Course No. 04813190
MEMS DEVICES AND DESIGN , Spring 2004
Lecture1:
Introduction to MEMS
Haixia Zhang
Institute of Microelectronics, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Overview
What is MEMS and why MEMS?
z The History of MEMS
z MEMS Design Items
z The future of MEMS
z Summary
z Homework1
z
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS Meaning
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
General MEMS Design
Micro-Electro-Mechanical Systems (MEMS) is the
integration of mechanical elements, sensors,
actuators, and electronics on a common substrate
through the utilization of microfabrication
technology or “microtechnology”.
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS : Mechanical-Electronics-Material-Synthesis
Electronics
Mechanics
Fabrication & Integration
(Function & Domains)
IC Planar
3D
CMOS-MEMS
Mechanical
Electrostatic
Magnetic
Thermal
Fluidic
Optical
Materials
Structures & Performance
Synthesis
Design & Test & Control
Properties
Energy Transfer
Devices
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
General MEMS Advantages
z
Batch fabrication
– Reduced cost
z
Reduced size
– Is everything better smaller?
Reduced power
z High precision
z New capabilities?
z Improved performance?
z
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
General MEMS Challenges
•The high tooling costs.
A state-of-the-art silicon foundry cost the better part of $1B.
•The complexity of MEMS design.
Typical MEMS devices, even simple ones, manipulate energy
(information) in several energy domains. The designer must
understand, and find ways to control, complex interactions
between these domains.
•Parallel processing
does not lend it self to step-by step optimization of a design.
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
The History of MEMS
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
1950’s
1950’s Silicon Anisotropic Etchants (KOH) in Bell Lab
1959 “There’s Plenty of Room at the Bottom” – Richard
Feynman gives a milestone presentation at California
Institute of Technology.
Issues a public challenge by offering $1000 to the first
person to create an electrical motor smaller than 1/64th of
an inch.
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
1960’s
1961 First silicon pressure sensor (Kulite)
1965 Invention of surface micromachining. (Nathanson)
Westinghouse creates the Resonant Gate FET, (RGT).
1967 Anisotropic deep silicon etching (H.A. Waggener)
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
1970’s
1970 First silicon accelerometer demonstrated (Kulite)
1977 Silicon electrostatic accelerometer (Stanford)
First capacitive pressure sensor (Stanford)
1979 First micro-machined inkjet nozzle
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
1980’s
Early 1980’s, Berkeley and Wisconsin demonstrate polysilicon
structural layers and oxide sacrifical layers,…. rebirth of
surface micromachining. Late 1980’s micromachining
leverages microelectronics industry and widespread
experimentation and documentation increases public interest.
1982 Disposable blood pressure transducer
1982 “Silicon as a Mechanical Material” (K. Peterson, IBM)
. Instrumental paper for material properties and etching data
for silicon.
1982 LIGA Process
1983 Integrated pressure sensor (Honeywell)
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
1987
1986 Silicon wafer bonding (M. Shimbo)
1987 “Microfabricated structures for the measurement of
mechanical properties and adhesion of thin films,” (MIT,
S. D. Senturia), in Proc.Transducers’87, Tokyo, Japan,
June The Beginning of MEMS CAD
1987 Berkeley and Bell Labs demonstrate poly-silicon
surface micro-mechanism;
1987 MEMS becomes the name in U.S.
1987 Analog Devices begins accelerometer project
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
1988
1988 First MEMS Conference, ?IEEE MEMS
1988 Batch fabricated pressure sensors via wafer bonding
(Nova Sensor)
1988 Rotary electrostatic side drive motors (Berkeley)
1989 Lateral comb drive (Tang, Nguyen, Howe, Berkeley)
The motors stimulating major interest in Europe, Japan,
and U.S
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
1990’s
MEMS rapid extending to the whole world, Research on
Fabrication techniques, Design technology , CAD tools
and Devices are developing quickly.
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
1992
CAD Tools:
MIT, S. D. Senturia, MEMCAD1.0
Michigan, Selden Crary, CAEMEMS1.0
Techiniques:
Bulk micromachining (SCREAM process, Cornell)
MCNC starts the Multi User MEMS Process (MUMPS)
Devices:
Grating light modulator invented at Stanford University
(Solgaard, Sandejas, Bloom)
First micromachined hinge
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Sandia Ultra-Planar Multi-Level Technology (SUMMiT).
