<IGBT Modules> CM300DY-24S HIGH POWER SWITCHING USE INSULATED TYPE Collector current IC .............….........................… 300A Collector-emitter voltage VCES ........................… 1 2 0 0 V Maximum junction temperature T j m a x ..................... 1 7 5 °C ●Flat base Type ●Copper base plate ●RoHS Directive compliant ●UL Recognized under UL1557, File E323585 dual switch (Half-Bridge) APPLICATION AC Motor Control, Motion/Servo Control, Power supply, etc. OUTLINE DRAWING & INTERNAL CONNECTION Dimension in mm INTERNAL CONNECTION Publication Date : February 2015 CMH-10486 Ver.1.5 0.5 to over 3 over 6 over Tolerance 3 ±0.2 to 6 ±0.3 to 30 ±0.5 30 to 120 ±0.8 over 120 to 400 ±1.2 1 Di1 C2E1 Tr2 E2 Di2 Tr1 C1 G1 E1 (Es1) Division of Dimension E2 G2 (Es2) Tolerance otherwise specified <IGBT Modules> CM300DY-24S HIGH POWER SWITCHING USE INSULATED TYPE MAXIMUM RATINGS (Tj=25 °C, unless otherwise specified) Rating Unit VCES Symbol Collector-emitter voltage G-E short-circuited 1200 V VGES Gate-emitter voltage C-E short-circuited ± 20 V IC Item Pt ot Pulse, Repetitive Total power dissipation IE (Note1) IERM (Note1) (Note2, 4) DC, TC=119 °C Collector current ICRM Conditions TC=25 °C DC Emitter current 300 (Note3) A 600 (Note2, 4) 2270 (Note2) W 300 Pulse, Repetitive (Note3) A 600 Visol Isolation voltage Terminals to base plate, RMS, f=60 Hz, AC 1 min 2500 Tj m ax Maximum junction temperature Instantaneous event (overload) 175 Tcmax Maximum case temperature (Note4) 125 V °C Tjop Operating junction temperature Continuous operation (under switching) -40 ~ +150 Tst g Storage temperature - -40 ~ +125 °C ELECTRICAL CHARACTERISTICS (T j =25 °C, unless otherwise specified) Symbol Item Limits Conditions Min. Typ. Max. Unit ICES Collector-emitter cut-off current VCE=VCES, G-E short-circuited - - 1.0 mA IGES Gate-emitter leakage current VGE=VGES, C-E short-circuited - - 0.5 μA V G E (t h ) Gate-emitter threshold voltage IC=30 mA, VCE=10 V 5.4 6.0 6.6 V IC=300 A, VGE=15 V, V C E sa t (Terminal) Collector-emitter saturation voltage V C E sa t (Chip) Cies Input capacitance Coes Output capacitance Cres Reverse transfer capacitance QG Gate charge td(on) Turn-on delay time tr Rise time td(off) Turn-off delay time tf Fall time T j =25 °C - 1.80 2.25 Refer to the figure of test circuit T j =125 °C - 2.00 - (Note5) T j =150 °C - 2.05 - IC=300 A, T j =25 °C - 1.70 2.15 VGE=15 V, T j =125 °C - 1.90 - (Note5) T j =150 °C - 1.95 - - - 30 - - 6.0 - - 0.5 - 700 - - - 800 - - 200 - - 600 VCE=10 V, G-E short-circuited VCC=600 V, IC=300 A, VGE=15 V VCC=600 V, IC=300 A, VGE=±15 V, RG=0 Ω, Inductive load - - 300 T j =25 °C - 1.85 2.30 Refer to the figure of test circuit T j =125 °C - 1.85 - (Note5) T j =150 °C - 1.85 - T j =25 °C - 1.70 2.15 G-E short-circuited, T j =125 °C - 1.70 - (Note5) T j =150 °C - 1.70 - IE=300 A, G-E short-circuited, VEC (Note.1) (Terminal) Emitter-collector voltage VEC (Note.1) (Chip) IE=300 A, V V nF nC ns V V trr (Note1) Reverse recovery time VCC=600 V, IE=300 A, VGE=±15 V, - - 300 ns Qrr (Note1) μC Reverse recovery charge RG=0 Ω, Inductive load - 16 - Eon Turn-on switching energy per pulse VCC=600 V, IC=IE=300 A, - 41 - E of f Turn-off switching energy per pulse VGE=±15 V, RG=0 Ω, - 32 - Err (Note1) mJ Reverse recovery energy per pulse T j =150 °C, Inductive load - 22 - mJ RCC'+EE' Internal lead resistance Main