Confidential Reliability of Spring Contacts Basics of electrical spring contacts Micro-vibration Temperature cycling Industrial atmosphere Shock & Vibration 1 Confidential Customer Concerns Advantages General Considerations Spring Contact Solder Contact (PIN) Comments Utilization of PCB area + o No through-holes Connection of power module to PCB ++ - No alignment and tolerance problems Equipment investment for inverter production ++ - No solder line needed Inverter assembly time and cost ++ o Easy mounting Rework and field service + o Contact resistance o ++ Contact stability in temperature cycling + o Contact stability in industrial environment + + Contact stability under shock and vibration + o ++ + o - Excellent Good Adequate Bad No fatigue of solder contacts (cold joints) No fractures as in solder contacts Comparison Spring contact / Solder contact 2 Qualification Standards – SEMiX™ Confidential Test Test Conditions Standard High Temperature Reverse Bias IGBT 600/1200 V 1700 V 1000h, VGE = 0V 95% VDSmax / VCEmax, Tc = 140°C Tc = 125°C IEC 60747 High Temperature Gate Stress High Humidity High Temperature Reverse Bias 1000h, VGSmax / VGEmax, Tvjmax 1000h , 85°C, 85% RH VDS/VCE= 80% VDSmax/VCEmax, max. 80V, VGE = 0V 04 High Temperature Storage 1000h, T = + 125°C IEC 60068 Part 2-2 05 Low Temperature Storage 1000h, T = - 40°C IEC 60068 Part 2-1 06 Temperature Cycling 100 cycles - 40°C + 125°C IEC 60068 Part 2-14 Test Na 07 Power Cycling 20000 load cycles Tj = 100K IEC 60749-34 08 Vibration Sinusoidal Sweep, 5 g, x, y, z – axis, 2h/axis IEC 60068 Part 2-6 Test Fc 09 Shock Halfsinusoidal Pulse, 30 g, x, y, z direction, 3x/direction IEC 60068 Part 2-27 Test Ea 10 Tensile Strength No 01 02 03 IEC 60747 IEC 60068 Part 2-67 IEC 60068 Part 2-21 Test Ua1 SEMIKRON Standard Qualification Test Program 3 Confidential Qualification Standards - SEMiX™ Failure Criteria: IGSS / IGES IDSS / ICES RDS(on) / VCE(sat) VGS(th) / VGE(th) : : : : Rth(j-c) thjh Visol : : + 100 % of the upper specification limit + 100 % of the upper specification limit + 20 % of the initial value + 20 % of the upper specification limit - 20 % of the lower specification limit + 20 % of the initial value not below the specification limit Failure Criteria for Module Qualification 4 Confidential Qualification Standards - SEMiX™ Contact Resistance of Sense and Auxiliary Contacts Set-up: short circuit bonded or continuous copper area DBC, current sensor contact pads max. change: 400 mΩ for ΔRc: C o n d a i t i o n s : m e a s . c u l i n r r e n t : 1 0 m A ( p u l s e ) p a i , 5 V r o v 1 0 1 T e m p e r a t u r e C y c 0 f p o l 0 i t n a s ( g c y = e c l l 2 i m e s 2 5 0 i 0 t a Ω m t i o p e r p i n ) n I E C 6 0 0 6 8 P a r t 2 - 1 4 g - 4 0 ° C + 1 ° C T e s t N a SEMIKRON Additional Reliability Test Program 5 Confidential Contents Basics of electrical spring contacts Micro-vibration Temperature cycling Industrial atmosphere Shock & Vibration 6 Confidential Basics on electrical spring contacts mating and unmating force contact force Rc typ. 50N/mm² typ. 10N/mm² 20-100N/mm² Types of electrical pressure contact 7 Confidential Basics on electrical spring contacts Metallic platings (Mating/un-mating forces & contact forces): Contact forces in pressure contacts of power modules: SnPb or Sn - 2.5 - 20 N Ag - 1 - 20 N Ni / Au flash - 1-2 N Ni / AuCo 0.2% - 1-2 N Mini SKiiP SEMiX 5-6 N 3-5 N Plating systems for different pressure ranges 8 Basics on electrical spring contacts Confidential (P. Slade, Electrical