VLSI Design & Test Seminar
Wednesday, November 18, 2009
4:00PM, Broun 235
Title:
Techniques of Testing Interconnects in High Density
Package Substrates
Speaker: Bruce Kim, bkim@eng.ua.edu
University of Alabama, Tuscaloosa, AL
Abstract: The package interconnects are fundamental bottleneck for achieving
high performance and reliability. There are numerous test techniques to test VLSI
and package interconnects. However, their test techniques could be too expensive
and cumbersome to use for today’s high density interconnects. Testing of
interconnects are important to ensure reliable system after the packaged chips leave
a factory. This talk will provide research work in techniques for testing
interconnects in today’s high density packages, carbon nanotube based
interconnects and RF circuit test automation. First, we will introduce work on RF
resonator based testing of interconnects in high density packages. The RF
resonator based technique provides testing of near-open and near-short defects in
high density packaging. This could be a viable technique for 3D TSV packages.
We will then introduce some work on carbon nanotube-based interconnects.
Finally, we will discuss test automation of RF circuits including RF microstrips
and interconnects.
Bruce Kim received the B.S.E.E. degree from the University of California, Irvine,
the M.S. degree in electrical engineering from the University of Arizona, and the
Ph.D. degree in electrical engineering from Georgia Institute of Technology. He is
an Associate Professor at The University of Alabama. His current research
interests include RF IC testing, 3D packages and VLSI circuits. Dr. Kim is a 1997
recipient of the National Science Foundation’s CAREER Award and received two
Meritorious Awards from IEEE Computer Society. He is an editor of IEEE Design
& Test of Computers for the Microelectronic IC Packaging topic area and a BoG
member of the IEEE CPMT Society.
Seminar Contact: Vishwani Agrawal, vagrawal@eng.auburn.edu