Letting Process Drive Design The RocketMEMS® Model Alissa M. Fitzgerald | 6 October 2014 11th anniversary Overview • • • • • About us The „Long Tail‟ of the MEMS market Customer profile: System integrators What‟s wrong with MEMS development The RocketMEMS model Page 2 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 Company background • Founded 2003 by Alissa M. Fitzgerald, self-funded • Burlingame, CA: near SFO and Silicon Valley • Goal: to be the premier MEMS product development firm Headquarters in Burlingame, CA • Consistent growth – Over 125 clients served to date • Active member of the MEMS Industry Group Fab operations at 1500m2 UCBerkeley Marvell Nanolab Page 3 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 Full development services from concept to production AMFitzgerald in-house Strategic partners • Custom MEMS development from start to finish – Multi-disciplinary, expert engineering team • Design and process integration for volume production • In-house prototype fabrication, easy transition to production partners Page 4 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 A Tale of Two MEMS Markets Page 5 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 The Top 30 earn ~80% of industry revenue Page 6 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 The Long Tail concept of market distribution Harry Potter Book sales on Amazon MEMS Design [Source: C. Anderson, Wired, October 2004.] Page 7 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 The MEMS Industry has a Long Tail 500M- Units/ yr. 100M- Everybody else The Top 30 10M MEMS for consumer, automotive Applications [Source: C. Anderson, Wired, October 2004.] Page 8 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 Some applications in the MEMS Long Tail Units per year Diagnostic chips Low volume 1M Surgical tools High profit margin Cell phone towers Little price erosion Robots 100K Industrial printing Scientific instruments Factory monitoring Commercial aircraft 10K Energy exploration Server farms Military aircraft 1K Spacecraft Page 9 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 Long Tail company profile • A well-established system integrator or OEM – Has a mature product line – Deeply understands their market – Examples: Schlumberger, Medtronic • Sees MEMS as an opportunity to make new products and gain a competitive advantage – New sensing capabilities – Lower existing product cost to expand market • Sees market opportunity, needs < 2 years development to enter market at right time Page 10 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 Long Tail company profile - continued • No experience with MEMS chip design or integration – No confidence nor desire to hire a MEMS team or to develop MEMS capabilities (yet) • Views MEMS as a component in their system – Developing new patents not that important – IP is in package and system integration • Would prefer to buy finished MEMS chips to minimize overall product development risk • Does not understand why MEMS development takes so long and is so risky! Page 11 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 How to serve the Long Tail market • Serving the Long Tail requires selling many different items in small unit volumes • Amazon is the master of the Long Tail market – Super-efficient operations model • Current barriers in MEMS: – Long development times (usually 5+ years) – Hard to recover cost of custom development when unit volumes are so low Page 12 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 The challenge of MEMS development Lack of process rules Desire for patents Limited physical models Designer forces new process to foundry “One product, one process” Jean-Christophe Eloy, Yole Développment Page 13 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 Current MEMS fabless model → design-fab-test cycles Digital ASIC Fabless Model Reference designs, IP blocks Verified physics models New Design Foundryspecific design rules Process modeling Design simulation 18 months, 95+% yield Rule checking, Verification Product MEMS Fabless Model Reference designs, IP blocks Verified physics models Foundryspecific design rules New Design © AMFitzgerald Semicon Europa2014 2014 - Grenoble Design simulation 5+ years, ?