EE141

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EE141- Spring 2004
Lecture 4
Metrics
CMOS Inverter
MOS Transistor Model
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Today’s lecture
‰ Design
Metrics (continued)
‰ The CMOS inverter at a glance
‰ An MOS transistor model for manual
analysis
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Important!
Labs start next week
‰ You must show up in one of the lab sessions
‰ If you don’t show up you will be dropped from
the class
‰
ƒ Unless you let me know that you still want to be in
the class
‰
Homework 2 will be posted later today. Due
next Thursday, February 6.
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The Ideal Gate
V out
Ri = ∞
Ro = 0
Fanout = ∞
NMH = NML = VDD/2
g=∞
V in
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An Old-time Inverter
5.0
4.0
NML
3.0
(V )
o u
t
2.0
V
VM
NMH
1.0
0.0
1.0
2.0
3.0
Vin (V)
4.0
5.0
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Example: An Old-time Inverter
‰ VOH
= 3.6V
‰ VOL = 0.4V
‰ VIL = 0.6V
‰ VIH = 2.3V
‰ NMH = VOH – VIH = 1.3V
‰ NML = VIL – VOL = 0.2V
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Delay Definitions
Vin
50%
t
tpHL
Vout
tpLH
90%
50%
t
10%
tf
tr
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Ring Oscillator
v0
v1
v0
v2
v1
v3
v4
v5
v5
T = 2 × tp × N
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A First-Order RC Network
R
vin
vout
C
tp = ln (2) τ = 0.69 RC
Important model – matches delay of an inverter
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Power Dissipation
Instantaneous power:
p(t) = v(t)i(t) = Vsupplyi(t)
Peak power:
Ppeak = Vsupplyipeak
Average power:
Vsupply t +T
1 t +T
p(t )dt =
Pave = ∫
isupply (t )dt
T t
T ∫t
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Energy and Energy-Delay
Power-Delay Product (PDP) =
E = Energy per operation = Pav × tp
Energy-Delay Product (EDP) =
quality metric of gate = E × tp
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A First-Order RC Network
R
vout
vin
CL
T
T
E 0→1 = ∫ PDD (t )dt = VDD ∫ i DD (t )dt = VDD
0
T
0
T
EC = ∫ PC (t )dt = ∫ v out i L (t )dt =
0
0
VDD
∫ CLdv out
2
= CLVDD
0
VDD
∫
0
CLv out dv out =
1
2
CLVDD
2
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Summary
‰ Understanding
the design metrics that
govern digital design is crucial
ƒ
ƒ
ƒ
ƒ
Cost
Robustness
Speed
Power and energy dissipation
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CMOS Inverter
MOS Transistor
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What is a Transistor?
A MOS Transistor
A Switch!
|V GS|
VGS ≥ VT
Ron
S
D
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NMOS and PMOS
NMOS Transistor
V GS>0
S
PMOS Transistor
G
G
V GS<0
D
S
D
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CMOS Inverter: First Glance
N Well
VDD
VDD
PMOS
2λ
PMOS
In
Contacts
Out
In
NMOS
Out
Metal 1
Polysilicon
NMOS
GND
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CMOS Inverter
First-Order DC Analysis
V DD
V DD
Rp
V out
V out
VOL = 0
VOH = VDD
VM = f(Rn, Rp)
Rn
V in ⫽ V DD
V in ⫽ 0
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CMOS Inverter: Transient Response
VDD
VDD
tpHL = f(Ron.CL)
Rp
= 0.69 RonCL
Vout
Vout
CL
CL
Rn
Vin ⫽ 0
Vin ⫽ VDD
(a) Low-to-high
(b) High-to-low
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CMOS Properties
Full rail-to-rail swing
‰ Symmetrical VTC
‰ Propagation delay function of load
capacitance and resistance of transistors
‰ No static power dissipation
‰ Direct path current during switching
‰
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MOS Transistors Types and Symbols
D
D
G
G
S
S
NMOS Enhancement NMOS Depletion
D
D
G
G
B
S
S
NMOS with
Bulk Contact
PMOS Enhancement
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Threshold Voltage: Concept
+
VG S
S
–
D
G
n+
n+
n-channel
Depl etion
region
p-substrate
B
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The Threshold Voltage
Threshold
Fermi potential
2φF is approximately - 0.6V for p-type substrates
γ – the body factor
VT0 is approximately 0.45V for our process
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The Body Effect
0.9
0.85
0.8
0.75