terminals -chip, per switch, T C =25 °C - - 0.9 mΩ rg Internal gate resistance Per switch - 6.5 - Ω Publication Date : February 2015 CMH-10486 Ver.1.5 2 <IGBT Modules> CM300DY-24S HIGH POWER SWITCHING USE INSULATED TYPE THERMAL RESISTANCE CHARACTERISTICS Symbol Rt h(j -c)Q Item Junction to case, per IGBT Thermal resistance Rt h(j -c)D Rt h(c-s) Limits Conditions Min. (Note4) Junction to case, per DIODE (Note4) Case to heat sink, per 1/2 module, Contact thermal resistance Thermal grease applied (Note4, 6) Typ. Max. Unit - - 66 K/kW - - 120 K/kW - 20 - K/kW MECHANICAL CHARACTERISTICS Symbol Mt Item Mounting torque Ms Typ. Max. Unit Main terminals M 6 screw 3.5 4.0 4.5 N·m M 6 screw 3.5 4.0 4.5 N·m - 400 - g -50 - +100 μm mass - ec Flatness of base plate On the centerline X, Y (Note7) -: Concave This product is compliant with the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) directive 2011/65/EU. Represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (DIODE). Junction temperature (T j ) should not increase beyond T j m a x rating. Pulse width and repetition rate should be such that the device junction temperature (T j ) dose not exceed T j m a x rating. temperature (TC) and heat sink temperature (T s ) are defined on the each surface (mounting side) of base plate and heat sink just under the chips. Refer to the figure of chip location. The heat sink thermal resistance should measure just under the chips. Pulse width and repetition rate should be such as to cause negligible temperature rise. Refer to the figure of test circuit. Typical value is measured by using thermally conductive grease of λ=0.9 W/(m·K). Base plate (mounting side) flatness measurement points (X, Y) are as follows of the following figure. +: Convex 5. 6. 7. Min. Mounting to heat sink m Note1. 2. 3. 4. Limits Conditions X Mounting side 3 mm Y Mounting side -: Concave Mounting side +: Convex RECOMMENDED OPERATING CONDITIONS Symbol VCC Item (DC) Supply voltage Conditions Applied across C1-E2 VGEon Gate (-emitter drive) voltage Applied across G1-Es1/G2-Es2 RG External gate resistance Per switch Publication Date : February 2015 CMH-10486 Ver.1.5 3 Limits Unit Min. Typ. Max. - 600 850 13.5 15.0 16.5 V 0 - 15 Ω V <IGBT Modules> CM300DY-24S HIGH POWER SWITCHING USE INSULATED TYPE CHIP LOCATION (Top view) Dimension in mm, tolerance: ±1 mm Tr1/Tr2: IGBT, Di1/Di2: DIODE TEST CIRCUIT C1 C1 VGE=15 V V G-E shortcircuited G1 IC G1 V Tr1 Di1 Di2 VEC test circuit 4 E2 Es2 E2 Es2 Tr2 IE G2 G2 V C E s a t test circuit Publication Date : February 2015 CMH-10486 Ver.1.5 G-E shortcircuited E2 Es2 E2 Es2 C2E1 C2E1 IC G2 V Es1 Es1 G-E shortcircuited VGE=15 V G2 G1 V C2E1 C2E1 G-E shortcircuited IE G-E shortcircuited G1 Es1 Es1 C1 C1 G-E shortcircuited <IGBT Modules> CM300DY-24S HIGH POWER SWITCHING USE INSULATED TYPE TEST CIRCUIT AND WAVEFORMS ~ ~ iE C1 vGE 90 % 0V IE + C2E1 iC VCC t 90 % RG 0 0A Irr vCE vGE -VGE G2 0.5×I r r 10% iC 0A tr Es2 td(on) E2 tf td(off) t Switching characteristics test circuit and waveforms t r r , Q r r test waveform iE iC iC ICM vCE trr ~ ~ Es1 +VGE Q r r =0.5×I r r ×t r r t Load G1 -VGE iE 0 VCC IEM vEC ICM VCC vCE VCC t 0A 0.1×ICM 0.1×VCC 0 0.1×VCC t 0.02×ICM 0 ti ti IGBT Turn-on switching energy IGBT Turn-off switching energy t 0V t ti DIODE Reverse recovery energy Turn-on / Turn-off switching energy and Reverse recovery energy test