On-die L2

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10. Rendszerarchitektúrák
Busses:
Figure 1.: Busses
Figure 2.: Main features of the system-bus
Figure 3.: General purpose peripheral busses
Figure 4.: Early implementations of the ISA-bus
Figure 5.. Dedicated busses
Figure 6.: Storage interfaces
Figure 7.: IDE/ATA
Figure 8.: Basic transfer modes of the IDE/ATA standards
Figure 9.: SCSI
Figure 10.: AGP
Figure 11.: AC ’97
Figure 12.: AC ’97
Figure 13.: Implementation of the AC ’97
DRAMs:
Figure 14.: DRAMs
Figure 15.: Memory modules
Figure 16.: Serial Presence Detect (SPD)
Figure 17.: Packaging of memory modules
Figure 18.: DIMMs
Figure 19.: The JEDEC Serial Presence Direct (SPD) standard for DIMMs
Figure 20.: PC100 module identification
CHIPSETS:
Figure 21.: Overview of the Intel chipsets
Figure 22.: Chipsets I.: Supported DRAM features
Figure 23.: Chipsets II.: Supported I/O-features
Figure 9.4: Main features of Intel’s 845xx family of chipsets
Figure 9.10: Intel’s chipsets designed for P4-based value and desktop PCs
Figure 9.14: Bus innovations introduced into Intel’s P4 chipsets
Figure 9.16: The evolution of chipsets intended primarily for P4-based
value/mainstream desktops
Table 9.30: Main features of the FSB and SDRAM interface
Table 9.31: Main features of MCH/ICH interfaces of Intel’s P4-based chipsets
Table 9.32: Main features of high speed MCH interfaces of Intel’s P4-based
chipsets
Table 9.33: Peak bandwidth values and sustained data rates of peripheral buses
Figure 9.34: Peak bandwidth values (Mbyte/s) in a typical value/desktop
motherboard based on Intel’s 865xx family of chipsets
Figure 9.35: Peak bandwidth values (Mbyte/s) in a typical value/desktop
motherboard based on Intel’s 915xx family of chipsets
System architecture:
Figure 24.: Evolution of the system architecture
Figure 25.: ISA-bus based system architecture (Used typically in
08088/80286/80386-based PCs)
Figure 26.: Straight forward PCI-based system architecture (Used typically in 486
and early Pentium-based PCs along with Intel 420 and early 430
chipsets)
Figure 27.: PCI-based system architecture with IDE/ATA and USB ports (Used
typically in mature Pentium-based PCs with mature Intel 430 chipsets)
Figure 28.: PCI-based system architecture with AGP, IDE/ATA and USB
ports(Used typically in early PentiumII and PentiumIII-based PCs
with Intel 440XX chipsets)
Figure 29.: Ports-based system architecture (Used typically in mature PentiumIIand PentiumIII-based systems with Intel 8X0 chipsets Excluding the
810, which includes an integrated display controller rather than an
AGP port)
Figure 30.:Mainstream evolution of the system architecture
Caches:
Figure 31.: Evolution of cache architectures
Figure 32.: Main features of AMD K6 and Athlon K7 cores
Figure 33.: Main features of Intel’s Pentium II/III and Pentium 4 cores
Figure 34.: Main parameters of L1 caches
Figure 35.:
- External L1-cache
- On-die unified L1-cache with optional (external, unified) L2-cache
- On-die split L1-cache with optional (external, unified) L2-cache
- Direct coupled L2-cache
- On-die L2-cache
- On-die L2-cache with an external front-end L3-cache
- On-die L2-cache with a direct coupled L3-cache
Busses
System bus
(Host bus)
(Processor bus)
General purpose peripheral bus
Figure 1.: Busses
Dedicated busses
Main features of the system-bus
Width of the
8086
8088
address bus (bit)
20 1
20 1
24
32
data bus (bit)
16 1
81
16
32
80286
1
Multiplexed
2
Bits 0,1 not implemented (Doubleword aligned)
3
Bits 0-2 not implemented (Quadword aligned)
4
For error protection
80386
2
80486
32
32
2
Pentium
32
3
64
Figure 2.: Main features of the system-bus
Pentium Pro
PII
PIII
P4
36
36
36
36
64+8 4
64+8 4
64+8 4
64+8 4
General purpose periphe ral busses
ISA
(Industry Standard Architecture)
1984: IBM PC/AT bus
The bus of the PC/AT became
a de facto standard.
The term ISA was coined later.
EISA
(Extenced ISA)
MCA
(Microchannel Architecture)
1987: IBM
1988: A number of companies
led by Compaq
The proprietary bus of the IBM PS/2
line of PCs.
(This line was intended to cope with
the clone-makers of the PC-line.)
VESA VL
(Video Electronics Standard
Association, (VESA) Local Bus)
1992: Version 1. VESA
An extension to the ISA bus,
An alternative to IBM's MCA.
16-bit/8 MHz
(2 cycles/B)
32-bit/8 MHz
32-bit/8.33 MHz
8 MB/s
32 MB/s
33 MB/s
PCI
(Peripheral Component
Interchange Bus)
1992: Version 1. Intel 2
The PCI specification was developed
by Intel as an alterative to
the VESA VL standard.
32-bit
Performance, trend
1 It originates from the IBM PC-bus which appeared in 1981 (8-bit wide, 4.77MHz)
2 Now managed by the PCI Special Interest Group Consortium.
Figure 3.: General purpose peripheral busses
Vers. 1.: 32-bit/33 MHz
Vers. 1.: 132 MB/s
Processor type
8088
80286
80386
20-bit
24-bit
24-bit
8-bit
16-bit
32-bit
4,77 MHz
6/8 MHz
20-bit
24-bit
8-bit
16-bit
freqency
4,77 MHz
6/8 MHz
pin-count
62
62+36
Processor bus
address width
data width
freqency
16/25/33 MHz
ISA bus
address width
data width
8 MHz
Figure 4.: Early implementations of the ISA-bus
Dedicated busses
Storage i.f.
