The Integrated Electronics Engineering Center a New York State Center of Advanced Technology at
Binghamton University, part of The New York State Center of Excellence in Small Scale Systems Integration
and Packaging, in conjunction with GE Global Research Center and the Binghamton Chapter of the IEEE
Components, Packaging and Manufacturing Technology Society (CPMT) hosted the 2011 Electronics
Packaging Symposium, Technology Advances in Small Scale Systems and Microelectronics Packaging,
October 10-11, 2011 at Binghamton University
The symposium provided over 150 attendees from academia, government and industry with information about
promising new technologies and developments that are now impacting the electronics industry. Participants
received overviews and research reports on a range of emerging technologies including: National Trends,
Thermal Management, 3-D Packaging, Sensors/MEMs, Power Electronics, Packaging for Harsh Environments,
Interconnects, Miniaturization, and Flexible/Printed Electronics.
The symposium was opened by Bahgat Sammakia, Interim Vice President for Research, and
Jerry Trant, GE Global Technology Leader, Micro & Nano Structure Technologies. Speakers included:
Tien Wu, Chief Operating Officer, ASE
Terry Ericsen, Office of Naval Research
Klaus Hummler, SEMATECH
Brandon Prior, Prismark Partners
Madhu Iyenagar, IBM
Yifan Guo, Skyworks Solutions, Inc.
Emad Samadiani, Binghamton University
Bernd Appelt, ASE Group
Shakti Chauhan, GE Global Research
Michael Gaynes, IBM TJ Watson Research Center
Carl Raleigh, Analog Devices
Sang Won Yoon, Toyota Research Institute of NA
Ralf Lenigk, GE Global Research
Jared Hornberger, APEI
Andrew Oliver, WIMS, University at Michigan
Patrick McCluskey, University of Maryland
Rob O'Reilly, Analog Devices
S. Manian Ramkumar, RIT
Liangyu Chen, NASA
Roger Quon, SEMATECH
Tan Zhang, GE Global Research Center
Lei Fu, AMD
Gamal Refai-Ahmed, PreQual Tech Corp.
Wayne Jones, Binghamton University
Joseph Fjelstad, Verdant Electronics
Romeo Delrosario, Army Research Laboratory
Liang Yin, Universal Instruments
Kock-Yee Law, Xerox
Yongjae Lee, GE Global Research
Mark Poliks, Endicott Interconnect Technologies
Brian Roggeman, Universal Instruments
Dinner remarks were given by Steve Betza Corporate Director, Electronics Engineering and Packaging,
Lockheed Martin.
The next symposium is scheduled for Fall, 2012 at GE Global Research, Niskayuna, NY.