2014
Corporate
OVERVIEW
Presented to
------------------
INTRODUCTION
Engineering
Division
- PCB Layout
Routing Services
Library Services
- Mechanical Design
- Signal Integrity
Printed Circuit
Board Division
- Quick Turn
- High Mix Low Volume
- Medium to High Volume
- Single Sided
- Multilayer
- Metal Core
Component
Division
- High Speed I/O Connectors
- Push/Pull Connectors
- RJ45 W/ Magnetics
- USB, SATA, HDMI Connectors
- HDMI/USB Cable Assemblies
- Discrete Magnetic Products
- B2B Connectors
- AOC Assemblies
New
Technologies
Division
- MEMS
- E-Bike
- Battery Management
MILESTONES
Opened Fast Print North America
Invested in
Invested in
Magnetic, PalCELL and PalMEMS Divisions / 2012
merged Sitor / 2011
Suzhou (ZPW) Starts Production,
/ 2011
Corporation, PALWONN Group Established / 2010
Component Division Formally Established, Invested in
China Operation Center (COC) Formed / Began China PCB Production / 2001
Taiwan Operation Center (TOC) Formed / Began Taiwan PCB Production / 1999
N. & S. California Facility Established / 1993 / 1997
Taiwan Design Facility Established / 1988
1988
1993
2007
2011
/ 2013
2013
/ 2007
PALPILOT ALLIANCE PARTNERS
GLOBAL LOCATIONS
Corporate Offices / Design Center
Regional Sales Offices
PCB Manufacturing / Design Center
Connector Manufacturing
PalPilot Taiwan
Magnetic Manufacturing
NORTH AMERICA REVENUE / 2009-2013
Revenue Totals Based on all Combined PalPilot Business Units
110 US$ Million
100 US$ Million
90 US$ Million
80 US$ Million
70 US$ Million
60 US$ Million
*Projected
50 US$ Million
2009
2010
2011
2012
2013
2014*
GLOBAL REVENUE / 09-13
GLOBAL REVENUE / 2009-2013
Revenue Totals Based on Global Alliance Partners.
1200US$ Million
1000 US$ Million
800 US$ Million
600 US$ Million
PCB Design
400 US$ Million
Connector
200 US$ Million
PCB
0 US$ Million
2009
2010
2011
2012
2013
2014*
*Projected
Engineering
Division
PCB DESIGN SERVICES
- Full Project Place-and-Route
- Schematic Re-Capture
- 24-Hour Library Support
- Schematic Symbol Creation
- Footprint Creation
- IPC-7251/ IPC-7351
- JEDEC Standards
- Custom Land Pattern
- Z-axis Dimension
- 24-Hour Routing Services
- Constraint Rules Driven
- 100% Manual Hand Routing
- Multiple Shifts (24 hours / 7 days)
- Design Partitioning, Multiple Designers
- Valor Enterprise DFM Pre-Fabrication Check
HIGH-SPEED SIMULATION & LAB MEASUREMENT SERVICES
1. Signal Integrity
- Pre-layout
- Post-layout
2. Power Integrity
3. Verification and Measurement Lab
MECHANICAL ENGINEERING SERVICES
1. Industrial Design (ID)
2. Mechanical Design (MD)
3. Soft Tooling
4. Prototyping
5. Hard Tooling
Printed
Circuit Board
Division
MANUFACTURING DISCIPLINES
PALPILOT’S FACTORIES OFFER
- Quick Turn Around
5-10 days from Asia
- High Mix Low Volume (HMLV) Production
For Low and High technology PCB’s
- Medium Volume Production
1 -40 layer
- High Volume Production
1-40 Layer
- Single Sided PCB
- Metal Clad PCB
- IC Substrate
- High Density Interconnect (HDI)
- Flex and Rigid Flex
Proto-type, small, medium, and high volume production
PCB DIVISION
CAPABILITIES / RIGID PCB
-
Layers
1-40 (layers)
Max Board Size
24’’*24’’
Max Board Thickness
.250”
Min.Board Thickness
4 layers 16mil/ 6 layers 24mil/ 8