Contacts, 1999) Electrical contact is formed by A-Spots 9 Confidential Basics on electrical spring contacts a – spot radius / µm constriction resistance / 0,01 0,88 0,1 8,8 · 10-2 1 8,8 · 10-3 10 8,8 · 10-4 O.K. for 20 A 100 8,8 · 10-5 O.K. for 200 A no significant T-rise (P. Slade, Electrical Contacts, 1999) a-Spot radius on Cu for different currents 10 Basics on electrical spring contacts Function Typ. voltage range Typ. current range Impact of resistance change MiniSKiiP Confidential Sensor Contact Control Contact Load Contact 0V to 5V nA to mA High -15V to 15V mA to 3A Low 2V to 1700V up to 20A Very low SEMiX Different application ranges for electrical pressure contacts 11 Confidential MiniSKiiP contact spring: The contact springs for MiniSKiiP II are made of “K88”, a copper alloy by German supplier “Wieland”. Thickness of the spring material: 0.3 mm 0.05 mm The contact spring is silver plated. The thickness of that plating is varying over the springs surface and given in the sketch below. To reduce tarnishing, the silver plating is passivated by an additional inorganic conversion layer (SnCl2) or a metallic plating with a thickness << 1µm. MiniSKiiP II Contact spring 12 Confidential Contents Basics of electrical spring contacts Micro-vibration Temperature cycling Industrial atmosphere Shock & Vibration 13 Confidential Micro-vibration clamping fixture piezo actuator contact force R I V PCB PCB spring pins fixing screw module housing ΔRc DBC mounting plate Tribometer Test – Schematic Set-up 14 Micro-vibration Confidential Source: P.G.Slade: Electrical contacts: principles and application, Marcel Dekker, Inc. 1999, pp 343-345 Classification of micro-vibration test results 15 Confidential Micro-vibration Travel range 100 µm Frequencies 20 Hz Typical test conditions: 10 - 30 µm 5-10 Hz Tribometer (A) - Test equipment for micro-vibration 16 Confidential Micro-vibration MiniSKiiP II. Generation Spring / PCB HAL SnPb 0,010 pair of springs #1 0,005 pair of springs #2 Delta R [Ohm] 0,000 -0,005 -0,010 Test conditions: Frequency: Amplitude: Sample Rate: Cycles: 1 Hz 50µm 5s 4,65 Mio. (Test time: ~54 days) -0,015 -0,020 -0,025 -0,030 0,0E+00 1,0E+06 2,0E+06 3,0E+06 4,0E+06 5,0E+06 number of cycles Micro-vibration test result on Ag-Spring contact system 17 Confidential Contents Basics of electrical spring contacts Micro-vibration Temperature cycling Industrial atmosphere Shock & Vibration 18 Confidential Temperature cycling of contact system Experimental parameters • Temperature cycling test: -40°C to +125°C • During T-cycling: no current load on contacts • Rc test: 10mA, 5V voltage limitation in open circuit • Testing current over a pair of spring pins • Rc limit: 400m per pair of spring pins (after 100 cycles) I V FR4 PCB Rc1 Rc4 SnPb K88 Ag plated Initial R depends on • Rc of 4 pressure contacts • current paths Rc2 DBC Al Rc3 Cu Al2O3 General set-up of TC contact resistance tests 19 Confidential Temperature cycling of contact system MiniSKiiP II. Generation / PCB SnPb 500 Standard Lead PCB 450 #1 #2 Specification limit #3 #4 400 delta Rc / mOhm #5 #6 350 300 250 200 150 100 50 MA 040435 0 0 20 40 60 80 100 120 140 160 180 200 number of temperature cycles Temperature cycling results for contact resistance tests 20 Confidential Temperature cycling of contact system MiniSKiiP II. Generation / PCB Ni/Au flash 500 RoHS compatible 450 #0 #7 #8 #9 #10 #11 #12 Specification limit delta Rc / mOhm 400 350 300 250 C 200 150 100 50 MA 040435 0 0 20 40 60 80 100 120 140 160 