The LOC project status and SMU's plan in ASICs - Indico

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The LOC project status and SMU’s plan in ASICs Jingbo Ye for the LOC project at SMU The project is actually lead by Datao Gong For details on recent LOC results please see this talk at TWEPP: hIps://indico.cern.ch/contribuLonDisplay.py?sessionId=17&contribId=164&confId=228972 There are two developments: §  The dual channel serializer: ü  LOCs2: 2×8 Gb/s 16:1 serializer, prototype, tested to design goals. o  LOCx2: 2×5.12 Gb/s 8:1 serializer for ATLAS LAr phase-­‐1, low latency, low power, with framing, CRC, and scrambling. In design. Will be QFN-­‐88 packaged. Transmits any 12-­‐bit serial output ADC data. §  The VCSEL drivers: ü  LOCld1: 8 Gb/s VCSEL driver with I2C, QFN-­‐24, tested to design goals. This is a generic VCSEL driver with SLVS inputs. With VCSEL at 8 Gbps < 200 mW. • ? LOCld4: 4-­‐ch open-­‐drain array VCSEL driver. Tested but with problems. o  LOCld2: 2-­‐ch TOSA VCSEL driver for MTx. Submission: Dec. 2013. o  LOCld8: 8-­‐ch array VCSEL driver, try to fix problems idenLfied with LOCld4. submission Dec. 2013. Future plans: §  serializer: • 
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Follow the SOS technology (PC process, 180 nm) to move to 10 Gb/s per channel. Join CERN for 65 nm development. §  VCSEL drivers: • 
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Probe the speed of open-­‐drain array VCSEL driver with the current GC process. LOCld12: 12-­‐ch array VCSEL driver to complete the LOCld4,8, and 12 series. Join CERN for 65 nm development. Backup slides LOCs2 design features Serializing unit
4
2:1 Mux
8
4:2 Mux
8:4 Mux
16
16:8 Mux
LVDS Rec
16
Data
2
SerialData
@ 8Gbps
CML Driver
Clock Dividers
LC
VCO
LPF
Dn
Charge
pump
PFD
Up
Div2
Div2
Div2
LVDS Rec
500 MHz
Clock
PLL
Serializing unit
Clock Dividers
2
2:1 Mux
4
4:2 Mux
8
8:4 Mux
16
16:8 Mux
16
LVDS Rec
Data
CML Driver
SerialData
@ 8Gbps
•  Two (2) channel 16:1 serializer sharing one LCPLL; Each channel operates at 8 Gbps. •  LVDS 16-­‐bit × 2 data and 500 MHz clock inputs. •  Input data can be latched with either edges of the internal clock. •  Output CML signal > 200 mV over a 100 ohm differenLal load. •  LC-­‐tank PLL with loop bandwidth programmable from 1.3 to 6.8 MHz. •  Power consumpLon 1.2 WaI. 5 Wire-­‐bonded LOCs2 LOCs2 test setup •  The LOCs2 die is wire-­‐bonded to a PCB. A QFN packaged version will be tested soon. •  Input PRBS 27-­‐1 data from the LOCs2 tested together with LOCld1 Kintex-­‐7 board; Output serialized data to high-­‐speed oscilloscope for jiIer and eye measurement. 6 LOCs2 eye diagrams 100 mV/div. 8 Gbps 8.48 Gbps •  LOCs2 works from 6.6 to 8.5 Gbps, limited by the LCPLL tuning range . •  Measured power consumpLon is 1.25 waI at 8 Gbps, matching simulaLon. 7 LOCs2 bathtub curve •  The bathtub curve of LOCs2 at 8 Gbps. •  At 10-­‐12 the eye has an opening of about 60 ps. 8 LOCs2 jiIer performance 30 1 28 1.1 0.95 27 1 0.9 Random ji+er (ps) Total ji+er (ps) 26 25 24 23 Channel A 22 Channel B 21 Random ji+er (ps) 1.2 29 0.9 0.8 Channel A 0.7 Channel B 0.6 7 7.5 8 Data rate (Gbps) 8.5 9 0.8 0.75 0.7 0.65 0.5 20 0.85 7 7.5 8 8.5 Data rate (Gbps) 9 0.6 400 Icp =40 uA, loop bd = 2MHz Icp = 80uA, loop bd = 2.2 MHz 450 500 550 Reference clock (MHz) •  Measure jiIer with a 50 Gs/s real Lme oscilloscope. •  Measure the total jiIer (pk-­‐pk) of the serial output bit stream to be about 30 ps with the input PRBS 27-­‐1 parallel data. RJ about 1 ps. •  Measure the PLL jiIer through a clock signal divided-­‐by-­‐8 from the VCO clock; Only random jiIer is significant in this case and it is measured to be below 1 ps. 9 LOCld1 design VDD
V33
Vctrl
M5
Vcom
R1
M6
M3
R4
R3
M4
Vout_p
Vout_n
R2
Vin_p
M1
M2
M7
M8
Vin_n
Pre-drive 2
Pre-drive 1
V25
I2C bus
Iref
Iref
Voltage
DAC Vctrl
I2C
Iref
Main drive
Ibias
Iref
Ibias_ref
Iref
Current
DAC Ibias_ref
Pre-drive 6
LOCld1