T
V (V)
0.7
0.65
0.6
0.55
0.5
0.45
0.4
-2.5
-2
-1.5
-1
V
BS
-0.5
0
(V)
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The Drain Current
Charge in the channel is controlled by the gate voltage:
Drain current is proportional to charge and velocity:
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The Drain Current
Combining velocity and charge:
Integrating over the channel:
Transconductance:
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Transistor in Linear
Linear (Resistive) mode
VGS
S
VDS
G
n+
–
V(x)
ID
D
n+
+
L
x
p-substrate
B
MOS transistor and its bias conditions
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Transistor in Saturation
VGS
VDS > VGS - VT
G
D
S
n+
-
VGS - VT
+
n+
Pinch-off
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Saturation
For VGD < VT, the drain current saturates
k′ W
I D = n (VGS − VT )2
2 L
Including channel-length modulation
k′ W
I D = n (VGS − VT )2 (1 + λVDS )
2 L
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Modes of Operation
Cutoff:
VGS < VT
ID = 0
Resistive:
VT < VGS ; VGS − VT > VDS
k′ W ⎡
V2 ⎤
ID = n
⎢(VGS − VT )VDS − DS ⎥
2 L ⎣⎢
2 ⎥⎦
Saturation:
VT < VGS ; VGS − VT < VDS
k′ W
I D = n (VGS − VT )2
2 L
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Current-Voltage Relations
A Good Ol’ Transistor
6
x 10
-4
VGS= 2.5 V
5
Resistive
Saturation
4
ID (A)
VGS= 2.0 V
Quadratic
Relationship
3
VDS = VGS - VT
2
VGS= 1.5 V
1
0
VGS= 1.0 V
0
0.5
1
1.5
2
2.5
VDS (V)
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A model for manual analysis
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Current-Voltage Relations
The Deep-Submicron Era
x 10
2.5
-4
VGS= 2.5 V
Early Saturation
2
VGS= 2.0 V
ID (A)
1.5
1
0.5
0
Linear
Relationship
VGS= 1.5 V
VGS= 1.0 V
0
0.5
1
1.5
2
2.5
VDS (V)
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υ n (m/s)
Velocity Saturation
υsat = 105
Constant velocity
Constant mobility (slope = µ)
ξc = 1.5
ξ (V/µm)
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Velocity Saturation
ID
Long-channel device
VGS = VDD
Short-channel device
V DSAT
VGS - V T
VDS
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ID versus VGS
-4
6
x 10
-4
x 10
2.5
5
2
4
linear
quadratic
ID (A)
ID (A)
1.5
3
1
2
0.5
1
quadratic
0
0
0.5
1
1.5
VGS(V)
Long Channel
2
2.5
0
0
0.5
1
1.5
2
2.5
VGS(V)
Short Channel
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ID versus VDS
-4
6
-4
x 10
VGS= 2.5 V
x 10
2.5
VGS= 2.5 V
5
2
Resistive Saturation
ID (A)
VGS= 2.0 V
3
VDS = VGS - VT
2
VGS= 2.0 V
1.5
ID (A)
4
1
VGS= 1.5 V
0.5
VGS= 1.0 V
VGS= 1.5 V
1
VGS= 1.0 V
0
0
0.5
1
1.5
2
VDS(V)
Long Channel
2.5
0
0
0.5
1
1.5
2
2.5
VDS(V)
Short Channel
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Including Velocity Saturation
Approximate velocity:
And integrate current again:
In deep submicron, there are four regions of operation:
(1) cutoff, (2) resistive, (3) saturation and (4) velocity saturation
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Regions of Operation
Long Channel
Short Channel
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An Unified Model
for Manual Analysis
G
S
D
B
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Regions of Operation
2.5
x 10
-4
VDS=VDSAT
2
Velocity
Saturated
Linear
I D (A)
1.5
1
VDSAT=VGT
0.5
VDS=VGT
0
0
Saturated
0.5
1
1.5
2
V DS (V)
2.5
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A PMOS Transistor
-4
0
x 10
VGS = -1.0V
-0.2
VGS = -1.5V
ID (A)
-0.4
-0.6
-0.8
-1
-2.5
VGS = -2.0V
Assume all variables
negative!
VGS = -2.5V
-2
-1.5
-1
-0.5
0
VDS (V)
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Transistor Model
for Manual Analysis
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The Transistor as a Switch
VGS ≥ VT
Ron
S
ID
V GS = VD D
D
Rmid
R0
V DS
VDD/2
VDD
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The Transistor as a Switch
7
x 10
5
6
4
R
eq
(Ohm)
5
3
2
1
0
0.5
1
1.5
V
DD
2
2.5
(V)
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The Transistor as a Switch
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Future Perspectives
25 nm MOS transistor (Folded Channel)
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