2SK963
Switching Diodes
MA156
Silicon epitaxial planer type
Unit : mm
For switching circuits
6.9±0.1
1.5
board
1.0
4.5±0.1
di
p
Pl
lan nclu
ea
e
se
pla m d m des
ne ain ain foll
htt visit
d te t o
p:/ fo
/w llo dis disc nan enan wing
ww wi co on ce c fo
.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
ct
life
an ut e
d
as lat
cy
on es
cle
ic. t in
sta
co fo
ge
.jp rm
.
/en at
i
o
/
n.
0.85
4.1±0.2
R
fixed in a self-standing pattern after insertion in the printed-circuit
2.4±0.2 2.0±0.2 3.5±0.1
M type package for automatic and manual insertion, which can be
0.
7
●
1.0±0.1
Series connection of diodes in the package
M
Di ain
sc te
on na
tin nc
ue e/
d
●
1.0
1.5 R0.9
R0.9
0.4
■ Features
2.5±0.1
3
0.45±0.05
2
1
1.25±0.05
0.55±0.1
1 : Anode
2 : Cathode
0ÅAnode
3 : Cathode
EIAJ : SC-71
M Type Package
■ Absolute Maximum Ratings (Ta= 25˚C)
Parameter
Symbol
VR
Repetitive peak reverse voltage
VRRM
Forward current
IF
Peak forward current
IFM
Junction temperature
Tj
Storage temperature
Tstg
Unit
Rating
40
V
40
V
100
mA
200
mA
150
˚C
– 55 to +150
˚C
2.5
2.5
■ Internal Connection
3
2
1
/D
isc
on
tin
ue
Reverse voltage
■ Electrical Characteristics (Ta= 25˚C)
Parameter
Symbol
an
ce
Reverse current (DC)
int
Reverse voltage (DC)
en
Forward voltage (DC)
Ma
Terminal capacitance (Single)
❖Rated input/output frequency : 100MHz
IR
VF
VR
Ct
Condition
min
VR= 40V
IF=100mA
IR=100µA
VR= 0V, f=1MHz
typ
max
Unit
0.1
µA
1.2
V
40
5.0
V
pF
MA156
Switching Diodes
IF – VF
IF – VF
103
103
Ta=25˚C
D1 (1-2)
103
Ta=25˚C
D2 (2-3)
D1 (1-2)
D2 (2-3)
D1 (1-2)
102
IR – V R
102
Ta=125˚C
102
D2 (2-3)
Reverse current IR (µA)
Forward current IF (mA)
1 2 3
10
10
10
D1 (1-2)
1
10–1
10–2
0.2
0.4
0.6
0.8
1.0
1.2
0
Forward voltage VF (V)
0.2
0.4
0.6
0.8
1.0
1.2
0
0.1mA
D1 (1-2)
40
80
120
160
en
an
ce
Ambient temperature Ta (˚C)
Ma
int
Ct – VR
10
f=1MHz
Ta=25˚C
5
3
2
D1 (1-2)
D2 (2-3)
1
1
2
3
D2 (2-3)
0.5
D1 (1-2)
0.3
0.2
0.1
0
10
20
0.4
D1 (2-3)
1 2 3
/D
isc
on
tin
0
0.1mA
30
40
Reverse voltage VR (V)
50
0
–40
30
40
D1 (1-2)
50
VR=40V
D1 (1-2)
D2 (2-3)
1
2
3
10
D2 (2-3)
1
10–1
0.2
1 2 3
0
–40
3mA
1mA
0.6
ue
0.2
IF=10mA
Reverse current IR (µA)
102
0.4
20
IR – Ta
0.8
1mA
10
VF – Ta
0.8
3mA
D2 (2-3)
Reverse voltage VR (V)
103
0.6
Ta=25˚C
Forward voltage VF (V)
1.0
IF=10mA
D1 (1-2)
10–2
1.0
Forward voltage VF (V)
Forward voltage VF (V)
VF – Ta
Terminal capacitance Ct (pF)
10–1
10–2
0
1
di
p
Pl
lan nclu
ea
e
se
pla m d m des
ne ain ain foll
htt visit
d te t o
p:/ fo
/w llo dis disc nan enan wing
ww wi co on ce c fo
.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
ct
life
an ut e
d
as lat
cy
on es
cle
ic. t in
sta
co fo
ge
.jp rm
.
/en at
i
o
/
n.
10–1
1
D2 (2-3)
1 2 3
M
Di ain
sc te
on na
tin nc
ue e/
d
Forward current IF (mA)
1 2 3
10–2
0
40
80
120
Ambient temperature Ta (˚C)
160
–40
0
40
80
120
Ambient temperature Ta (˚C)
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
M
Di ain
sc te
on na
tin nc
ue e/
d
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
d
pla inc
ne lud
se
pla m d m es
v
ne ain ain foll
htt isit
d te t o
p:/ fo
/w llo dis disc nan enan wing
ww wi co on ce c fo
.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
ct
life
an ut e
d
as lat
cy
on es
cle
ic. t in
sta
co fo
ge
.jp rm
.
/en at
i
o
/
n.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
Pl
ea
Ma
int
en
an
ce
/D
isc
on
tin
ue
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.