee (pending 3DS-IC approval)
• SEMI MS1: Guide to Specifying Wafer-Wafer Bonding Alignment
Targets
• SEMI MS5: Test Method for Wafer Bond Strength Measurements Using
Micro-Chevron Test Structures
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA Metrics
– Last meeting: July 9, 2014
– Leadership Changes
• Jackie Ferrell stepped down as Wait Time Waste TF co-leader
– Approved Ballots
• Doc. 5682, Revision to SEMI E168, Specification for Product Time
Measurement
• Doc., 5683, Revision to SEMI E168.1, Specification for Product Time
Measurement in GEM 300 Production Equipment
– New Activities
• Revision to Add a New Subordinate Standard: Specification for Product Time
Measurement for Material Control Systems to SEMI E168, Specification for Product
Time Measurement (#5750)
• Revision to Add a New Subordinate Standard: Specification for Product Time
Measurement for Transport Systems to SEMI E168, Specification for Product Time
Measurement (#5751)
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA Microlithography
– Last meeting: July 9, 2013
• Did not meet during SEMICON West 2014 meetings
– Next meeting TBD
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA PV Materials
– Last meeting: July 9, 2014
– Leadership and TF Changes
• “International PV Analytical Test Methods TF” was
renamed to “International PV Analytical Test Methods,
Metrology, and Inspection TF”
– New Leaders: Ron Sinton (Sinton Instruments), Chris Moore
(BayTech-Resor)
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA Physical Interfaces & Carriers (PIC)
– Last meeting: July 9, 2014
– Leadership Changes
• David Halbmaier stepped down as EUV Reticle Handling TF leader
• Shoji Komatsu was appointed Int’l 450 mm Shipping Box TF leader
– Yasuhiro Shimizu stepped down
– New Activity
• Revision to SEMI E83, Specification for PGV Mechanical Docking Flange
(#5759)
• Revision to SEMI AUX023, Overview Guide to SEMI Standards for 450
mm Wafers (#5758)
– Issued Ballot (C6-14)
• Line Item Revisions to SEMI E83, Specification for PGV Mechanical
Docking Flange [#5759]
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA Silicon Wafer
– Last meeting: July 8, 2014
– Leadership Changes
• Murray Bullis stepped down as Int’l Terminology TF leader
– Revised SNARF
• (#5403) Withdrawal of SEMI MF534-0707, Test Method for Bow of
Silicon Wafers {formerly Reapproval of MF534}
– Reviewed Ballots
• Doc. 5604, Line Item Revision to SEMI M1, Specification for Polished
Single Crystal Silicon Wafer and SEMI M20, Practice for Establishing a
Wafer Coordinate System
– Line Item 1: Revise both SEMI M1 and SEMI M20 to add a notchless category
of 450 mm diameter wafers
Adjudication to be completed at the next meeting. IP matter raised during
SEMICON West 2014 meeting.
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
•
NA Silicon Wafer, cont’d
–
Approved Ballots
•
•
•
•
•
•
•
•
•
•
•
Doc. 5664, Line Item Revision to SEMI M59, Terminology for Silicon Technology
Doc. 5687, Line Item Revision of SEMI M60, Test Method for Time Dependent Dielectric Breakdown
Characteristics of Amorphous SiO2 Films for Silicon Wafer Evaluation
Doc. 5607, Line Items Revision of SEMI MF673, Test Methods for Measuring Resistivity of Semiconductor
Wafers or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gauge
Doc. 5654, Line Item Revision to SEMI M49, Guide for Specifying Geometry Measurement Systems for
Silicon Wafers for the 130 nm to 16 nm Technology Generations
Doc. 4844C, New Standard: Guide for the Measurement of Trace Metal Contamination on Silicon Wafer
Surface by Inductively Coupled Plasma Mass Spectrometry
Doc. 5404, Withdrawal of SEMI MF657, Test Method for Measuring Warp and Total Thickness Variation
on Silicon Wafers by Noncontact Scanning
Doc. 5539, Revision to SEMI MF1390 with title change to: Test Method for Measuring Bow and Warp on
Silicon Wafers by Automated NonContact Scanning