% yield GOOD Page 14 Process modeling FAIR POOR Rule checking, Verification Product Process development consumes a lot of time Process Development Redesign Redesign Design Example MEMS Custom Development 3 months Process Development: Attempt 2 Process Development: Attempt 1 3 1 3 Redesign Process Development: Attempt 3 1 3 Attempt N 1 3 >~18 months Page 15 Semicon Europa 2014 - Grenoble First working samples: © AMFitzgerald 2014 It‟s a different story for the Top 30 MEMS companies • They own their fabs and have characterized their processes – Mature process libraries, design rules – Customized EDA tools, IP blocks (“cells”) Captive Fab MEMS Development Reference designs, IP blocks New Design Verified physics models Foundryspecific design rules Process modeling Design simulation 2+ years, >75% yield GOOD FAIR Product POOR Page 16 Semicon Europa 2014 - Grenoble Rule checking, Verification © AMFitzgerald 2014 Letting process drive MEMS design *But customization is desired! Process and design rules No need for novelty* Tuned, verified models Foundry process library sets boundaries for designs One process library, many products…rapidly Page 17 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 Why can‟t MEMS copy the CMOS fabless model? CMOS MEMS • Process flow fixes Z axis • 2D design of circuits → many chip types • Needs 3D design freedom • Process flow fixes Z axis → few sensor types • Many ASIC designers • Few MEMS designers • CMOS foundry strongly motivated to create standard process flows • TSMC, GF, etc. • MEMS foundry has little motivation to create standard process flows • Contract mfg. model Page 18 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 What about MEMS “Platforms”? • Mature process flows opened to public • Customer must provide the chip design – Most Long Tail companies cannot provide a design! Source: CMP Some MEMS platforms: Facility Service Name Target Market Process Wafer size ST Thelma Motion sensors Thick epi-poly 200 Dalsa MIDIS Motion sensors SOI with vacuum and pressure cavity 200 X-FAB XMB-10 Motion sensors Cavity SOI 150, 200 NF Shuttle Motion sensors CMOS cap, SOI wafer 200 InvenSense Page 19 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 Platforms are not effective without MEMS Designers • There are very few of us! – MEMS is introduced very late in engineering education – Graduate-level only, usually Ph.D. • Lack of full-featured design tools means experts must do design Long Tail Companies MEMS Designers MEMS Foundries Page 20 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 RocketMEMS: A Model for Designer-Foundry Cooperation • Designer and foundry define design/process together • Use stable, characterized process modules – Silex SmartBlocksTM library • Collaboratively assemble process flow from modules • Create reference designs relevant to market needs – Many, but not all, sensor needs may be met • Ownership: – Designer owns reference designs – Foundry owns process library – Customer gets silicon – fast! Page 21 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 RocketMEMS® vs. Custom Development Process Development Redesign Redesign Design Example MEMS Custom Development Process Development: Attempt 2 Process Development: Attempt 1 3 months 3 1 3 Redesign Process Development: Attempt 3 1 3 Attempt N 1 First working samples: 3 >~18 months RocketMEMS: Skips Process Development Start with reference designs and process Tailor Design RocketMEMS Development 1-2 mo. Fabrication 3 Prototyping 3Low Volume Production First working samples: 4-5 months Pilot Production Page 22 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 First RocketMEMS sensor type: Pressure What can be customized? • Pressure range • Sensitivity • Die size & thickness • Bond pad location & size • Bridge resistance • Full vs. Half bridge Examples of various RocketMEMS pressure sensors (with test structures) Varying membrane sizes Page 23 Semicon Europa 2014 - Grenoble Varying resistor sizes Varying die sizes © AMFitzgerald 2014 Economical production that scales • Multi-Project Wafer (MPW) format for cost saving – Multiple customers served by AMFitzgerald • Production options at different volumes – Prototype 500+ die – Low volume production 10,000+ die – High volume dedicated runs at Silex 100,000+ die Multi-Project Wafer: Many different chip designs are processed on the same wafer Page 24 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 RocketMEMS: Our philosophy “Design for Verified Process” • No process development • Use proven reference designs and tailor them to customer specification One Product, • Our long-term vision for RocketMEMS: One Process – A menu of sensor types and foundries to suit a wide range of customer needs Page 25 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014 Summary • Two MEMS industries: the Head and the Long Tail – Good business opportunities exist in the Long Tail – if one can serve it efficiently • New models are needed to speed up MEMS development and serve the Long Tail – RocketMEMS is a new model – evolved from the ASIC design house model • The RocketMEMS model can benefit the entire industry – Helps to grow the MEMS Fabless model and ecosystem – Connect OEMs/System Integrators to rapid MEMS solutions – IoT, etc. Page 26 Semicon Europa 2014 - Grenoble © AMFitzgerald 2014