Joint Technical Seminar Program
IEEE Oregon CPMT/CAS Chapter
(in cooperation with the SMTA, IMAPS, IPC & EMA)
(the seminar room sponsored by the PSU ECE department)
presents
Joseph Fjelstad
“Great Topic TBA”
Wednesday, September 18th, 2013, 6:00-8:00 pm
PCC Willow Creek Center, Room 313
241 SW Edgeway Drive (near SW 185th and Baseline Road)
Beaverton, OR 97006
Directions: http://www.pcc.edu/about/locations/willow-creek/
Information: https://meetings.vtools.ieee.org/meeting_view/list_meeting/xxx
Registration: https://meetings.vtools.ieee.org/meeting_registration/register/xxx
(Registration is free, but helps in planning the refreshments)
Agenda:
6:00pm Refreshments and social
6:30pm Topic TBA
8.00pm Adjourn
Title:
Advantages of Aluminum Substrates for Electronic Assembly and Prospective Constructions
Abstract:
Aluminum is the 3rd most abundant element in the Earth's crust yet it was only first refined in
1827 and is today second only to iron in industrial use. However, it has seen only limited use in
the manufacture of substrates for electronic products, except as a heat sink, both internal as a
metal core and externally where it is most commonly seen. While it has seen increased use in
recent years as an interconnecting substrate for LED assemblies, aluminum is less favored by
more traditional applications where soldering is used to make interconnections due to concerns of
component damage due to the higher thermal exposure required to assure a good solder joint is
made. However, if one reconsiders the manufacturing process, aluminum could well become a
viable substrate for a range of future electronic products including, rigid, rigid flex and formable
circuits. This presentation will examine some of the myriad benefits of aluminum and explore
potential manufacturing methods, structures and uses, both novel and mundane, of this
potentially very important and highly beneficial metal in electronic applications.
Speaker Biography
Joseph Fjelstad is founder and president of Verdant Electronics, Inc. a
company focused on the development of lower cost, more
environmentally friendly and more reliable electronic products with a
goal of helping to meet the needs of the world’s disadvantaged
peoples for such given their limited resources. Mr. Fjelstad is a fourdecade veteran of the electronics industry and is a globally
recognized authority on and author of several books on electronic interconnection technologies
including Flexible Circuit Technology, 4th Edition. He is also a magazine columnist and
commentator, educator and innovator in the field of electronic interconnection and packaging
technologies. The recipient of a number of industry and corporate awards over his career
including the IPC's President Award, the first fellowship at Tessera and recognition as one of the
inventors of the year at Boeing Aerospace, Mr. Fjelstad has more than 300 U.S. and international
patents issued or pending.