180 200 number of temperature cycles Temperature cycling results for contact resistance tests 21 Confidential Temperature cycling of contact system MiniSKiiP II. Generation / different PCBs 500 050566 1 Chem. Sn PCB 450 Specification limit 2 Chem. Sn PCB R [m] 400 1 Ni/Au-flash PCB 350 2 Ni/Au-flash PCB 300 1 HAL Sn PCB 2 HAL Sn PCB 250 1 HAL SnPb PCB 200 2 HAL SnPb PCB 150 100 50 0 0 50 100 150 200 250 number of temperture cycles Temperature cycling results for contact resistance tests 22 Confidential Contents Basics of electrical spring contacts Micro-vibration Temperature cycling Industrial atmosphere Shock & Vibration 23 Confidential Industrial atmosphere ISA-S71.04-1985 Standard: Environmental Conditions for Process Measurement and Control Systems: Airborne Contaminants There are four classes of industrial atmospheres with respect to copper reactivity. G1 – Mild An environment sufficiently well-controlled such that corrosion is not a factor in determining equipment reliability. G2 – Moderate An environment in which the effects of corrosion are measurable and may be a factor in determining equipment reliability. G3 – Harsh An environment in which there is a high probability that corrosive attack will occur. These harsh levels should prompt further evaluation resulting in environmental controls or specially designed and packed equipment. GX – Severe An environment in which only specially designed and packaged equipment would be expected to survive. Specifications for equipment in this class are a matter of negotiations between user and supplier. Corrosive Atmosphere Test Conditions condition unit H2 S NO2 Cl2 SO2 T RH duration [ppm] [ppm] [ppm] [ppm] [°C] % days ISA-S71.04 class GX DIN EN 60068-2- IEC 60068- IEC 60068- SEMIKRON test 60 Ke 2-43 2-42 method 3 Kd Kc conditions >0.05 >1.25 >0.1 >0.3 25 <50% 0.1 0.2 0.02 10-15 30 75 21 25 75 10 25 25 75 10 0.4 0.5 0.1 0.4 25 75 21 EN 60721-3-3 class 3C2 0.36 0.53 0.1 0.38 Corrosive atmosphere conditions 24 Industrial atmosphere Confidential IEC 60068-2-43 Atmosphere: 10 ppm H2S Temperature: 25°C Relative humidity: 75 % Volume flow: >volume*3/h Duration: 10 days No current load during storage SEMiX with HAL SnPb PCB in industrial atmosphere 25 Confidential Industrial atmosphere Corrosive atmosphere results: IEC 60068-2-43 Module Rc [m] GT/ET GB/EB GT/ET GB/EB Module Rc [m] GT/ET GB/EB GT/ET GB/EB #1 #2 #3 #4 Rc before Rc after Rc before Rc after Rc before Rc after Rc before Rc after [m] [m] [m] [m] [m] [m] [m] [m] 219 222 218 221 230 236 225 217 248 247 251 268 225 232 230 236 3 3 6 -8 -1 17 7 6 #5 #6 #7 #8 Rc before Rc after Rc before Rc after Rc before Rc after Rc before Rc after [m] [m] [m] [m] [m] [m] [m] [m] 220 223 214 214 226 231 222 226 225 216 245 250 237 243 234 237 3 0 5 4 -9 5 6 3 Cu normal Cu normal Cu normal Ag normal Mass before Mass after Test Test [g] [g] 2,1528 2,164 2,2612 2,2721 2,1938 2,2044 35,544 35,5443 Mass Gain [%] 0,5203 0,4820 0,4832 0,0008 SEMiX with HAL SnPb PCB in industrial atmosphere 26 Industrial atmosphere Confidential SEMIKRON Test Conditions Atmosphere: 0.5 ppm NO2 0.4 ppm H2S 0.1 ppm Cl2 0.4 ppm NO2 Temperature: 25°C Relative humidity: 75 % Volume flow: >volume*3/h Duration: 21 days No current load during storage Corrosive atmosphere test: SEMIKRON Conditions 27 Confidential Industrial atmosphere Kontakt T1/T2 G1/Ex1 G2/Ex2 #1A Rc before Rc after [m] [m] 117,9 119,0 119,5 119,8 83,1 85,0 Rc [m] 1,11 0,22 1,86 #4A Rc before Rc after [m] [m] 98,8 100,8 102,3 102,7 87,4 88,6 