MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
48 LEAD LQFP, 7x7, 0.5P
CASE 932AA−01
ISSUE A
SCALE 2:1
DATE 13 OCT 2008
4X
0.2 Y T-U Z
D
PIN 1
CORNER
D/2
Z
48
1
36
5
T
e/2
DETAIL K
37
U
G
E
G
E1
E/2
E1/2
12
T, U, Z
25
DETAIL K
NOTE 9
13
24
D1/2
D1
4X
BASE METAL
0.2 H T-U Z
PLATING
DETAIL F
H
0.08 Y
e/2
Y
44 X
48 X
e
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DATUM PLANE H IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE H.
5. DIMENSIONS D AND E TO BE DETERMINED AT
SEATING PLANE Y.
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS D1 AND E1 DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE H.
7. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE b DIMENSION TO EXCEED 0.350.
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
c1 c
b1
b
b
SEATING
PLANE
0.08
M
Y T-U Z
SECTION G−G
q1
TOP & BOTTOM
DIM
A
A1
A2
b
b1
c
c1
D
D1
e
E
E1
L
L1
R
S
q
q1
GENERIC
MARKING DIAGRAM*
R
XXXXXXXX
XXXXXXXX
AWLYYWWG
A A2
1
(S)
A1
DETAIL F
MILLIMETERS
MIN
MAX
1.4
1.6
0.05
0.15
1.35
1.45
0.17
0.27
0.17
0.23
0.09
0.20
0.09
0.16
9.0 BSC
7.0 BSC
0.5 BSC
9.0 BSC
7.0 BSC
0.5
0.7
1.0 REF
0.15
0.25
0.2 REF
1_
5_
12 REF
L
(L1)
0.250
q
GAUGE PLANE
XXXXX
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
DOCUMENT NUMBER:
98AON13058D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD: JEDEC
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
48 LEAD LQFP 7X7X1.4, 0.5 PITCH
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON13058D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY N. LIPAT
12 AUG 2003
A
CORRECTED DIMENSION D1 REFERENCES IN TOP VIEW. REQ. BY S. KANEDA.
13 OCT 2008
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2008
October, 2008 − Rev. 01A
Case Outline Number:
932AA