(HD, CD-ROM, tape back-up etc.)
IDE/ATA
SCSI
Video i.f.
AGP
Audio i.f.
AC'97
RS-232
Figure 5.. Dedicated busses
Low speed peripheral bus
USB
X-bus
LPC
GPIB
Storage interfaces
(Hard disk interfaces)
ST-506/ST-412
IDE*/ATA
(Integrated Device Electronics)
SCSI
(Small Computer System Interface)
(AT - Attachment)
Seagate Technologies
Separate drive and controller
Now it is obsolete
1981: Westen, compaq, CDC
The controller is integrated on
the drive.
Less expensive, desktop systems
use ATA.
1986: Shugart, NCR
The controller is integrated on the drive.
More expensive (10-25%).
In servers/workstations/ tape
backup systems.
They are expected to offer highter
performance as
SCSI devices can exchange data
without the intervention of the
host processor.
Serial
Parallel, 16/32-bit
Parallel, 8/16-bit
0.625 MB/s
8-133 MB/s
5-160 MB/s
* The term IDE was coined in 1986.
Figure 6.: Storage interfaces
IDE/ATA
ATA
Fast ATA
EIDE
ATA-2
ATA-3
2
ATA-4*
ATA-5 * 3
(1991)
(withdrawn in 1999)
(1994)
(~1994)
(1996)
(withdrawn in 2001)
(1997)
(1998)
(2000)
Seagate
Western Digital
Small Form
Factor Committee
CAM Committee
(from a group of companies)
ANSI X3-221-1994
X3-279-1996
CHS-addressing
(Cylinder, Head, Sector)
max. 504 MB*
1 pair of drives
(1 channel)
Logical Block addressing
1
NCITS 317-1998
NCITS 340-2000
ATAPI (ATA Packet
Interface) for additional
support of CD-ROMs,
tape drives etc.
Logical Block addressing
137.5 GB
16 M-TeraB
2 pair of drives
(2 channels)
32-bit(?)
16-bit
4.17 MHz
8.3 MB/s
16 MB/s
6.67 MHz
8.33 MHz
13.3 MB/s
16.7 MB/s
Performance, trend
*1
*2
3
*
*4
(under development)
Technical Committee
TI3 of NCITS
X3-298-1997
Additional support of Based on Fast ATA
CD-ROMs, tape drives etc.
and EIDE
ATA-6 * 4
The addressable disk capacity is restricted by both the ATA and the BIOS addressing schemes.
The synchronous DMA, Mode 2 of ATA-4 is called ATA/33.
The synchronous DMA, Mode 4 of ATA-5 is called ATA/66.
The synchronous DMA, Mode 4 of ATA-6 is called ATA/133.
Figure 7.: IDE/ATA
8.33 MHz
(double clocked)
33.3 MB/s
16.67 MHz
(double clocked)
66.6 MB/s
16.67 MHz
(double clocked)
133.3 MB/s
Basic transfer modes of the IDE/ATA standards
PIO
Programmed I/O
Mode 0 - Mode 5
Single Word DMA
Transfer of one word at a time
Mode 0 - Mode 2
Multiple Word DMA
Burst mode DMA transfer
Mode 0 - Mode 2
Figure 8.: Basic transfer modes of the IDE/ATA standards
Synchronous DMA
Double clocked burst mode DMA transfer
Mode 0 - Mode 4
SCSI
SCSI-1
SCSI-2
(1986)
(1991)
SCSI-3
(In 2001 not yet formally approved, but
it is considered to be the current standard)
SCSI T10
Committee
Wiring standards
1 GB
8-bit
5 MHz
SPI
P1394
SSA
(SCSI Parallel
Interface)
Firewire
(100 MB/s serial)
System Storage
Architecture
8 GB
8-bit/16-bit
5 MHz/10 MHz
FC-AL
(Fibre ChannelArbitrated Loop)
8-bit/16-bit
20 MHz/40 MHz
(Fast SCSI)
(Ultra SCSI)/(Ultra2 SCSI)
SPI
SCSI-2
Plain
Fast
Wide
Fast Wide
Ultra
Ultra Wide
Ultra 2
Ultra 2 Wide
Data width
8-bit
8-bit
16-bit
16-bit
8-bit
16-bit
8-bit
16-bit
8-bit
16-bit
Bus frequency
5 MHz
10 MHz
5 MHz
10 MHz
20 MHz
20 MHz
40 MHz
40 MHz
40 MHz
40 MHz
Transfer rate
5 MB/s
10 MB/s
10 MB/s
20 MB/s
20 MB/s
40 MB/s
40 MB/s
80 MB/s
80 MB/s
160 MB/s
Performance, trend
Figure 9.: SCSI
Ultra 80/m Ultra 160/m Wide
AGP
The principle of the AGP port
Processor bus
Graphic chip
Memory bridge
(North bridge)
Frame buffer
I/O bridge
(South bridge)
Main memory
AGP
(Intel)
(PCI)
Clock speed
Bus
Version 1.0
Version 2.0
(7/1998)
(Based on Revision 2.1
of the PCI)
(5/1998)
66 MHz
(Multiplexed 32-bit address bus
/data bus)
(Transfer of 4-byte data blocks)
Seperate 32-bit address bus
and 32-bit data bus
Transfer of 8-byte data blocks
Transfer mode
1x
(AGP-66)
2x
(AGP-133)
(double
clocked)
4x
(AGP-266)
(quadruple
clocked)
Transfer rate
264 MB/s
532 MB/s
1064 MB/s
Figure 10.: AGP
AC '97
(Audio Codec)
Traditional sound solution:
ISA/PCI bus
KBD
SP
Sound
card
Mouse
PP
Analog audio input/output
(mono, stereo sound, mic etc.)
Principle of the AC '97 solution:
Separation of the primarily digital and analog parts, designated as Digital
Controller (DC) and Analog Codec (AC), as shown below. These parts
are connected via a 5 wire digital interface, called the AC '97 Link.
