Manufacturing Processes
Micro Fabrication
Associate Professor Su-Jin Kim
MEMS
Manufacturing Processes
© Pearson & GNU Su-Jin Kim
School of Mechanical Engineering
Gyeongsang National University
Index
•
Micro fabrication of IC(Integrated Circuits) 반도체제조
1.
2.
3.
4.
5.
6.
Weiper(웨이퍼)
Lithography(노광)
Etching(식각)
Doping(확산)
Deposition(증착)
Packaging(포장)
• MEMS(Microelectromechanical system) 미소기전
MEMS
Manufacturing Processes
© Pearson & GNU Su-Jin Kim
Micro-manufacturing
•
•
•
Manufacturing on a microscopic scale
IC: Integrated circuit
MEMS: micro electro mechanical system
•
Products
1.
2.
3.
4.
5.
6.
Sensors
Inkjet printing heads
Micro-actuators
Hard-drive heads
Computer processors
Memory chips
MEMS
Manufacturing Processes
© Pearson & GNU Su-Jin Kim
Scale, mm / μm / nm
MEMS
Manufacturing Processes
© Pearson & GNU Su-Jin Kim
Transistor to IC
• Transistors(1947)  IC (integrated circuits), MOS (metaloxide-semiconductor)  VLSI (very large-scale
integration)
• Moore’s Law : The number of transistors per chip doubles
every 18 months.
1st Transistor
MEMS
Manufacturing Processes
© Pearson & GNU Su-Jin Kim
IC
Clean Rooms
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•
•
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Essential for the production of IC (integrated circuits).
Cleanliness are defined by class of the clean rooms.
Air is passed through a high-performance particulate air
(HEPA) filter.
Largest source of contaminants is people.
MEMS
Manufacturing Processes
© Pearson & GNU Su-Jin Kim
Silicon (Semiconductors)
•
•
•
Natural silicon dioxide SiO2 is an excellent insulator.
Single crystal silicon Si is semiconductor.
Get n-type by doping P or p-type doping B.
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SiO2
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Si
-
-
Insulator
MEMS
Manufacturing Processes
© Pearson & GNU Su-Jin Kim
P
-
Single crystal silicon
-
-
+phosphorus
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n-type
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B
+boron
-
p-type
Integrated Circuits; IC Process
Wafers
Lithography
Ingot
Wafer
Coat photoresist
Photolithography
Remove exposed photoresist
Etching
Wet etching
Dry etching
Doping
Diffusion
Ion implantation
Deposition
Film deposition
Oxidation
Device
MEMS
Manufacturing Processes
© Pearson & GNU Su-Jin Kim
Wire bonding
Packaging
1967: http://www.youtube.com/watch?v=z47Gv2cdFtA (30min)
Ingot & Wafer
1. natural SiO2  purification  electric-grade silicon Si
2. Single-crystal silicon ingot is grown from the purified silicon
melt.
3. The Ingot is cut into silicon wafers. The wafers are polished
until they have mirror-smooth surfaces.
MEMS
Manufacturing Processes
Wafer: http://www.youtube.com/watch?v=LWfCqpJzJYM&feature=related
© Pearson & GNU Su-Jin Kim
Lithography
1. Drop down photoresist on spinning wafer.
2. Photolithography : UV light passes through mask to
wafer surface.
3. Exposed photoresist is dissolved by a solvent.
MEMS
Manufacturing Processes
Photolithography: http://www.youtube.com/watch?v=9x3Lh1ZfggM&feature=related
© Pearson & GNU Su-Jin Kim
Etching 식각
1. The photoresist protects
material not be etched away in
an acid solution.
2. After the etching the
photoresist is removed and the
desired shape becomes visible.
scale: transistor level (~50-200nm)
MEMS
IC Process:
Manufacturing Processes
Photoresist, Lithography, Etching, Doping, Deposition
http://www.youtube.com/watch?v=26fkuAY8jKs&feature=related(4min)
© Pearson & GNU Su-Jin Kim
Doping
1. The photoresist (blue) will protect material
that should not get ions implanted.
2. In Ion implantation, ions accelerate through
a high-voltage beam and impact on the
exposed areas (green) of the silicon wafer.
3. After the ion implantation the photo resist is
removed
4. Operation of microelectronic devices
depends on different doping types and
concentrations.
MEMS
Manufacturing Processes
© Pearson & GNU Su-Jin Kim
Deposition 증착
1. Three holes have been etched into the insulation
layer (magenta color) above the transistor.
