Package Outline Dimensions
SO-16
SEE DETAIL 'A'
D
E/2
X
E1/2
SO-16
Dim
Min
Max
Typ
A
-1.260
-A1
0.10
0.23
-A2
1.02
--b
0.31
0.51
-c
0.10
0.25
-D
9.80 10.00
-E
5.90
6.10
-E1
3.80
4.00
-e
1.27 BSC
h
0.15
0.25
0.20
L
0.40
1.27
-L1
1.04 REF
L2
0.25 BSC
R
0.07
--R1
0.07
--X
3.945 REF
Y
0.661 REF
θ
0°
8°
-θ1
5°
15°
-θ2
0°
--All Dimensions in mm
E
E1
h
Y
PIN 1
h
b
e
c
Ø0.760 Depth 0.050±0.02
01(8x)
A2
02
A1
R1
R
SEATING PLANE
A
GAUGE PLANE
SEATING PLANE
0
L
DETAIL 'A'
L2
L1
Suggested Pad Layout
SO-16
X1
Dimensions
Y
X
C
X
X1
Y
Y1
Value
(in mm)
1.270
0.670
9.560
1.450
6.400
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
2015-10-30
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Package Outline Dimensions
Suggested Pad Layout
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