AC '97
Digital Controller
AC '97 Link
(5 wire digital)
AC '97
Analog Codec
The original AC '97 interface description specifies the functionality of
the AC '97 Analog Codec and defines a 5 wire digital link (AC '97 Link)
to the AC '97 Digital Controller.
Figure 11.: AC ’97
AC '97
Version 1.0
Version 2.0
Revision 2.1
Revision 2.2
6/1996: 5 vendors
(Intel, ADI, Creative Labs,
National Semiconductor,
Yamaha).
(9/1997)
(5/1998)
(9/2000)
Link: 5-wire digital
(2 serial data lines)
Audio Codec
16-bit optionally
18/20-bit AD/DA
resolution
48 KHz sampling rate
4 analog stereo inputs
2 analog mono inputs
4/6 channel output
dedicated mic input
Digital controller
High Quality audio
(up to 96 KHz sampling rate
120 dB dynamic range)
Modem extension
(Cost effective)
Multiple codec
capability
(for multichannel
audio solutions etc.)
May reside on any bus
(ISA, PCI, USB, 1394) or
in an I/O-bridge
Figure 12.: AC ’97
Implementation of the AC '97
AC '97
Digital Controller
ISA /USB/
1394
AC '97
Digital Controller
AC '97
Link
Analog
audio inputs/
outputs
AC '97
Analog Codec
AC '97 Link
I/O-bridge
(South Bridge)
AC '97
Dig. Contr.
AC '97 Codec
AC '97
Link
Motherboard
Usually implemented
as part of the
South Bridge
Figure 13.: Implementation of the AC ’97
AC '97 Link
Motherboard
DRAM
1
FPM
2
EDO3
BEDO4
SDRAM 5
DRDRAM
6
Since 1996
Asynchronous
Synchronous
Burst mode access (4*8B) on the same row (page)
Up to 66 MHz bus frequency
66/100/133 MHz
Random access,
typ. access time
60/70/80/100 ns
Access to 4
subsequent
columns
(60 ns)
~ 40 ns
~ 25 ns
(5-5-5-5)
(5-7)-3-3-3
(5-7)-4-4-4
(5-7)-2-2-2
5-1-1-1
(5-7)-1-1-1
Max. bandwidth MB/s






Effective bandwidth MB/s




Triton III.: 7-1-1-1
430 ZX.: 7-1-1-1
820
840
Developed by
RAMBUS
Cycle time within a burst
(for a 60 ns part)
Full burst timing
Examples
Overlapping the
read and address
transfer operations
Internal 2-bit
address generator,
dual banks
~ 15 ns


Triton I.: 7-3-3-3 Triton I.: 7-2-2-2
Triton III.: 6-3-3-3 Triton II,III.:6-2-2-2
Internal on-chip
Full pipelined
operation,
SRAM cache,
assuming at least
page is filled in
dual banks
1 clock cycle,1-2 B
wide data path
256/300/356/400
MHz transfer rate
~ 15/10/7.5 ns
Developed by
MICRON
Remakes
(4/3.3/2.8/2.5 ns)
Level of overlapping
Cached structure
1
Dynamic RAM
2
Fast Page Mode DRAM
3
Extended Data Out DRAM
4
Burst mode EDO
Synchronous DRAM
6
Direct Rambus DRAM
5
Figure 14.: DRAMs
Memory modules
(FPM/EDO/SRDRAM)
1-byte wide modules
(8-bits)
30-pin SIPP
30-pin SIMM
4-byte wide modules
(32/36-bits)
8-byte wide modules
(64/72-bits)
72-pin SIMM
(FPM/EDO)
168-bit DIMM
Unbuffered
FPM/EDO
DRAM
Storage capacity (MB)
1/16-16
PPD on some
implementations
386
Presence Detect
Typical use in systems
based on
Unbuffered
SDRAM
Registered
SDRAM
8-512
2-512
SPD
SPD
SPD
PPro (mostly FPM)
PII (only EDO)
PII/PIII
PIII
1-2048
PPD
486
Pentium
PPro
Trend
PPD:
Parallel Presence Detect: Memory parameters and features can be accessed in parallel from a built in EEPROM
SPD:
Serial Presence Detect: Memory parameters and attributes may be serilly accessed from a built in EEPROM.
Figure 15.: Memory modules
Serial Presence Detect (SPD)
~ 40 memory parameters held in an SPD-EEPROM (2-kbit)
Byte 2: Memory type
02H: EDO
04H: SDRAM
Byte 9: Cycle time in tenths of ns
e.g. 75H: 7.5 ns (for PC133)
Further data:
- Memory capacity
- Access time
- CAS-latency
After switching on, the BIOS reads the data from
the EEPROM, and the memory controller part of the
chipset will be set accordingly.
Figure 16.: Serial Presence Detect (SPD)
Packaging of memory modules
SIMM
DIMM
SIPP
Single In-line Pin Package Module
Single In-line Memory Module
Dual In-line Memory Module
A single row of pin connectors,
Twin rows of edge connectors
Twin rows of independent
designed for soldering in place.
with opposite connectors
edge connectors
RIMM
Rambus In-line Memory Module
Dedicated DIMM developed
for Rambus memory
connected together so each
pair of connectors provides
30-pins
(8-bit wide memory modules)
the same contact.
Usually
30/72 pins
168 pins
(8- or 32-bit wide memory modules) (64-bit wide memory modules)
Trend
Figure 17.: Packaging of memory modules
184 pins
(16-bit wide memory modules)
DIMMs
72-bit SO DIMMs
(Small Outline DIMM)
144-bit SO DIMMs
(Small Outline DIMM)
168-bit DIMMs
Designed for portables
Designed for portables
Designed for desktops/workstations/servers
32/36-bit wide memory module
64/72-bit wide memory module
64/72-bit wide memory module
Typical for SDRAMs, but early
implementations include
FPM or EDO DRAMs, as well.