layers 40mil/ 10 layers 48mil/ 12~16 layers 63mil
Min.Line Width
3mil
Min.Line Space
3mil
Min.Hole Size
8mil/4mil (micro vias)
PTH Wall Thickness
1mil
PTH Dia.Tolerance
+3mil
NPTH Dia.Tolerance
+1mil
Hole Position Deviation
+2mil
Outline Tolerance
+4mil
S/M Pitch
4mil
Aspect Ratio
10:1
Thermal Shock
6×10sec@288℃
Warp and Twist
≤0.7%
Electric Strength
>1.3kv/mm
Peel Strength
1.4N/mm
Solder Mask Abrasion
>6H
Flammability
94V-0
Impedance Control
+/-7%
MATERIALS & SURFACE FINISH
MATERIALS
- FR-4
- High Tg FR-4
- Polyimide Materials
- High Speed Materials
- Low Loss Materials
- Mixed Dielectric Constructions
MATERIAL
SUPPLIERS
- Isola
- Sheng Yi
- Ventec
- Nelco
- Megtron
- Rogers
- Taconic
SURFACE
FINISHES
- Tin Lead
- Lead Free HASL
- Immersion Gold
- Immersion Silver
- OSP
- Flash Gold
- Selective Gold
- Immersion Tin
Components
Division
HIGH SPEED I/O CONNECTOR
Meet SFF Committee Specification & Fully MSA Compliant
nQSFP+
nSFP+
- nQSFP+ 100G/112G
25~28Gbps/Channel
- nSFP+ 25~28Gbps
Data Rate
QSFP+
- QSFP+ 40G~56G
- 10~14Gbps/Channel
- Press-Fit or Solder Tail
- Light Pipe
- Heat Sink
SFP+
- SFP+ 10~14Gbps
Data Rate
- Press-Fit or Solder Tail
- Light Pipe
- Heat Sink
SFP
- SFP 1~5Gbps Data Rate
- Press-Fit or Solder Tail
- Light Pipe
- Heat Sink
PUSH-PULL-LOCKING CIRCULAR CONNECTOR
Micro
Circular
- Flex-Pin Design with
Beryllium Copper material
- The best solution for resisting
vibration and shock
- Small contact size, 50 mil pitch
- Ø 0.27” outer housing with 12 contacts
- Tail options for pre-wired,
solder cup, and solid straight tail
Segment View
B-Series
Push-Pull
P Series
Push-Pull
- PSU or PEI plastic housing
- Peek insulator for
high performance
- Autoclave sterilization
& disinfection levels
- Tough-proof design
- Color identification
& Keying options
- Disposable types
-
Robust self-latch mechanism
DIP and Solder cup contacts
Error-proof keying options
Fully EMC protected
2 to 32 contact options
IP50
K Series
Push-Pull
-
Robust self-latch mechanism
DIP and Solder cup contacts
Error-proof keying options
Fully EMC protected
2 to 32 contact options
Water tight IP67 F0K/F1K/
F2K series
RJ45 W/MAGNETICS
Types
-
10/100/1000 Base-T
10GBase-T
RJ45 + USB Combo
PoE/PoE Plus with
Internal Diode Bridge
Packages
-
Single Port
Multiple Port
Stacked Port
Low Profile
Vertical
Custom Configurations
Optional Emi Tabs
Features
-
Integrated Magnetics
Tab Up or Tab Down
LED Color Options
Surge Protection
RoHS Compliant
DISCRETE MAGNETIC PRODUCTS
LAN
Modules
- 10/100/1000
Base-T LAN Magnetic
Discrete Modules
- PoE/PoE+ Modules
Inductors
-
Power
Signal
Energy Storage
Power Supply
Filters
- Signal Filtering
- Noise Filtering
- Power Supply
Common
Mode
Chokes
- Noise Suppression
- Power Supply
- Telecom
Transformers
-
Flyback
Coupling
Analog
RF
Switching
PoE/PoE+
T1/E1
USB, SATA & HDMI CONNECTORS
USB
-
USB 3.0
USB 2.0
USB Type A
USB Type B
USB Type AB
Mini USB
Micro USB
SATA
- SATA
- eSATA
- Micro SATA
HDMI
-
Type A (1.0 Spec)
Type B (1.0 Spec)
Type C (1.3 Spec)
Type D (1.4 Spec)
Type E (1.4 Spec)
Mini-HDMI
Micro-HDMI
BTB, FPC, RF & CUSTOMER MADE CONNECTOR & MEMORY CARD
BTB
Connector
- 0.4 Pitch. 0.8H/0.9H/
1.0H/1.5/H2.0H.