waveforms (Integral time instruction drawing) Publication Date : February 2015 CMH-10486 Ver.1.5 5 <IGBT Modules> CM300DY-24S HIGH POWER SWITCHING USE INSULATED TYPE PERFORMANCE CURVES OUTPUT CHARACTERISTICS (TYPICAL) COLLECTOR-EMITTER SATURATION VOLTAGE CHARACTERISTICS (TYPICAL) T j =25 °C (Chip) VGE=15 V VGE=20 V COLLECTOR-EMITTER SATURATION VOLTAGE VCEsat 13.5 V 12 V 15 V 500 COLLECTOR CURRENT IC (A) (V) 600 400 11 V 300 10 V 200 9V 100 0 0 2 4 6 8 COLLECTOR-EMITTER VOLTAGE 10 VCE T j =125 °C 3 T j =150 °C 2.5 2 T j =25 °C 1.5 1 0.5 0 0 100 (V) 300 400 500 600 FREE WHEELING DIODE FORWARD CHARACTERISTICS (TYPICAL) (Chip) G-E short-circuited 10 (Chip) 1000 8 IC=600 A EMITTER CURRENT IE (A) (V) COLLECTOR-EMITTER SATURATION VOLTAGE VCEsat 200 COLLECTOR CURRENT IC (A) COLLECTOR-EMITTER SATURATION VOLTAGE CHARACTERISTICS (TYPICAL) T j =25 °C (Chip) 3.5 IC=300 A 6 IC=120 A 4 T j =150 °C T j =125 °C 100 T j =25 °C 2 0 10 6 8 10 12 14 16 18 20 0 GATE-EMITTER VOLTAGE VGE (V) Publication Date : February 2015 CMH-10486 Ver.1.5 0.5 1 1.5 2 EMITTER-COLLECTOR VOLTAGE 6 2.5 VEC (V) 3 <IGBT Modules> CM300DY-24S HIGH POWER SWITCHING USE INSULATED TYPE PERFORMANCE CURVES HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCC=600 V, VGE=±15 V, RG=0 Ω, INDUCTIVE LOAD ---------------: T j =150 °C, - - - - -: T j =125 °C VCC=600 V, IC=300 A, VGE=±15 V, INDUCTIVE LOAD ---------------: T j =150 °C, - - - - -: T j =125 °C 1000 1000 10000 td(off) td(off), tf tr td(on), tr SWITCHING TIME tf 100 SWITCHING TIME 100 tr 1000 td(off) tf 10 10 10 100 1000 0.1 1 COLLECTOR CURRENT IC (A) 100 100 10 EXTERNAL GATE RESISTANCE RG (Ω) HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCC=600 V, VGE=±15 V, RG=0 Ω, INDUCTIVE LOAD, PER PULSE ---------------: T j =150 °C, - - - - -: T j =125 °C VCC=600 V, IC/IE=300 A, VGE=±15 V, INDUCTIVE LOAD, PER PULSE ---------------: T j =150 °C, - - - - -: T j =125 °C 100 SWITCHING TIME (ns) td(on) (ns) (ns) td(on) 100 SWITCHING ENERGY (mJ) Err 10 E off Eon 1 REVERSE RECOVERY ENERGY (mJ) SWITCHING ENERGY (mJ) REVERSE RECOVERY ENERGY (mJ) Eon E off Err 10 1 10 100 1000 0.01 COLLECTOR CURRENT IC (A) EMITTER CURRENT IE (A) Publication Date : February 2015 CMH-10486 Ver.1.5 0.1 1 EXTERNAL GATE RESISTANCE 7 10 RG 100 (Ω) <IGBT Modules> CM300DY-24S HIGH POWER SWITCHING USE INSULATED TYPE PERFORMANCE CURVES CAPACITANCE CHARACTERISTICS (TYPICAL) FREE WHEELING DIODE REVERSE RECOVERY CHARACTERISTICS (TYPICAL) VCC=600 V, VGE=±15 V, RG=0 Ω, INDUCTIVE LOAD ---------------: T j =150 °C, - - - - -: T j =125 °C G-E short-circuited, T j =25 °C 1000 100 Cies 10 CAPACITANCE (ns) (nF) trr Irr (A), t r r Coes 100 Irr 1 Cres 0.1 0.01 10 0.1 1 10 COLLECTOR-EMITTER VOLTAGE 100 VCE 10 (V) TRANSIENT THERMAL IMPEDANCE CHARACTERISTICS (MAXIMUM) V C C = 600 V, I C = 300 A, T j =25 °C Single pulse, TC=25°C R t h ( j - c )Q =66 K/kW, R t h (j - c ) D =120 K/kW NORMALIZED TRANSIENT THERMAL IMPEDANCE Z t h ( j - c ) GATE-EMITTER VOLTAGE VGE (V) 1000 GATE CHARGE CHARACTERISTICS (TYPICAL) 20 15 10 5 0 0 100 EMITTER CURRENT IE (A) 200 400 GATE CHARGE 600 QG 800 1000 (nC) Publication Date : February 2015 CMH-10486 Ver.1.5 1 0.1 0.01 0.001 0.00001 0.0001 0.001 0.01 TIME 8 (S) 0.1 1 10 <IGBT Modules> CM300DY-24S HIGH POWER SWITCHING USE INSULATED TYPE Keep safety first in your circuit designs! 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