Unbuffered
Registered
(buffered)
Unbuffered SDRAMs
can drive a smaller
number of memory chips
Buffered SDRAMs
can drive a larger
number of memory chips
Figure 18.: DIMMs
The JEDEC Serial Presence Detect (SPD)
standard for DIMMs.
Recent implementations support
PC100
PC133
SDRAMs
SDRAMs
(Intel's PC100 standard (1997)
VIA's PC133 standard (1999)
JEDEC's registered PC100 SDRAM
JEDEC's registered PC133 SDRAM)
Module identification (Intel, VIA)
PC100 requires 8 ns parts,
PC133 needes 7.5 ns parts.
Figure 19.: The JEDEC Serial Presence Direct (SPD) standard for DIMMs
PC100 module identification
(according to Intel)
PCX-abc-def
X: Clock frequency (MHz)
For PC100 modules 100
a: CAS-latency in cycles
Typically 2-3 cycles
b: RAS-CAS-delay in cycles
Typically 2-3 cycles
c: RAS-precharge-time in cycles
Typically 2-3 cycles
d: Output valid in ns (Access time)
Maximum 6 ns
e: SPD-revision nr., last digit
E.g. for revision 1.2: 2
f: Reserved, now 0.
E.g. PC100-322-610
CAS-latency: The time between appearing the column address
(CAS-signal) and appearing the data
RAS-CAS-latency: The time between the RAS and CAS signals
RAS-precharge time: Before a new RAS signal is allowed to appear
Latency for accessing a new row: RAS-prechange + RAS-CAS-latency + CAS-latency
Latency for accessing new colums on the same page: CAS-latency
RAS: Row Address Strobe
CAS: Column Address Strobe
Figure 20.: PC100 module identification
Overview of the Intel chipsets
420 family
430 family
486-based
Pentium-based
440 family
Pentium II/III-based (early chipsets)
450 family
Pentium Pro-based (mostly)
Pentium II/III-based (more recent chipsets)
800 family
Figure 21.: Overview of the Intel chipsets
Servers/Workstations
1993
Type
1995
450 KX
Mars
P
PPro
Target
2
Nr. of CPUs
Proc. bus fr. (MHz)
DRAM
1/2
1
FPM
P
ECC
SIMM/72
SIMM/72
DIMM(u)
430 HX
Trion II
Febr.
PPro
4
2
FPM
1996
450 GX
Orion
60/66
60/66
max. size (GB)
type FPM DRAM
EDO DRAM
SDRAM
RDRAM
Error prot.
Sockets
1994
430 NX
Neptune
June
60/66
2
60/66
4
1/2
FPM
EDO
ECC
SIMM/72
DIMM(u)
PPro/PII
P
FPM
ECC
SIMM/72
1997
440 LX
440 FX
Natoma
May?
Aug
April
PII
PII/PIII
2
2
60/66
66
1
1-1/2
FPM
EDO
EDO
1999
820
Camino
Nov.
PIII
2000
440 GX
450 NX
PII Xeon/
PIII Xeon
PII Xeon/
PIII Xeon
4
2
2
100
100
100/133
133
2
8
1/4-1/2-1
2
2
2
66/100
1
EDO
SDRAM
SDRAM
EDO
SDRAM
SDRAM
SDRAM
SDRAM
ECC
ECC
ECC
ECC
DIMM(u)
DIMM(u/r)
DIMM
DIMM
ECC
SIMM/72
DIMM(u)
1998
440 BX
840
Carmel
PIII/
PIII Xeon
EDO
EDO
RDRAM
RDRAM
RDRAM
RDRAM
RIMM
RIMM
RIMM
RIMM
opt. ECC
ECC
Desktops
1993
Type
Target
Nr. of CPUs
Proc. bus fr. (MHz)
DRAM
max. size (MB)
type FPM DRAM
EDO DRAM
SDRAM
RDRAM
Error prot.
Sockets
1994
430 LX
Mercury
1995
430 FX
Triton
Febr.
P
1
60/60
192
FPM
P
SIMM/72
SIMM/72
P
1
50/60/66
128
1996
430 VX
Triton III.
Febr.
P
1
50/55/60/66
128
1997
1998
430 TX
440 EX
Jan.
March.
P
PII (Cel.)
1
1
60/66
66
256
256
440 ZX
PII
1
66/100
440 MX
Mobile PII/
PII Cel.
1999
810
Whitney
June?
PII(Cel.)/
PIII Cel.
2000
815
850
PII(Cel.)
PIII
P4
1
1
1
66/100
66/100
100/133
256
512
2048
FPM
EDO
SDRAM
FPM
EDO
SDRAM
EDO
SDRAM
EDO
SDRAM
SDRAM
SDRAM
SDRAM
-
P
-
-
-
-
-
SIMM/72
SIMM/72
DIMM
SIMM/72
1
DIMM (u)
-
DIMM(u/r)
DIMM(u/r)
DIMM(u)
DIMM(u)
FPM
EDO
DIMM(u/r)
1
100
RDRAM
opt. ECC
RIMM
1 For FPM/EDO: 72-pin SIMM/144-pin SO-DIMM
for SDRAM: 168-pin DIMM/144-pin SO-DIMM
Figure 22.: Chipsets I.: Supported DRAM features
u: Unbuffered SDRAM
r: Registered (buffered) SDRAM
Identifies related or derived chip sets
Servers/workstations
1993
Type
1994
1995
430 NX
Neptune
June
450 KX
Mars
2
2
Nr. of CPUs
Target
P
PPro
PCI
AGP
ATA
USB
AC'97
1.0
2.0
LPC
Nr. of chips
4/5 (VESA/EISA)
1996
450 GX
Orion
4
8
430 HX
Trion II
Febr.
2
1997
440 LX
440 FX
Natoma
May?