- 10 Pin~60 Pin
- Designed to
Prevent Tin Wicking
- Narrow Design to
Reduce Space for PCB
FPC
Connector
RF
Connector
- 0.3mm,0.5mm Pitch
- 1.2H/1.5H/2.5H Plug
1.0H
and Socket Series
- 6 Pin ~ 67 Pin
0.81/1.00/1.13/1.32
- Front and Backflip Lock
/1.37 Wire
Supports Insert
- Designed to
Molding Process for
Prevent Tin Wicking
Sealing
- Superior Solder Peg
- Strong Chamber for
Better Molding and
Mating Guide
Customer
Made
Connector
Memory
Card
- Plastic Cover
- 1.5/1.30H Push Pull Type
- Stamping Contact
Micro SD
- Insert Molding
- Locking Feature for the Design
Mechanical Structure - Anti Card Fast Eject Function
- Detection Switch Pin Attached
- Low Profile Sim Card
CABLE ASSEMBLY CAPABILITES
AOC
HDMI
56G QSFP + AOC
40G QSFP+AOC
10G SFP+AOC
HDMI + AOC
Hot Pluggable
Fiber to 100M
QSFP+MSA Compliant
Form Factor
- HDMI Compliant with
version 1.4a
- HMDI 19 Pin
Male to Male
- HDMI 19 Pin
Male to DVI-D
- Custom Design
- Low Noise
- High Volume
Manufacturing
Capabilities
-
USB
-
USB 2.0 A to B
USB 3.0 to 3.0
Low Noise
Custom Design
High Volume
Capabilities
- USB Committee
Member
LVDS
SATA
- Crimp Terminal
LVDS
- Housing LVDS
- SATA 7pin/
7+6pin/7+15pin/
RF
- Matches high
frequency
characteristics
- 1.2H/1.5H/2.5H
plug and socket
series
0.81/1.00/1.13/1.32
/1.37 wire
New
Technologies
Division
NEW TECHNOLOGIES
MEMS
- Micro-electro-mechanical systems
- LiGA/LIKE Process that enable us
to print micr-3D structures on a six
inch ceramic wafer
- Across Nano and Micro Technology
Battery
Management
E-BIKE
-
Light Weight Electrical Motor
e-Torc
E-Bike
E-wheelchair
Robotics
-
Scalable Smart Battery
BMS/Battery Monitoring Software
Custom Engineering Design
Co-Op Design
Form-fit to existing, using our
Lego-Technology
SOCIAL RESPONSIBILITY
- PalPilot involves itself supporting global disaster relief and
charitable causes.
-
PalPilot audits it’s manufacturing facilities & partners for
compliance to social standards that meet North American
OEM expectations. All facilities are certified or in the process
of being certified to OHSAS 18001 requirements.
“PalPilot is committed to adding value to all of our customer and business relationships, utilizing
the highest degree of ethical standards and integrity as our core value!”
— Eddy C. Niu, President & C.E.O
EMS CUSTOMERS
OEM CUSTOMERS
THANK
YOU