Doc. 5662, Revision of SEMI M35, Guide for Developing Specifications for Silicon Wafer Surface Features
Detected by Automated Inspection
Doc. 5707, Revision of SEMI M40, with title change to: Guide for Measurement of Roughness of Planar
Surfaces on Polished Wafers
Doc. 5701, Line Item Revision of SEMI M1, Specifications for Polished Single Crystal Silicon Wafers
(Correct references to test methods for measurement of front surface chemistry)
Doc. 5666, Revision of SEMI MF928, Test Methods for Edge Contour of Circular Semiconductor Wafers and
Rigid Disk Substrates
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA Silicon Wafer, cont’d
– New Activities
• Line Item Revision to M62, Specifications For Silicon Epitaxial Wafers
(#5742)
• Line Item Revision to SEMI M1, Specification for Polished Single
Crystal Silicon Wafer (#5743)
– Remove classification 1.15 wafers
• Line Item Revision to SEMI M49, Guide for Specifying Geometry
Measurement Systems for Silicon Wafers for the 130 nm to 16 nm
Technology Generations (#5744)
– Clarify and better define exclusion windows
• New Standard: Guide for Wafer Dimensional Metrology Based on
Areal Image Acquisition Technology (#5745)
• Reapproval of SEMI ME1392, Guide for Angle Resolved Optical Scatter
Measurements on Specular or Diffuse Surfaces (#5746)
NARSC Report - October 2014
Overall TC/WG Updates
(from SEMICON West 2014 Meetings)
• NA Traceability
– Last meeting: July 10, 2014
– Approved Ballots
• Doc. 5613, Reapproval of SEMI T11, Specification for Marking of
Hard Surface Reticle Substrates
• Doc. 5689, Line Item Revision of SEMI T5, Specification for
Alphanumeric Marking of Round Compound Semiconductor Wafers
– Line Item 1: Update table 1 by adding Back Surface for 150 mm wafer
– New Activity
• Revision of SEMI T7, Specification for Back Surface Marking of
Double-Side Polished Wafers with a Two-Dimensional Matrix Code
Symbol (#5752)
– To be adjudicated at the next Japan Traceability TC Chapter meeting in
2014, pending GCS approval
NARSC Report - October 2014
Upcoming NA Meetings – 2014
Event Name
Event Type
NA Standards Fall 2014
Meetings
Standards Meetings
November 3-6, 2014
SEMI HQ in San Jose, California
NA Standards Spring 2015
Meetings
Standards Meetings
March 30 – April 2, 2015
SEMI HQ in San Jose, California
NA Standards Meetings at
SEMICON West 2015
Standards Meetings
July 13-16, 2015
San Francisco, California
Date/Venue
…2015
NARSC Report - October 2014
TENTATIVE
NA Standards Fall 2014 Meetings
November 2 – 6
• Most Standards meetings will be held
at SEMI Headquarters
(San Jose, CA)
–
–
–
–
–
–
–
–
–
–
3DS-IC
EHS
Facilities & Gases
HB-LED
Information & Control
Liquid Chemicals
MEMS / NEMS
Metrics
NARSC
PV Materials
NARSC Report - October 2014
• Intel (Santa Clara)
will host
– PIC
– Silicon Wafer
SEMI thanks Intel for
hosting these meetings.
NA Standards Fall 2014 Meetings
November 2 – 6
Sunday
2
Monday
Tuesday
3
4
Wednesday
5
Thursday
6
Friday
7
Saturday
8
3DS-IC
NARSC
EH&S
Schedule
at-a-glance
Facilities & Gases
HB-LED
Information & Control
Liquid Chemicals
MEMS/NEMS
Metrics
PV / PV Materials
Physical Interfaces & Carriers
Silicon Wafer
NARSC Report - October 2014
Regional Staff
Contact Information
Name
Paul Trio
E-mail
ptrio@semi.org
Phone
+1.408.943.7041
Office Address
NARSC Report - October 2014
3081 Zanker Road
San Jose, CA 95134
U.S.A.
Thank you!
NARSC Report - October 2014
Back-up
NARSC Report - October 2014
NA Standards Staff Changes
North America
Paul Trio
Headquarters
Michael Tran
Kevin Nguyen
3DS-IC
ATE
EHS
Information & Control
NARSC
Compounds
Facilities
FPD
Gases
HB-LED
Liquid Chemicals
MEMS / NEMS
Metrics
Microlithography
PIC
Traceability
Silicon Wafer
PV/PV Materials
NA Operations
Meetings & Events Planning
Standards Programs/STEPs/WS
CAST SIG
Test Vision
Member Outreach
Sales Development
NA Standards Membership
NA Standards Web
HQ Operations
Standards Ballots
Regs SC
A&R SC
Regional Support
NARSC Report - October 2014