Aug
2
2
PPro
P
PPro/PII
2.0
2.1
2.1
Y
Y
2.1
2x
ATA/33
Y
3
Y
2
12
2
PII
440 BX
1998
440 GX
April
2
2
PII Xeon/
PIII Xeon
2.1
2x
ATA/33
Y
PII/PIII
2.1
2x
ATA 33/66
Y
Y
2
450 NX
4
PII Xeon/
PIII Xeon
2.1
ATA/33
Y
Y
6
1999
820
Camino
Nov.
2000
840
2
2
PIII
PIII/
PIII Xeon
2.2
4x
ATA/66
Y
1.0
Y
3
2.2
4x
ATA/66
Y
1.0
Y
3
Desktop
1993
1994
1995
1996
1997
1998
430 VX
Triton III.
Febr.
1
430 TX
440 EX
1
430 FX
Triton
Febr.
1
Jan.
1
March.
1
Target
P
P
P
P
PII (Cel.)
PCI
AGP
ATA
USB
AC'97
1.0
-
2.0
-
2.1
Y
2.1
2x
ATA/33
ATA/33
Y
Y
2.1
2x
ATA/33
ATA/33
Y
Y
4/5 (VESA/EISA)
4
4
2
2
Type
Nr. of CPUs
430 LX
Mercury
440 ZX
1
PII
2.1
2x
ATA/33
Y
440 MX
1
Mobile PII/
PII Cel.
2.2
ATA/33
Y 1.1
1.0
LPC
Nr. of chips
Figure 23.: Chipsets II.: Supported I/O-features
1
1999
810
Whitney
June?
1
PII(Cel.)/
PIII Cel.
2.2
ATA 33/66
Y
1.0
Y
3
2000
815
850
June
1
1
PII(Cel.)
P4
PIII
2.2
2.2
4x
4x
ATA33/66/100 ATA33/66/100
Y
Y
2.1
2.1
Y
Y
3
3
845xx family
Features
MCH/GMCH
Memory
(Brookdale)
Single channel SDR/DDR SDRAM
(unbuffered)
2 GB1
Max. memory
FSB
HT support
DRAM speed
PC133
9/01
Memory protection
400 MHz
533/400 MHz
HT not supported
HT supported
PC133,
DDR 266/200
12/01
845
845
ECC (opt.)
ECC (opt.)
Integrated graphics (IG)
Graphics interface up to
ICH
PC133,
DDR 266/200
PC133,
DDR 266/200
5/02
5/02
5/02
845G
845E
845GL
AGP 4X
ICH2:
ICH2:
IG
AGP 4X
ICH4:
ICH4:
ICH4:
PCI 2.2
10/100 Mbit/s
Target core at introduction
1
2
DDR 333/266
DDR 333/266
10/02
10/02
845GE
845PE
IG
AGP 4X
AGP 8X
ICH4:
ICH4:
ICH4:
USB 2.0
Ultra ATA/100
LAN
Target line at introduction
845GV
AGP 4X
PCI
AC '97
10/02
IG
ATA up to
USB
DDR 266/200
ECC (opt.)
IG
AGP 4X
DDR 266/200
2
USB 1.1
USB 1.1
USB 2.0
USB 2.0
USB 2.0
USB 2.0
USB 2.0
AC '97 2.1
AC '97 2.1
AC '97 2.3
AC '97 2.3
AC '97 2.3
AC '97 2.3
AC '97 2.3
AC '97 2.3
P4
P4
Celeron
P4
P4
Celeron/P4
P4
P4
Willamette
Northwood-A
Willamette-128

 PGA 478
 PGA 478


 PGA 478
Northwood-B
without HT
Northwood-128/
Northwood-B with HT
Northwood-B
with HT

 PGA 478
The 845 has a max. memory of 2 GB for DDR SDRAMs and 3 GB for SDR SDRAMs.
At introduction of the 845G and 845E chipsets (5/02) Intel did not made any notice about supporting hyperthreading. But in 10/02 Intel revealed that the enhanced 845G (B stepping) and the original
845E do support hyperthreading with upgraded BIOSs.
Figure 9.4: Main features of Intel’s 845xx family of chipsets
11/00
Core s
FSB
Willame tte
400 MHz
8/01
1/02
Willame tte
400 MHz
Northwood-A
400 MHz
11/02
5/03
2/04
Northwood-B
5/02
Northwood-B
Northwood-C
Pre scott
533 MHz
533 MHz
800 MHz
800 MHz
HT
HT
HT
HT
6/04
Pre scott F
800 MHz
800 MHz
HT
HT
LGA 775
EM64T
LGA 775
EM64T
Socket
 PGA 423
 PGA 478
9/01
Chipse ts
11/01
845
 PGA 478
 PGA 478
5/02
845G/E
 PGA 478
 PGA 478
10/02
5/03
865P
 PGA 478
8/03
845GV/GE/PE
848P
5/03
9/03 5/03
865G/GV/PE
4/03
875P
6/04
9/03 6/04
915G/GV/P
Figure 9.10: Intel’s chipsets designed for P4-based value and desktop PCs
8/04
Pre scott
11/02
AGP 8x
AGP
5/03
SATA 1.0a
SATA
5/03
PC I 2.3
PC I
2/04
PC I-X 2.2
PC I-X
6/04
PC I Expre ss
PC I Expre ss 1.0a
5/02
USB
USB 2.0
12/01
AC ' 97
AC ' 97 2.3
6/04
HDAI
HDAI
2001
2002
2003
2004
Figure 9.14: Bus innovations introduced into Intel’s P4 chipsets
P4
FSB
VGA
AGP 4X/8X/PCI Express x.16
1
2
MCH
(845/845xx/848P/865xx/
875P/915xx)
SDRAM
interface
SDRAM 3
interface
Max. 2/4 GB 4
PC 133, DDR 200/266/333/400, DDR2 400/533
SDRAM
unbuffered, ECC opt.