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Mid. 1990’s
Devices
1993 First surface micromachined accelerometer sold (ADXL50)
1993 Digital mirror display (Texas Instruments)
1994 Commercial surface micromachined accelerometer (AD)
1995 BioMEMS rapidly develop
Techniques
1994 Deep Reactive Ion Etching is patented
MEMS Design
1995 MEMCAD2.0
1996 Microcosm Inc. for MEMCAD
1995 Intellisense Inc. for IntelliSuite
1995 ISE for SOLIDIS and ICMAT
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Later 1990’s
Devices
Bio-MEMS:
Microfluidics starts with capiullary electrophoresis
circa,1990
µ-TAS (Micro-total-analysis System) vision for diagnosis,
sensing and synthesis
Optical MEMS booming and bust from 1998-2002 (Lucent)
Commercializating of inertial sensors (AD, Motorola) 10e8 by
each company by 2002
RF MEMS from 2000
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
200 µm
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Research of Caltech Micromachining Lab
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Techniques
Foundries:
US (MUMPs, Sandia, ……)
Euro (Germany, France, Belgium, Holland, Switzerland …..)
Asia (Japan, Korea, China,……)
Integration MEMS-CMOS
Packing Technology
Testing Technology
NEMS
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Cu Trace
500µm
650µm
Alumina
Core
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
3D filter of SU8
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
iMEMS (Integrated Microelectromechanical
Systems) patented by Sandia National Laboratories,
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Electrode pattern made on a 1mm diameter Si ball, Esashi,2001
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Nano-heater probe array (32×32)
(D.W.Lee et.al., J. of Microelectromechanical Systems, 11, 3 (2002), 215-219)
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS Design
1996 H. A. C. Tilmans, “Equivalent circuit representation
of electromechanical transducers”
1996-1998 System level design, NODAS(Fedder
,Carbegie Mellon), SUGAR (Pister, Berkeley)
1998 S. D. Senturia, “CAD challenges for
microsensors, microactuators, and microsystems,”
Proc. IEEE, vol. 86.
1999 CARAMEL, Carnegie Mellon; CAT, TIMA, France
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
2000-: Commercial MEMS CAD Tools
ConventorWare, U.S
History:
1996, MicroCosm, MIT, MEMCAD2.0
2001, Conventor
2003, Conventor merge Intellisuite, only 1
month
Http://www.conventor.com
国内代理：IMAG
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Intellisuite
History:
1991, Intellisense Cor. , MIT
2000, merges with Corning Inc.,
2002, Renamed, Corning Intellisense,
2004, Intellisense Software)
http://www.intellisuite.net
http://www.intellisensesoftware.com
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMSCAP, http://www.memscap.com
ANSYS, http://www.ansys.com
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS China
1989-1995
我国的MEMS研究始于1989年，清华大学、复旦大学、上
海冶金所、中科院电子所、重庆大学、东南大学，微马达
、压力传感器、加速度计、微陀螺、真空微电子等。
特点：器件托工艺
1995-1998
北京大学(Silicon)+上海交大(LIGA)，重点实验室建设
更多的器件设计和工艺开发
特点：开始从研究分散到系统工艺研究
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Peking University
Shanghai Jiaotong University
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
1999— MEMS进入发展时期：863/973/…..
2003,我国MEMS的研发单位主要集中在华北、华东和东北三
个地区，还有西南地区的重庆和西北地区的西安等。初步統計
，不同层次的研发单位共有70多个。
高校60%
university 60%
中科院16.6%
Chinese Academy of
Sciences 16.6%
信息产业部11.7%
Department of
information industry
11.7%
其它11.7%
others 11.7%
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS Research in PeKing University
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
创建于 1995年
z 学术带头人: 郝一龙教授，张大成教授
z 硅基MEMS加工与设计技术
z 600m2 超净间
z
z
主要设备
z STS:
ICP ASE, AOE, Low stress PECVD
z Karl Suss: SB6, MA6
z LPCVD
z RIE
z Ion Implanting Machine
z Sputter
z…
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
国家863计划
z 国家973计划
z
重点实验室建设
z 自然科学基金
z
国防预研项目
z 教育部项目
z 北京市科委研究项目
z
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
1.
基础研究
z
z
关键加工工艺
设计方法
2.