2. The wafers are put into a copper sulphate
solution. The copper ions are deposited onto the
transistor thru a process called electroplating.
3. On the wafer surface the copper ions settle as a
thin layer of copper.
4. The excess material is polished off. Three holes
are filled with copper which will make up the
connections to other transistors.
MEMS
Manufacturing Processes
PVD: http://www.youtube.com/watch?v=dpwIswozTdw&feature=related (30s)
© Pearson & GNU Su-Jin Kim
Metallization & Testing
1. Metallization: Devices are
interconnected by multiple metal layers
(Al, Cu).
2. Testing: Test each of the individual
circuits with probe
3.
The wafer is cut into pieces called dies.
MEMS
Manufacturing Processes
© Pearson & GNU Su-Jin Kim
Wire Bonding and Packaging
1. Working dice is attached to a rugged
foundation with epoxy or eutectic
bond.
2. Chip is electrically connected to the
package lead by thermo-sonic wire
bonding.
3. Package: The green substrate, the die
and the silver heat-spreader are put
together to form a completed
processor.
MEMS
Manufacturing Processes
Packaging m. p.: http://www.youtube.com/watch?v=Cg-mvrG-K-E&feature=related
© Pearson & GNU Su-Jin Kim
Printed Circuit Boards; PCB
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•
Packaged integrated circuits are combined with other
ICs as building blocks for a larger system.
Printed circuit board (PCB) is the substrate for the final
interconnections.
MEMS
Manufacturing Processes
© Pearson & GNU Su-Jin Kim
Equipment
공정
주요 장비명
기능
빛을 사용하여 웨이퍼위에 회로의 모양을 그리는
장비
Poly-Si Etcher(폴리실리콘 식각장비), Oxidation Etcher(산화막
식각장비), Metal Etcher(금속막 식각), Asher(PR제거장치)
노광공정에서 그려진 대로 식각을 통하여 모양을
만드는 장비
세정공정
(Wetstation)
Wetstation(세정장비), Dryer(건조장비)
제조공정상에서 웨이퍼위에 발생되는 이물질의
제거
평탄화공정
(CMP)
CMP(평탄화장비)
제조공정상에서 웨이퍼내의 소자간 위상차를 보
정해주기 위하여 평평하게 해주는 장비
ALD(원자층증착공정)
웨이퍼위에 미세하게 물질을 증착하는 장비
노광공정
(Photo/Litho)
식각공정
(Etch)
원자층증착공정(ALD)
이온주입공정(Ion Implant)
증착공정(CVD)
메탈공정
(Metallization)
열처리공정(Diffusion)
웨이퍼검사공정
(Micro Inspection)
Stepper, Scanner, Track
웨이퍼내에 불순불을 주입하는 장비
중전류 이온주입기,고전류 이온주입기,고에너지 이온주입기
APCVD(상압증착장비), LPCVD(감압증착장비), PECVD(플라즈
웨이퍼위에 산화막, 절연막 등을 증착하는 장비
마증착장비)
Metal CVD(금속막증착장비), Sputtering(이온분사장비), Electro
웨이퍼위에 금속막을 증착하는 장비
Platting(금속막 전기도금장비)
열을 이용하여 웨이퍼내 물질을 균질하게 하거나,
Furnace,TP(Annealer포함), Epitaxial 성장장비
증착하는 장비
Wafer Inspection, Metrology(물성분석장비)
웨이퍼내 물질의 특성을 분석하는 장비
E-beam(전자빔장비), Imprinter
노광을 하지 않고 웨이퍼위에 직접 패턴을 형성하
는 장비
Assembly공정
Wafer Dicing, Die Attacher, TSV Etcher, Die Bonder, Wire
Bonder, TAB Bonder, Wafer Marker
웨이퍼가공공정이 완료된 이후 절단하여 밀봉하
기 이전까지 진행하는 장비
Packaging공정
Molding M/C, Singulator, Packaging Maker, Saw Sorter, Ball
Attacher
전자제품에 장착하기 위하여 밀봉하는 장비
기타공정
검사공정
(Test)
MEMS
Manufacturing Processes
© Pearson & GNU Su-Jin Kim
Memory Tester, Logic Tester, Mixed Signal Tester, CIS Tester, 제조공정을 완료한 이후 원하는 대로 만들어 졌는
Burn In Tester, Prober, 핸들러
지를 확인하는 장비