3
SDRAM
HI 1.5/DMI
ICH2
ICH4
ICH5(R)
6x v2.2
6x v2.2
6x v2.3
5
ICH6(R)
7x v2.3
6
ICH2
PCI
ATA/100
PCI-X
4
4x v1.1
6x v2.0
8x v2.0
8x v2.0
v2.1
v2.3
v2.3
v2.3
PCI Express x1
845xx
848P
865xx
875P
915xx
2
2
2
2
SATA
ICH
ICH5(R) 5 ICH6(R) 6
46
LAN 10/100
GPI0
AC/97
5
ICH2/4/5/5R /6/6R 6
LPC
FWH
845
845xx
848P
865xx
875P
BIOS
1
The chipsets including the letter G in their designation provide an integrated graphics controller.
2
The chipsets including the letters GL or GV in their designation don't have an AGP or PCI Express x16 interface.
3
The 845, 845xx and 848P chipsets have a single channel memory link, while the others listed above have a dual channel link.
The 845 has a max. memory of 3 GB for SDR SDRAMs.
5 The ICH5R includes an integrated RAID controller that utilizes the dual SATA ports for a high performance RAID Level 0 implementation.
4
6
1
5
USB
HDAI
845
ICH4
The ICH6R includes an integrated RAID controller that utilizes the dual SATA ports for a high performance RAID Level 0 implementation.
Figure 9.16: The evolution of chipsets intended primarily for P4-based value/mainstream desktops
915xx
Width
Peak aggregate bandwidth
FSB
64-bit
8 * f c Mbyte/s
SDRAM-interface
64-bit
8 * f SDRAM Mbyte/s
Table 9.30: Main features of the FSB and SDRAM interface
Used in the chipsets
Width
Peak aggregate bandwidth
HI 1.5
All prior chipsets
8-bit
266 MByte/s
DMI
910GL, 915xx, 925X, 925XE
4*1 bit
2000 MByte/s
Table 9.31: Main features of MCH/ICH interfaces of Intel’s P4-based chipsets
Used in the chipsets
HI
CSA
HI 2.0
PCI E. x8
Width
Peak aggregate bandwidth
16-bit
533 MByte/s
8-bit
266 MByte/s
E7500/7501/7505
16-bit
1066 MByte/s
E7221/7320/7520/7525
8*1 bit
4000 MByte/s
860
848P/865xx/875P/E7210
Table 9.32: Main features of high speed MCH interfaces of Intel’s P4-based chipsets
Peak bandwidth
MByte/s
AGP 4X
1066
AGP 8X
2132
VGA port
Sustained data rate up to
MByte/s
analog port
MbE c.
12.5
GbE c.
125
SCSI Ultra 320
320
Ultra ATA/100
100
~30-60/drive
SATA 1.0
150
~30-60/drive
PCI 32-bit/33 MHz
133
PCI-X 64-bit/66 MHz
533
PCI-X 64-bit/133 MHz
1066
PCI E. x1
500
PCI E. x4
2000
PCI E. x8
4000
PCI E. x16
8000
USB 1.0
~125
60-90/drive, ~200-250/bus
~400-450
1.5
USB 2.0
60
AC'97
~1.4
HDA
3/SDI, 6/SDO
LPC
~5
~50
Table 9.33: Peak bandwidth values and sustained data rates of peripheral buses
P4
Northwood B/C
FSB 400/533/800 MHz
2132
AGP 8x
865xx1
VGA
GbE
GbE c.
3200-6400
CSA (HI 1.5)
(GMCH)
266
HI 1.5
MbE c.
MbE
PCI v.2.3
ICH5
CODEC
AC'97 v.2.3
SDRAM
21323200
SDRAM
interface
SDRAM
4 GB
DDR 266/333/400
unbuffered, no ECC
Ultra ATA/100
(2 ports)
2*100
USB 2.0
(6-8 ports)
Audio
SDRAM
interface
266
133
PCI v.2.3
(3 slots)
21323200
SATA
(2 ports)
2*150
GPIO
1.4
~5
LPC
SIO
FWH
FD
KB
MS
SP
PP
Figure 9.34: Peak bandwidth values (Mbyte/s) in a typical value/desktop motherboard based on Intel’s 865xx family of chipsets
P4
Prescott
FSB 533/800 MHz
PCI E. x16
VGA
PCI E. x16
PCI E. x16
8000
915xx 1
(G)MCH
8000
DMI
MbE c.
MbE
PCI v.2.3
(2-4 slots)
GbE
Audio
GbE c.