•  8-­‐Gbps single channel VCSEL driver with acLve shunt peaking. •  I2C slave and DAC module (thanks to Sandro Bonacini and Paulo Moreira) for remote configuraLon. •  Programmable: VCSEL bias and modulaLon currents; peaking strength. •  VCSEL bias and modulaLon currents refer to a constant current source, not sensiLve to transistor threshold voltage change caused by radiaLon. 10 LOCld1 lab test LOCld1 test board I2C master •  LOCld1 is wire-­‐bonded to a PCB for this test. A QFN-­‐24 packaged version will be tested soon. •  Input 200 mV PRBS signal from signal generator and from LOCs2. •  Output signal to oscilloscope through SMA connectors for electrical test, to a VCSEL for opLcal signal test. •  VCSEL modulaLon current programmable (4 bits) up to 7.6 mA. VCSEL bias current programmable (4 bits) up to 8 mA. 11 LOCld1 eye-­‐diagrams RJ = 0.89 ps DJ = 11.7 ps TJ = 21.8 ps 5 Gbps 9 Gbps RJ = 0.9 ps DJ = 15.5 ps TJ = 26.0 ps 8 Gbps 10 Gbps 12 LOCld1 irradiaLon tests LOCld1 test board Test system LOCld1 test board in X-­‐ray chamber LOCld1 has been verified to meet ATLAS LAr front-­‐end electronics TID requirement. LOCld1 has also been tested in a neutron beam of 800 MeV. No bit error is found in the data transmission, and in its I2C configuraLon circuit. 13 LOCld4 design innerVCSEL
Peaking
Vctrl
Vin_p
Vin_p
Vin_p
Vin_n
Vin_p
Vin_n
Vin_n
Vin_n
Five amplifier stages
Five amplifier stages
Five amplifier stages
Five amplifier stages
out
in
Tail current
reference
LOCld4
Biasing
Biasing
current
Biasing
Output stage
current
Biasing
Output stage
current
Output stage
current
Output stage
Bias
V control
•  4-­‐channel 8 Gbps VCSEL array driver, taken advantage of one submission with spare design area in one corner. •  Design: acLve shunt peaking + open-­‐drain last stage •  Design VCSEL modulaLon current 6 mA 14 LOCld4 lab test preliminary • 
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Input: Diff 200mV (peak-­‐peak) at 5Gbps Output: Bias-­‐Tee PE1606 (100k ~ 12.4GHz) pulling up to 3.3V 5 Gbps eye-­‐diagram looks good, but amplitude is only 200 mV Problem idenLfied, next design to be submiIed in Dec. 2013 15 LOCx2 dedicated to ATLAS LAr • 
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LOCx2 is a 2-­‐channel full funcLonal 5.12 Gbps transmiIer for ATLAS LAr trigger upgrade in phase I. LOCx2 interfaces to 8 channel 12 or 16 bits ADC serial outputs with the full digital block LOCic. LOCic and the new LCPLL will be submiIed December 2013. LOCx2 is planned to be packaged in QFN-­‐88 (10 mm × 10 mm). 16 LOCic design • 
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Simi-­‐manual layout based on foundry’s digital library plus a pipeline technique are used to research the speed of 640 MHz. The design is opLmized to reduce transmission latency (to transmit trigger data ) and overhead. 12-­‐bit BCID is encoded in the data frame. CRC-­‐8 code is added to detect transmission error; Scrambler is included to transfer DC-­‐
balanced data. Design is in final checking stage. 17 LOCic design LOCic layout 18 LC-­‐PLL for LOCx2 LC_PLL
40 MHz
SLVS
Receiver
Up
PFD
Dn
Charge pump
LC-­‐Tank VCO
LPF
2.56 GHz
40 MHz
Div by 32
2.56 GHz
To Serializer
1.28 GHz
Diff to CMOS
1.28 GHz
CML Divider by 2
1.28 GHz
40 MHz/640 MHz
Outputs
• 
• 
LVDS Drivers
40 MHz
With phase ctrl
640 MHz
Dividers with phase control
SCL
SDA
I2C Controller
32-­‐b
2.56 GHz LC-­‐tank PLL with 2.56 GHz and phase adjustable 640 MHz and 40 MHz clock outputs. The Input reference clock is 40 MHz; Loop bandwidth is programmable from 500 KHz to 2 MHz 19 LC-­‐PLL for LOCx2 LCPLL layout 20 LOCs2 and LOCld1 package •  10 dies of LOCld1v2 are packaged in 5mm x 5mm 24-­‐pin QFN. •  10 dies of LOCs2 are packaged in 12mm x 12mm 100-­‐pin QFN. •  The test boards of packaged chips are ready for test (Put packaged chip photo here) LOCld1 with 24-­‐pin QFN LOCs2 with 100-­‐pin QFN 21 
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