Rc [m] 2,05 0,39 1,21 Kontakt T1/T2 G1/Ex1 G2/Ex2 #2A Rc before Rc after [m] [m] 127,6 129,4 117,8 118,4 92,5 93,0 Rc [m] 1,75 0,61 0,51 #5A Rc before Rc after [m] [m] 111,7 113,3 105,3 107,8 76,7 77,6 Rc [m] 1,66 2,5 0,94 Kontakt T1/T2 G1/Ex1 G2/Ex2 #3A Rc before Rc after [m] [m] 123,8 125,6 119,6 121,4 87,6 87,9 Rc [m] 1,83 1,76 0,27 #6A Rc before Rc after [m] [m] 99,0 101,0 98,8 100,8 90,4 94,4 Rc [m] 1,98 1,98 4,01 SEMiX with HAL SnPb PCB in industrial atmosphere 28 Confidential Contents Basics of electrical spring contacts Micro-vibration Temperature cycling Industrial atmosphere Shock & Vibration 29 Vibration & Shock on contact system Confidential Standard test conditions: Sinusoidal sweep 10 - 1000 Hz 10-12 Hz: constant amplitude = 17.5mm (pp) 12-1000 Hz: constant acceleration = 5g 1 Octave/min. 6:40 min per sweep 20 sweeps per axis 2:20 hrs per axis Vibration Test (external test lab) - Test conditions 30 Confidential Vibration & Shock on contact system Current Monitoring MV 200 10 100 10 100 DUT 1 - DUT 2 +12V 10 100 DUT n Contact Monitoring (detects contact breaks >1µs) Vibration test (external test lab) – Monitoring for contact break 31 Vibration & Shock on contact system Confidential No contact interruption >1µs detected Vibration test (external test lab) – Test results SEMiX 32 Vibration & Shock on contact system Confidential Vibration test (external test lab) – Test results MiniSKiiP 33 Vibration & Shock on contact system Confidential Standard test conditions: half-sinusoidal pulse peak acceleration 30g shock width 18ms 3 shocks in each direction (±x, ±y, ±z) 18 shocks in total Shock Test (external test lab) - Test conditions 34 Confidential Qualification of functional modules Typ: Name: SKiiP 26 NHB 065 V1 Parameter: Lechner Vormessung Schock und Vibration-Test MA: 03/08/26 Dat.: 17.10.2003 25°C statische Werte Nr. 37 37 37 37 37 37 37 37 Zweig IGBT 1 IGBT 3 IGBT 5 IGBT 2 IGBT 4 IGBT 6 D B+ Brake IC=1mA VGE = + 25V VGE = - 25V IC =50A IC = 25A VR = 612V VGE = VCE VCE = 0V VCE = 0V VGE = 15V VGE = 0V VGE = 0V VGE(th) 3,86 3,86 3,87 3,86 3,86 3,85 V V V V V V V IGES < 10 < 10 < 10 < 10 < 10 < 10 nA nA nA nA nA nA nA IGES < 10 < 10 < 10 < 10 < 10 < 10 nA nA nA nA nA nA nA 3,86 V < 10 nA < 10 nA Typ: V V V V V V V 1 V Name: SKiiP 26 NHB 065 V1 Parameter: VCEsat 2,15 2,14 2,16 2,05 2,07 2,09 3,00 2,16 VCERV 1,49 1,50 1,51 1,56 1,53 1,48 1,69 V V V V V V V V Lechner Nachmessung Schock und Vibration-Test ICES 3 2 3 2 2 2 1,6 1,1 V(BR)CES IR = 10 mA µA µA µA µA µA µA µA µA µA V(BR)CES 734 729 726 728 739 737 728 733 MA: 03/08/26 Dat.: 15.01.2004 V V V V V V V V V Nr. 37 37 37 37 37 37 37 37 Zweig IGBT 1 IGBT 3 IGBT 5 IGBT 2 IGBT 4 IGBT 6 D B+ Brake VGE = + 25V VGE = - 25V IC =50A IC = 25A VR = 612V V(BR)CES VGE = VCE VCE = 0V VCE = 0V VGE = 15V VGE = 0V VGE = 0V IR = 10 mA V V V V V V V IGES < 10 < 10 < 10 < 10 < 10 < 10 nA nA nA nA nA nA nA IGES < 10 < 10 < 10 < 10 < 10 < 10 nA nA nA nA nA nA nA VCEsat 2,37 2,40 2,36 2,36 2,42 2,39 3,88 V < 10 nA < 10 nA 2,43 V V V V V V V 1 V VCERV 1,59 1,63 1,62 1,73 1,69 1,64 1,83 V V V V V V V V ICES 4,6 4,6 4,2 3,9 3,7 3,8 1,1 0,4 µA µA µA µA µA µA µA µA µA V(BR)CES 733 735 728 736 743 737 728 740 in spec. ICES in spec. VGE(th) in spec. VCE(sat) in spec. 3.6kV o.k. Rth(j-h) not tested IC=1mA VGE(th) 3,88 3,88 3,89 3,88 3,88 3,86 IGES Viso 25°C statische Werte 6 devices tested (VF in spec.) V V V V V V V V V Vibration & shock test - Results MiniSKiiP® II 35 Confidential Thank You Very Much For Your Kind Attention 36