PCI v.2.3
PCI E. x1
SDRAM
interface
SDRAM
26644264
SDRAM
interface
SDRAM
4 GB
DDR 333/400, DDR2 400/533
unbuffered, no ECC
2000
1*100
Ultra ATA/100
(1 ports)
4*150
SATA
(4 ports)
500
ICH6
500
USB 2.0
(8 ports)
60
AC'97 v.2.3
26644264
133
PCI E. x1
(1-2 ports)
CODEC
3200-6400
1.4
GPIO
~5
LPC
SIO
FWH
FD
KB
MS
SP
PP
Figure 9.35: Peak bandwidth values (Mbyte/s) in a typical value/desktop motherboard based on Intel’s 915xx family of chipsets
System architecture
ISA-based
PCI-based
With IDE/ATA and
With AGP, IDE/ATA
USB-ports
and USB-ports
486 and early
Pentium-based PCs
Mature
Pentium-based PCs
Early PII and
PIII-based PCs
Mature
PII/PIII-based PCs
Intel 420
early 430
chipsets
Mature
Intel 430
chipsets
Intel 440XX
Intel 8X0
chipsets
chipsets
Straightforward
8088/80286/
80386-based PCs
Port-based
Trend
Figure 24.: Evolution of the system architecture
8088/80286/80386
Processor
Memory/
Bus controller
KBD
Main Memory
(DRAM/FPM)
ISA
Monitor
Adapter
WD
Adapter
FD
Adapter
PP
Adapter
SP
Adapter
Multi-I/O card
I/O devices
Figure 25.: ISA-bus based system architecture
(Used typically in 8088/80286/80386-based PCs)
486/Pentium
Processor bus
L2 cache
System
controller
Main Memory
(FPM/EDO)
PCI bus
Peripheral
controller
PCI device
adapter
ISA bus
ISA device
adapter
(Legacy and/or
slow devices)
Figure 26.: Straight forward PCI-based system architecture
(Used typically in 486 and early Pentium-based PCs
along with Intel 420 and early 430 chipsets)
Pentium
Processor bus
L2 cache
System
controller
Main Memory
(FPM/EDO/SDRAM)
PCI bus
IDE/(ATA/33)
USB
Peripheral
controller
PCI device
adapter
ISA bus
ISA device
adapter
(Legacy and/or
slow devices)
Figure 27.: PCI-based system architecture with IDE/ATA and USB ports
(Used typically in mature Pentium-based PCs with mature Intel 430 chipsets)
IDE port: First on the 430FX (Triton, 1995)
ATA/33: First on the 430TX (1997)
USB:
First on the 430VX (Triton III, 1996)
PentiumII/
PentiumII/
PentiumIII
PentiumIII
Processor bus
AGP
System
controller
Main Memory
(EDO/SDRAM)
PCI bus
2xIDE/ATA33/66
Peripheral
controller
PCI device
adapter
(Legacy and/or
slow devices)
2xUSB
ISA bus
ISA device
adapter
Figure 28.: PCI-based system architecture with AGP, IDE/ATA and USB ports
(Used typically in early PentiumII and PentiumIII-based PCs with Intel 440XX chipsets)
PentiumII/
PentiumIII
Processor bus
AGP
System
controller
Main Memory
(SDRAM/RDRAM)
Hub interface
LPC
2xIDE/
ATA 33/66/100
Peripheral
controller
2x/4x USB
Super I/O (KBD, MS, FD, SP, PP, IR)
AC'97
PCI bus
PCI to ISA
bridge
PCI device
adapter
ISA bus
ISA device
adapter
(Legacy and/or
slow devices)
Figure 29.: Ports-based system architecture
(Used typically in mature PentiumII- and PentiumIII-based systems with Intel 8X0
chipsets
Excluding the 810, which includes an integrated display controller rather than an AGP
port)
ISA
General purpose
peripheral buses
PCI
SCSI
IDE/ATA
AGP
Dedicated I/O-ports
AC'97
LPC
1980 81
82
83
84
85
86
87
88
89 1990 91
General purpose peripheral buses
92
93
94
95
96
97
98
99 2000 01
Dedicated I/O-ports
Figure 30.: Mainstream evolution of the system architecture
Caches
Added
feature
External
(unified) L1
L1
External
Unified
On-die L1
Split L1
External
(unified) L2
Direct
coupled L2
On-die L2
External
(unified) L3
Direct
coupled L3
On-die
Split
On-die
External
L2
Direct coupled
Direct coupled
Unified
External
L3
Direct coupled
Unified
Intel
x/86
386 (opt.)
486 1
Pentium
Pentium (opt.)
PPro
PII (except Mendocino)
PIII (0.25 μ)
PII (Mendocino)
PII/PIII (0.18 μ)
P4
IA/32
(P4 orig.design)
Itanium
IA/64
AMD
Kx
K5
K6
K6-2
K5 (opt.)
K6 (opt.)
K6-2 (opt.)
Athlon
(K7, K75 cores)
Trend
1
Optionally extended with on external, unified L2 cache
Figure 31.: Evolution of cache architectures
K6-2+
Athlon
(Thunderbird core)
Athlon 4
Duron
(Spitfire core)
K6-III
K6-III+
Server/Workstation
models
(Athlon MP-line)
Performance
desktop models
(K6/Athlon-line)
4/97
Δ
K6 Model 6
(0.35 μ/8.8 mtrs)
166/200/233 MHz
Opt. L2 through FSB
Socket 7 1
5/98
Δ
K6-2
(0.25 μ/9.3 mtrs)
266/300/333 MHz
Opt. L2 through FSB
Socket 7 1
1/98
Δ
K6 Model 7
(0.25 μ)
266/300 MHz
Opt. L2 through FSB
Socket 7 1
8/99
6/00
Δ
Δ
Athlon K7
Thunderbird
(0.25 μ/22 mtrs)
(0.18 μ/37 mtrs)
500/550/600/650 MHz
750-1000 MHz
Direct coupled half speed L2
On-die full speed L2 3
(512 KB)
(256 KB)
Slot A
Socket-A
11/99
3/99
Slot-A (OEMs only)
Δ
Δ
Athlon K75
K6-III
(0.18 μ/22 mtrs)
(0.25 μ/21.3 mtrs)
750 MHz
400/450 MHz
Ext. 0.4 times 2
On-die full speed L2
core speed L2
(256 KB)
(512 KB)
Socket 7 1
Slot A
6/01
Δ
Model 6
(0.18 μ)
1/1.2 GHz
