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  1. Engineering & Technology
  2. Electrical Engineering
  3. Microelectronics
(SOLES) Optical Applications
(SOLES) Optical Applications
(SOI) Wafer
(SOI) Wafer
(PQFN) Packages
(PQFN) Packages
(PCILynx -2) IEEE 1394 Link Layer Controller
(PCILynx -2) IEEE 1394 Link Layer Controller
(Part 1) (ppt) [updated]
(Part 1) (ppt) [updated]
(NOTE that the disassembler output below omit the binary
(NOTE that the disassembler output below omit the binary
(Norton) Amplifiers
(Norton) Amplifiers
(MOSFET).
(MOSFET).
(MEMS): fabrication, design and applications
(MEMS): fabrication, design and applications
(LNCSP) Packages in Pb-Free Processes
(LNCSP) Packages in Pb-Free Processes
(IC) Decamouflaging - New York University
(IC) Decamouflaging - New York University
(GUI) for the MC3PHAC
(GUI) for the MC3PHAC
(DVI) Compliance Testing
(DVI) Compliance Testing
(a) (b) (c) (d) Monolithic 3D Chip: 3D circuits often are made by
(a) (b) (c) (d) Monolithic 3D Chip: 3D circuits often are made by
(a'b'c).
(a'b'c).
(790 kB PowerPoint)
(790 kB PowerPoint)
(5.7 MB PowerPoint)
(5.7 MB PowerPoint)
(32K x 8) Static RAM
(32K x 8) Static RAM
(3.5 MB PowerPoint)
(3.5 MB PowerPoint)
(2004) - iLabs: A Scalable Architecture for Sharing Online Laboratories
(2004) - iLabs: A Scalable Architecture for Sharing Online Laboratories
(1M x 32-Bit), 16 Mbit - Cypress Semiconductor
(1M x 32-Bit), 16 Mbit - Cypress Semiconductor
(12.1 MB PowerPoint)
(12.1 MB PowerPoint)
(10) COMPUTER MEMORY
(10) COMPUTER MEMORY
(1.50 MB PowerPoint)
(1.50 MB PowerPoint)