应用技术研究
z
z
z
z
z
标准工艺研究
核心器件研究
封装技术研究
测试技术研究
设计工具研究
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
标准加工工艺研究
体硅标准工艺一：静电键合和深刻蚀释放
z 体硅标准工艺二：静电键合和自停止腐蚀
z 压阻薄膜工艺
z 双面 KOH 腐蚀释放结构
z
z
表面牺牲层释放
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
体硅标准工艺一：静电键合和深刻蚀释放
Zhang Dacheng, 2000
a.Shallow trench etching
d.Silicon/Glass anodic bonding
Si
e.Silicon wafer thinning
b.Surface doping
c.Lift-off to form electrodes
f.Deep trench etching to
release structure
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
体硅标准工艺二：静电键合和自停止腐蚀
Zhang Dacheng, 2000
a.Shallow trench etching
b.Heavy boron
doping
c.deep trench etching,
prerelease structure
d.lift-off to form
electrodes on glass
e.Si/Glass anodic
bonding
f. KOH self stop etching,
release structure
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
薄膜压阻工艺
Zhang Dacheng, 2002
a.Ion implanting to
form piezoresistor
b.Ion implanting to form
ohm contact
c.Back side KOH etching to
form membrane
d. Metallization
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
双面 KOH 腐蚀释放结构
Zhang Dacheng, 2001
d. KOH etching beam area
a.Surface diffusion
b.shallow trench etching
c.Depositing SiO2/Si3N4 as
KOH etching mask
e. KOH etching structure
f. Si/Glass anodic bonding
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
表面牺牲层释放
Hao Yilong, 2000
a. Depositing and etching
Polysi to form bottom
electrodes
d. LPCVD deposition
b.Depositing PSG, bump etching
e.Etching polysi, define structure
c.Anchor etching
f. Sacrificial layer etching to
release strucure
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
50nm
< 5％
Zhang Dacheng, 2002
Zhang Dacheng, 2001
Zhang Dacheng, 2001
Hao Yilong, 2000
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Etching, Yan Guizhen, 2002
V
oi
d
Trench profile
with standard
DRIE parameters
无电镀Cu Li Yi, 2003
ƒ Large
stress
ƒ low
structure
strength
Isolation trenches
with void after
refilling
Isolation Trench Fabrication, Yan Guizhen, 2003
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
核心器件研究
惯性器件
z 光学器件
z 生物MEMS器件
z RF MEMS器件
z
z
化学传感器
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Accelerometer, Li Zhihong, 1998
Optical Switch, Zhang Peiyu, 2000
Relay, Li Zhihong, 1999
3D accelerometer, Li Gang , 2000
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
RF Switch, Zhang Jinwen, 2003
Zhang Dacheng, 2001
Gas Sensor, Xu Jiajia , 2002
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Bio Chip, Yu XiaoMei, 2003
Gyro, Yan Guizhen, 2003
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Accelerometer, Shi Jinjie, 2003
Accelerometer, Dong Haifeng, 2003
Optical Switch, Wu Wengang, 2003
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
IMEE1.0系统
（2003，Zhang Haixia）
„
实现了与版图设计工具PDT 、工艺文件编辑与
模拟、材料库DM、工艺模拟库DP等模块的集
成，可以试用。
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
ICP Simulation
（2003，Zhou Rongchun）
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS Devices
z
z
Sensors: measure pressure, strain, acceleration,
angular-rate-of-change, temperature, fluid flow, fluid
viscosity, and more.
Actuator systems, control power switches and relays;
RF- and microwave controlled devices; fluidic valves
and pumps; mirrors; fiber aligners and controllable
filters; and inductors and capacitors. Designers are
also tackling integrated systems of multiple MEMS
units, such as radar applications.
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS Examples
pressure sensors
accelerometers
flow sensors
inkjet printers
deformable mirror devices
gas sensors
micromotors
microgears
lab-on-a-chip systems
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS Examples
Micromachined Tips for FEDs and AFMs
Source: Micron (?)
Source: IBM
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS Examples
Neural Probes
Source: Mich (K. Wise)
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS Examples
Neural Interface Chip
Source: Stanford
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS Examples
Micro-Grippers
Source: AND
Berkeley
MEMS DEVICES
DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS Examples
Micro-Tweezers
Source:
MEMS Precision Instruments
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS Examples
Accelerometers
Sources: Analog MEMS
Devices,
LucasAND
NovaSensor,
and2004,
EG&G
IC Sensors
DEVICES
DESIGN , Spring
Lecture1,
Haixia Zhang, PKU
MEMS Examples
Optical MEMS (MOEMS)
Source: IMC (Sweden), Maluf and TI
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS - evolved from the Microelectronics
Revolution
IC Industry Timeline
1947
single transistor
1958
first IC
1999
10 million transistors
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS Timeline
1980
1999
Bulk micromachined
pressure sensor
2030
TI DMD
(1.3 million micro-mirrors)
?
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
The Opportunity of MEMS Technology
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
The Design of MEMS
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS Design and Modeling
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
The Future
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
DPN(dip pen nanolithography)
Univ. of Illinois of Urbana Champaign,Urbana,IL,USA
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
Summary
MEMS Define
History of MEMS
MEMS Design Items
The future technology
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU
HomeWork
Relative Reading:
1. “There’s Plenty of Room at the Bottom” (R. Feynman)
2. S. D. Senturia, “CAD challenges for microsensors,
microactuators, and microsystems,” Proc. IEEE, vol.
86, pp. 1611–1626, Aug 1998.
MEMS DEVICES AND DESIGN , Spring 2004, Lecture1, Haixia Zhang, PKU