On-die full speed L2
(256 KB)
Socket A
6/01
Δ
Athlon 4
(0.18 μ/37.5 mtrs)
1.4-1.5 GHz
3
On-die full speed L2
(256 KB)
Socket-A
6/00
Δ
Spitfire
(0.18 μ/25 mtrs)
600/650/700 MHz
On-die full speed L2
(64 KB)
Socket-A
Low-end
desktop models
(Duron-line)
1997
1998
(MMX supported)
1 Actually 321 pin CPGA (Ceramic Pin Grid Array)
2
Later, higher speed versions (900/950/1 GHz)
used 1/3 speed L2
3 Exclusive L2
1999
(3D-Now! supported)
2000
(Enhanced 3D-Now! supported)
2001
(3D-Now! Professional supported)
(~SSE)
mtrs: Million transistors
FSB: Front-side Bus
Slot-A: Mechanically identical to Slot 1 but it is electriclly different
Socket A (Socket 462): Physically the same as the Socket 7 or the Socket-370
Figure 32.: Main features of AMD K6 and Athlon K7 cores
1/99
10/99
6/98
5/00
Δ
Δ
Δ
Δ
Tanner
Cascades
Cascades
Xeon
(0.25 μ)
(0.25 μ)
(0.18 μ)
(0.18 μ)
400 M Hz
500 M Hz
700 M Hz
600/667/700 M Hz
Ext. full-speed L2 Ext. full-speed L2 On-die full-speed L2 On-die full-speed L2
(0,5/1 M B)
(0,5/1/2 M B)
(1/2 M B)
(0.25 M B)
Slot2
Slot2
Slot2
Slot2
S erver/Workstation
models
(Xeon-line)
Performance
desktop models
11/95
Δ
Pentium Pro
(0.6 μ/0.35 μ/5.5 mtrs)
150/180/200 M Hz
Ext. full-speed L2
(256 K)
Socket8
5/97
Δ
Klamath
(0.28 μ/7.5 mtrs)
233/266/300 M Hz
Ext. half-speed L2
(512 KB)
Slot1
1/98
Δ
Deschutes
(0.25 μ)
333 M Hz
Ext. half-speed L2
(512 KB)
Slot1
2/99
Δ
Katmai
(0.25 μ/8.5 mtrs)
450/500 M Hz
Ext. half-speed L2
(512 KB)
Slot1
Low-end
desktop models
(Celeron-line)
3/00
Δ
Coppermine128
(0.18 μ/28.1 mtrs)
566/600 M Hz
On-die full-speed L2
(128 KB)
FC-PGA
8/98
Δ
Mendocino
(0.25 μ/19 mtrs)
300/333 M Hz
On-die full-speed L2
(128 KB)
Slot1
1995
1996
Pentium Pro
(M M X added)
Slot1: SECC 242
Slot2: SECC 330
SECC: Single Edge Contact Connector
Socket8: 387-pin PGA
1997
1998
Pentium II
(M M X added)
FC-PGA: Flip Chip Pin Grid Array
Ext.: External direct coupled
mtrs: M illion transistors
Figure 33.: Main features of Intel’s Pentium II/III and Pentium 4 cores
11/00
Δ
Pentium 4
(0.18 μ/42 mtrs)
1.4/1.5 GHz
On-die full speed L2
(256 KB)
423-pin PGA
10/99
Δ
Coppermine
(0.18 μ/28.1 mtrs)
500-733 M Hz
On-die full-speed L2
(256 KB)
Slot1/FC-PGA1
4/98
Δ
Covington
(0.25 μ)
266 M Hz
No ext. L2
Slot1
5/01
Δ
Xeon 1.7 GHz
(0.18 μ/42 mtrs)
1.4/1.5/1.7 GHz
On-die full speed L2
(0.25 M B)
603-pin micro PGA
1999
2000
2001
Pentium 4
(SSE2 added)
Pentium III
(SSE added)
1 Only
the 500/550 M Hz models
L1 instruction cache
Bytes per
cache line
4-way
Nonblocking
8 KB
2-way
WB/WT
Y
8 KB
2-way
16 KB
Y
16 KB
Y
16 KB
Y
16 KB
Y
Y
8 KB
16 KB
Y
16 KB
32 KB
Y
32 KB
Y
K6-2
32 KB
Y
32 KB
Y
K6-3
32 KB
Y
32 KB
Y
K7
64 KB
Y
64 KB
Y
Thunderbird
64 KB
2-way
Y
L: 3 clocks
64 KB
2-way
Y
Athlon 4
64 KB
2-way
Y
64 KB
2-way
Y
1
8 KB
Bytes per
cache line
Organization
16 B
Organization
Nonblocking
Size
Intel 486
Size
L1 data cache
Pentium
32 B
8 KB
2-way
PPro
32 B
8 KB
4-way
PII
PIII
P4
Itanium
AMD K6
32 B
Trace cache
(12 K μops)
1
Unified instruction/data cache
2
No FP data stored
Figure 34.: Main parameters of L1 caches
4-way
2
Y
Y
Y
Processor
Bus interface unit
Processor bus
L1-cache
System
Contr.
Memory
Core Logic
External L1-cache
Examples: Intel 386 based systems with optional L1-cache
L1-cache
Processor
Bus interface unit
Processor bus
L2
Cache
System
Contr.
Memory
Chipset
(core logic)
On-die unified L1-cache with optional (external, unified) L2-cache
Examples: Intel 486-based systems
D-cache
I-cache
Processor
Bus interface unit
Processor bus
L2
Cache
System
System
Contr.
Contr.
Memory
Chipset
On-die split L1-cache with optional (external, unified) L2-cache
Exmples: Intel Pentium, AMD K5, K6, K6-2 based systems
Processor
D-cache
I-cache
L2
Cache
Bus interface unit
Processor bus
System
Contr.
Memory
Chipset
Direct coupled L2-cache
Examples: Intel Pentium Pro, Pentium II (expect Mendocino), Pentium III
(0.25μ technology) and AMD Athlon (K7, K75 cores) based systems
D-cache
I-cache
L2-cache
Processor
Bus interface unit
Processor bus
System
Contr.
Memory
On-die L2-cache
Examples: Intel Pentium II (Mendocino core), Pentium III (0.18μ technology),
Pentium4, Athlon (Thunderbird core), Athlon 4, Duron (Spitfire core)
D-cache
I-cache
L2-cache
Processor
Bus interface unit
Processor bus
L3
Cache
System
System
Contr.
Contr.
Memory
On-die L2-cache with an external front-end L3-cache
Examples: Pentium 4 original design, K6-III
D-cache
I-cache
L2-cache
Bus interface unit
Processor
L3
Cache
Processor bus
System
Contr.
Memory
On-die L2-cache with a direct coupled L3-cache
Examples: Itanium
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