DMS Design

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3CEMS DMS R&D Service
Introduction
DMS RD Dept.
Updated Date: May, 2012
Confidential
Overview
 DMS Team has over 10 years of experience in
Industrial PC Field.
 We provide industrial grade products and solutions to meet
the different extreme and tough environmental conditions.
 We specialize in fanless
and wide temperature
solutions.
Our heat dissipation
structure has U.S. patent.
(Patent No. US7,468,555 B2)
It makes our products
100% Fanless.
2
EMS+DMS
Client Input
Client Input
DMS
Design & Verification
NPI
EMS
Build, QC & Deliver
EMS
Build, QC & Deliver
3
Supportable DMS Project Type
4
DMS R&D Design
Introduction
5
Top-grade
Products Design
Others
Material
Requirements
Wide
Temperature
Design
System
Test
Layout
System
Design
Requirements
Signal
P.C.B
Measure
Requirements
6
Design Overview
• Components selection
• Layout
• PCBA Conformal Coating
– Silicone for Anti-vibration, Wide Temp in Vehicle Computer
• Wide Temperature Design
• Wide Voltage Design (9-32V)
• Water /Dust/ Salt Fog
Resistance(Environmental)
– Passed MIL-STD-810G Tests
• Sunlight Readable Solution
• Fanless / Cableless Embedded System Design
• Anti-shock & Vibration Embedded System
Design
7
Material Requirements
Quality Improvment
 Wide temperature components selection (-30~+70)
Passive parts
Active parts
Peripheral
Others
Resistor
Easy
Diode
Easy
Memory
Selection
Cable
Easy
Inductor
Easy
Transistor
Easy
Flash
Selection
Connector
Selection
Capacitor
POSCAP/TAN
MOSFET
Easy
HDD/SSD
Selection
Switch
Selection
CPU & ASIC
Selection
PANEL
Selection
 Ensures all of the components can work in a wide-temp
environment
Design phase
8
Wide Temperature Design
Quality Improvment
 Wide Temperature Design
 High efficient PWM design
 Sensitive PLL circuit design
 Hi-speed circuit design
 Balance performance and power consumption
Design phase
Talented Engineer
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P.C.B Requirement
Quality Improvment
 Checks all of the impedance to fit requirements
Make PCB phase
Slice PCB
10
Thermal Design
Truly FANLESS, Patent for Thermal Design
Material Technology
Nano Paint:
Water proof & Anti-heat
Ceramics Paint
Anti-vibration & Drop
Design
Anti-Vibration, Removable HDD Design
Anti-Vibration, Anti-Shock System Design


Fanless(Wide Temp.)
Anti-Vibration(Rugged/IP)
MIL-SDT-810F C3 Pass
(Operational Vibration)
Crash & Shock
14
Vibration – Vehicles
MPC 900
Embedded computer
15
Vibration – Wheeled
Trailer / Truck
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Vibration – Wheeled
Trailer / Truck
17
Industrial Grade Product
Design for Mission Critical
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Dust & Water
Resistance
19
Sunlight Readable
 Core Technology (Increase Contrast Ratio)
 Increase LCD Brightness
 Normally, the utilization rate
from light bar to surface is only 5%
 Increase light bar brightness
 Change materials
Decease the sunlight reflection
 Add Anti-Reflection and
¼ lambda Films
 Change materials
20
Signal Measure
Quality Improvment
 Critical signal’s eye pattern check
During system design
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Verification Requirement
Burning & Memory Test
Memory Test
Burning Test
22
Verification Requirement
Power Cycle Test
Power Cycle
23
R&D Design Verification
Testing Facility
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Compelete RD Testing Equipments
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IR
Thermal Image Scan
 IR camera: FLIR
Thermal CAM SC2000
 Hot spots identified as
the monitor points in
system thermal test
 Hot spots are all under
the components
thermal specs
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Climatic Stressing
 To simulate the worst environmental conditions
with regard to temperature, humidity, etc.
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Safety pre-test
 Dielectric Withstand/Insulation
Resistance Test (Hi-Pot test)
 Ground Bond Tester
 limited power sources test
 Touch current test
 Steady force test
 Reflection test
 Enclosure opening test
 Accessibility test
 Impact test
 Stability test
3CEMS Confidential
28
Transprotation
Simulation
 To simulate transportation impact to provide system /device
within good condition during shipping
 Vibration
 Shock impact
 Handling impact
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Manufacturing Capabilities
 Advanced Process Technology
 Surface Mounting Technology Process
Large Scale SMT Capacity
Double Side Component Capability
VAD & RAD Capabilities High Speed & Efficient
Machine
Multiple & Flexible M/C Combination
 Circuit Board Fabrication
 Material Bar-Coding System
 Automated & Manual Insertion
 Automated Conformal Coating
 Clean & Lead-Free (RoHS) Process
 Specific Testing Service tailored for customers
 Full System Assembly
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Manufacturing Capabilities
World-Class Production Facilities
Latest Manufacturing
Techniques
+
State-of-the-Art
Test Equipment
=
Top-Grade Products
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DMS Design Capability – ID & ME
Embedded Computer / Controller
Mobile DVR
Digital
Signage
Rugged Fanless Embedded
Computer
Rugged Fanless I/O
Controller
Design Capability for Rugged,
Fanless, Cable less, Industrial
Embedded I/O Controller &
Computers.
DMS Design Capability – ID & ME
Panel PC / POS / IPC Monitor
Design capability for Rugged,
Industrial Panel PC, POS
System & IPC Monitor
Panel PC Product
12” - 15”
8” - 10”
Robust Panel PC/POS, Monitor, ARM HCI Mobile handheld for
Mission Critical in Military, Medical, Outdoors.
Panel PC Product
Panel Size : 17”
Maritime Panel PC
For Offshore, Cruise, Oil drill
platform applications.
Use for Sea Map, Navigation
Monitors or Bridge Controller
display
Applications: River Cruise
35
Sunlight Readable
Smart Panel Module
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DMS Design – ID Design
External HDD Enclosure
External HDD Enclosure
Multimedia Door Phone
Door Phone
DMS Design Capability – ID & ME
Panel PC/POS/IPC Monitor
Strong R&D experiences to fulfill customize needs
On-going Project – 12” Panel PC
(ODM)
Delicate experienced R&D center locate in Taiwan
System Design Capability:
SAVE Manpower resources
= SAVE COST
One Stop Service
Changeable
Decoration
Front Bezel
• Design Quality Assurance
• Fast and quick response
• Testing Labs, Verifications
• Tooling Molding benefits
• Local supply chain links
• One stop manufacturing
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DMS Design – ID & ME Design
Medical Equipment
Direct phone in emergency
With fingerprint module, control board, batteries, motor and
mechanical linkage structure
DMS Design – ID & ME Design
Thermostat / LED Bulb
Thermostat
Battery
charger
LED bulb with heat
spreading cooler
Expansion card
module
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