Plastic Packages for Integrated Circuits
Package Outline Drawing
Q48.7x7B
48 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE
Rev 2, 7/10
9.0±0.20
4 5
7.0±0.10
D 3
A
3
7.0±0.10
9.0±0.20
4
5
4.00±0.1
0.50
B
3
TOP VIEW
EXPOSED PAD
4.00±0.1
1.20 MAX
11/13°
C
BOTTOM VIEW
0.08
0° MIN.
SEE DETAIL "A"
0.08 M C A-B D
H
0.17/0.27
WITH LEAD FINISH
7
0.09/0.20
0.09/0.16
2
1.00 ±0.05
0.05/0.15
0.25
GAUGE
PLANE
0.60 ±0.15
0-7°
0.20 MIN.
0.17/0.23
(1.00)
BASE METAL
DETAIL "A"
(10.00)
(0.28) TYP
NOTES:
1. All dimensioning and tolerancing conform to ANSI Y14.5-1982.
2. Datum plane H located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting line.
(10.00)
(4.00)
3. Datums A-B and D to be determined at centerline between
leads where leads exit plastic body at datum plane H.
4. Dimensions do not include mold protrusion. Allowable mold
protrusion is 0.254mm on D1 and E1 dimensions.
5. These dimensions to be determined at datum plane H.
(1.50) TYP
6. Package top dimensions are smaller than bottom dimensions
and top of package will not overhang bottom of package.
7. Dimension does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm total at maximum material
condition. Dambar cannot be located on the lower radius or
the foot.
8. Controlling dimension: millimeter.
(4.00)
TYPICAL RECOMMENDED LAND PATTERN
1
9. This outline conforms to JEDEC publication 95 registration
MS-026, variation ABC-HD.
10. Dimensions in ( ) are for reference only.