Plastic Packages for Integrated Circuits
Thin Plastic Quad Flatpack Package with Top Exposed Pad (TQFP-TEP)
5
D1
Q64.10x10E
7
64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE WITH
TOP EXPOSED PAD (TQFP-TEP)
D1/2
ACD
SYMBOL
7
E1
D2 13
4X
NOM.
MAX
A
E1/2
5
MIN
0.20 H A-B D
E2 13
1.20
A1
0.05
A2
0.95
A
-H-
0.05
2
/ /
0.10 C
ccc
-C-
SIDE VIEW
SEE DETAIL "B"
4
D
1.00
12
1.05
12.00 BSC
4
D1
10.00 BSC
7, 8
D2
7.49 BSC
13
E
12.00 BSC
4
E1
10.00 BSC
7, 8
L
11/13°
0.15
D
E2
TOP VIEW
NOTES
7.49 BSC
0.45
13
0.60
N
64
e
0.50 BSC
0.75
b
0.17
0.22
0.27
b1
0.17
0.20
0.23
ccc
0.08
ddd
0.08
9
D/2
-D-
Rev. 1 7/11
3
NOTES:
-A-
3
4
E
-Be
3
E/2
N/4 TIPS
0.20 C A-B D
4X
SEE DETAIL "A"
8 PLACES
BOTTOM VIEW
0° MIN.
- 0.05 S
0.08/0.20 R.
DATUM
A2 PLANE
-HA1
0.08
R. MIN.
0.20 MIN.
0.25
0-7°
GAUGE PLANE
L
1.00 REF.
DETAIL "B"
ddd M C A -B S D S
9
b
WITH LEAD FINISH
1. All dimensions and tolerances per ANSI Y14.5-1982.
2. Datum plane -H- located at mold parting line and coincident with
lead, where lead exits plastic body at bottom of parting line.
3. Datums A-B and -D- to be determined at center line between
leads where leads exit plastic body at datum plane -H- .
4. To be determined at seating plane -C- .
5. Dimensions D1 and E1 do not include mold protrusion. Allowable
mold protrusion is 0.254 mm on D1 and E1 dimensions.
6. "N" is the total number of terminals.
7. These dimensions to be determined at datum plane -H- .
8. The top of package is smaller than the bottom of package by 0.15
millimeters.
9. Dimension b does not include dambar protrusion. allowable
dambar protrusion shall be 0.08mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius or the foot.
10. Controlling dimension: millimeter.
11. This outline conforms to jedec publication 95 registration
MS-026, variations ACB, ACC, ACD & ACE.
12. A1 is defined as the distance from the seating plane to the lowest
point of the package body.
13. Dimension D2 and E2 represent the size of the exposed pad.
14. Exposed pad shall be coplanar with bottom of package within 0.05.
15. JEDEC variation.
-A,B, OR De/2
3
b
3
0.09/0.16
0.09/0.20
9
-A,B, OR DBASE METAL
b1
1
DETAIL "A"