Transfer Calibration
LRT Training Center
Shaw Wang
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Theory of Operation
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All wafer locations throughout the system are defined as stations.
Each robot must be calibrated (“taught”) to each station.
Stations are typically defined by the wafer center at each location.
The wafer center position is defined by a radial (R) and theta (T) coordinate relative to
the robot being taught. The vertical position (Z or BTO) is defined relative to the robot
being taught. Which is typically defined as the wafer height that the wafer can freely
enter and exit the station.
Stations with multiple slots must define the number of slots (slot) and the pitch (p)
between the slots.
For stations not radially located from the robot center, the wafer path to and from the
station must also be defined (via points).
For stations which require mapping, map positions must also be defined. These
positions are typically defined with radial, theta and wrist coordinates.
Reference
– “Transfer Calibration procedure”, 202-012898-001 Rev G
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Transfer Calibration Fixtures
CDM (Control display module)
Dummy wafer (Carbon wafer)
Chamber fixture
Airlock fixture
ATM Aligner fixture
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Dynamic Alignment
FOUP fixture
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ATM arm position
Refer document:202-012898-001 version G
Transfer Calibration Fixtures
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System Block Diagram
Terminal
Server
ATM
Robot
Drive
ATM Robot
Controller
Motor Power
RS-232 Serial Cable
Signal Cable
(SIO 1)
(SIO 2)
Null Modem Cable
RS-232 Serial Cable
Aligner
VTM
Robot
24VDC Power
24VDC Power
ATM ROBOT COVER SWITCHES
LPM 1, LPM 2, LPM 3
Misc IO
VTM
Mother
Board
Aligner Window
Misc IO
A/L1 Window, A/L2 Window
Right Side Window (Bottom)
Right Side Window (Top) Newer Systems
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ATM Robot Cover Switches
A/L 2 Window
Right side Window
A/L 1 Window
Alinger
Window
Loadport Switch 1 ,2 & 3
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Station Numbering
ATM 2
Middle FOUP
ATM 3
Right FOUP
ATM 1
Left FOUP
ATM 7
Aligner
ATM 4
IMM
ATM 10
ATM 9
ATM / VTM 5
Right Airlock (2)
ATM 8
ATM / VTM 6
Left Airlock (1)
VTM 4
PM 4
VTM 1
PM 1
VTM 3
PM 3
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VTM 2
PM 2
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Wafer Flow
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Serial Processing
– Poly, Exelan
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Wafer Flow
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Parallel Processing
– Metal/Strip, Poly/Strip
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ATM Calibration
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Module station positions (R, T, Z) are taught by the user using the CDM and a fixture
that is placed in the module.
Intermediate points are defined by calculations based on the nominal positions.
– Intermediate points include via positions, map positions, & map via positions.
– Nominal points are based off of a defined home position.
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Constants are defined where possible and set based on nominal positions or values.
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VTM Calibration
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Module station positions (R, T, Z) are taught by the user using the CDM and a fixture
that is placed in the module.
Constants are defined were possible and set based on nominal positions or values.
Each VTM position is optimized using Dynamic Alignment (can be done at
atmosphere or vacuum)
– A wafer is perfectly centered in the station
• Wafer is centered either by a fixture (PM) or by the aligner (LL)
– Routine is run through system software to adjust the station
• The wafer is picked
• Dynamic Alignment reports a radial and theta offset (wafer center offset).
• Station position (R and T) is adjusted so that the arm and the wafer line up.
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Prepare the System
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2300 software ready.
ATM /VTM Robots had installed.
System must be leveled.
Robots and aligner had been setup.
Pin lifter calibrated.
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Leveling Procedure
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ATM Robot Leveling.
Aligner Leveling.
Airlock Buffer/Cool Station Leveling.
25 slots Buffer station Leveling.
LPM Installation and Leveling.
KLA Metrology Station Leveling.
VTM Robot End Effector Leveling for SCARA Arm.
ATM Robot vacuum switch set up.
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ATM/VTM Robots Calibration
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ATM-LPM.
ATM-KLA Metrology Station.
ATM-Airlocks.
ATM-Aligner.
ATM-Buffer/Cool station.
VTM-Airlocks.
VTM-PMs.
After finished all the station, do the ironman test.
– To identify the reliability of transfer.
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Diagnose\Iron Man
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Calibration Parameters
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Backup – WPS System
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WPS System
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Dynamic Alignment is a wafer location and centering algorithm used during wafer
transfer in the VTM. Dynamic Alignment uses two sensors on each facet to determine
the location of the wafer.
300mm Wafer
200mm use sensor 2 for wafer presence.
300mm use sensor 1 for wafer presence.
200mm Wafer
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WPS System
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200 mm System
Connect to Emitter
AL1 S1T
AL1 S1R
AL2 S1T
AL2 S1R
PM1 S1T
PM1 S1R
PM2 S1T
PM2 S1R
PM3 S1T
PM3 S1R
PM4 S1T
PM4 S1R
Connect to Detector
P2
P1
Sensor optical 1
Sensor optical 8
P4
P3
Sensor optical 2
Sensor optical 9
P6
P5
Sensor optical 3
AL2 S2T
AL2 S2R
PM1 S2T
PM1 S2R
PM2 S2T
PM2 S2R
WPS control
PCB
Sensor optical 10
P8
P7
Sensor optical 4
Sensor optical 11
P10
P9
Sensor optical 5
Sensor optical 12
P12
P11
Sensor optical 6
VTM
Mother PCB
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AL1 S2T
AL1 S2R
Sensor optical 7
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PM3 S2T
PM3 S2R
PM4 S2T
PM4 S2R
WPS System
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300mm System
Connect to Emitter
AL1 S3T
AL1 S3R
AL2 S3T
AL2 S3R
PM1 S3T
PM1 S3R
PM2 S3T
PM2 S3R
PM3 S3T
PM3 S3R
PM4 S3T
PM4 S3R
Connect to Detector
Sensor optical 7
P2
P1
Sensor optical 1
Sensor optical 8
P4
P3
Sensor optical 2
Sensor optical 9
P6
P5
Sensor optical 3
WPS control
PCB
Sensor optical 10
P8
P7
Sensor optical 4
Sensor optical 11
P10
P9
Sensor optical 5
Sensor optical 12
P12
P11
Sensor optical 6
VTM
Mother PCB
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AL1 S1T
AL1 S1T
AL2 S1T
AL2 S1R
PM1 S1T
PM1 S1R
PM2 S1T
PM2 S1R
PM3 S1T
PM3 S1R
PM4 S1T
PM4 S1R
WPS System
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Location
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Component
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Transducers
– 24 VDC to provide light source for fiberoptics
– Convert light energy into 5 VDC signal
– LEDs
• Green - DC Power ON
• Amber - OFF when Blocked
– Gain Adjustment - Factory Set
Center Finding
PCB
LEDs
Transducers
Gain Adjustment
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Component
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Detector
– Receive light if not blocked by wafer
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Emitter
– Send light
Emitter
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Detector
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DA function
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Theory of Operation
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DA function
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Theory of Operation
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