4/1/2008 Lecture 17 OUTLINE • NMOSFET in ON state (cont’d) – Body effect – Channel‐length modulation – Velocity saturation • NMOSFET in OFF state • MOSFET models • PMOSFET • Reading: Finish Chap. 6 EE105 Spring 2008 Lecture 17, Slide 1 Prof. Wu, UC Berkeley Body Effect Example VTH = VTH 0 + γ where γ = ( 2ϕB + VSB − 2ϕ B 2qN Aε Si Cox ) Example: Typical values γ ~ 0.5 ϕ B = 0.48V for N A = 1018 cm−3 (substrate doping) A substrate bias of VSB = 1V produce a VTH shift of 0.2V EE105 Spring 2008 EE105 Fall 2007 Lecture 17, Slide 2 Prof. Wu, UC Berkeley 1 4/1/2008 Channel‐Length Modulation • The pinch‐off point moves toward the source as VDS increases. Æ The length of the inversion‐layer channel becomes shorter with increasing VDS. Æ ID increases (slightly) with increasing VDS in the saturation region of operation. I Dsat ∝ 1 1 ⎛ ΔL ⎞ ≅ ⎜1 + ⎟ L − ΔL L ⎝ L ⎠ ΔL ∝ (VDS − VDSsat ) 1 W 2 μnCox (VGS − VTH ) ⎡⎣1 + λ (VDS − VD , sat ) ⎤⎦ 2 L λ: channel length modulation coefficient 1 W 2 * Note: in Razavi: I D , sat = μ nCox (VGS − VTH ) [1 + λVDS ] 2 L I D , sat = EE105 Spring 2008 Lecture 17, Slide 3 Prof. Wu, UC Berkeley λ and L • The effect of channel‐length modulation is less for a long‐ channel MOSFET than for a short‐channel MOSFET. λ∝ EE105 Spring 2008 EE105 Fall 2007 1 ⇒ short channel MOSFET has larger λ L Lecture 17, Slide 4 Prof. Wu, UC Berkeley 2 4/1/2008 Velocity Saturation • In state‐of‐the‐art MOSFETs, the channel is very short (<0.1μm); hence the lateral electric field is very high and carrier drift velocities can reach their saturation levels. – The electric field magnitude at which the carrier velocity saturates is Esat. v Saturation Velocity: vsat E Drift velocity: v = μ E Slope = μ EE105 Spring 2008 ⎧8 ×106 cm/s for electrons in Si vsat = ⎨ 6 ⎩ 6 × 10 cm/s for holes in Si ⎧⎪ NMOS: μ n ≈ 250 cm 2 /V-s ⇒ Esat ≈ 30, 000 V/cm ⎨ 2 /V-ss ⇒ Esat ≈ 80 80, 000 V/cm ⎪⎩PMOS: μn ≈ 80 cm /V For L = 0.1 μ m ⎧⎪VD , sat = 0.3 V for NMOS ⎨ ⎪⎩VD , sat = 0.8 V for PMOS Lecture 17, Slide 5 Prof. Wu, UC Berkeley Impact of Velocity Saturation • Recall that I D = WQinv ( y )v( y ) • If VDS > Esat×L, the carrier velocity will saturate and hence the drain current will saturate: I D, sat = WQinvvsat = WCox (VGS − VTH )vsat • ID,sat is proportional to VGS–VTH rather than (VGS – VTH)2 • ID,sat is not dependent on L is not dependent on L • ID,sat is dependent on W EE105 Spring 2008 EE105 Fall 2007 Lecture 17, Slide 6 Prof. Wu, UC Berkeley 3 4/1/2008 Short‐Channel MOSFET ID‐VDS P. Bai et al. (Intel Corp.), Int’l Electron Devices Meeting, 2004. • ID,sat is proportional to VGS‐VTH rather than (VGS‐VTH)2 • VD,sat is smaller than VGS‐VTH • Channel‐length modulation is apparent (?) EE105 Spring 2008 Lecture 17, Slide 7 Prof. Wu, UC Berkeley Drain Induced Barrier Lowering (DIBL) • In a short‐channel MOSFET, the source & drain regions each “support” a significant fraction of the total channel depletion charge Qdep×W×L g Æ VTH is lower than for a long‐channel MOSFET DIBL Injection Barrier Source ShortChannel LongChannel -qVDS Drain Drain • As As the drain voltage increases, the reverse bias on the body‐drain PN the drain voltage increases the reverse bias on the body drain PN junction increases, and hence the drain depletion region widens. ÆVTH decreases with increasing drain bias. (The barrier to carrier diffusion from the source into the channel is reduced.) Æ ID increases with increasing drain bias. EE105 Spring 2008 EE105 Fall 2007 Lecture 17, Slide 8 Prof. Wu, UC Berkeley 4 4/1/2008 NMOSFET in OFF State • We had previously assumed that there is no channel current when VGS < VTH. This is incorrect! • As V As VGS is reduced below V is reduced below VTH (towards 0 V), the potential barrier to (towards 0 V) the potential barrier to carrier diffusion from the source into the channel is increased. ID becomes limited by carrier diffusion into the channel, rather than by carrier drift through the channel. (This is similar to the case of a PN junction diode!) ÆID varies exponentially with the potential barrier height at the source which varies directly with the channel potential source, which varies directly with the channel potential. EE105 Spring 2008 Lecture 17, Slide 9 Prof. Wu, UC Berkeley Sub‐Threshold Leakage Current • Recall that, in the depletion (sub‐threshold) region of operation, the channel potential is capacitively coupled to the gate potential. c a ge gate o tage ( GS)) results in a change in channel esu ts a c a ge c a e A change in gate voltage (ΔV voltage (ΔVCS): ⎛ Cox ΔVCS = ΔVGS × ⎜ ⎜C +C dep ⎝ ox ⎞ Cdep >1 ⎟⎟ ≡ ΔVGS / m ; m = 1 + Cox ⎠ • Therefore, the sub‐threshold current (ID,subth) decreases exponentially with linearly decreasing VGS/m ID l (ID) log Sub-threshold swing: −1 VTH EE105 Spring 2008 EE105 Fall 2007 VGS VTH VGS Lecture 17, Slide 10 ⎛ d (log10 I DS ) ⎞ S ≡⎜ ⎟ dVGS ⎝ ⎠ S = mVT ln(10) > 60mV/dec Prof. Wu, UC Berkeley 5 4/1/2008 Short‐Channel MOSFET ID‐VGS P. Bai et al. (Intel Corp.), Int’l Electron Devices Meeting, g, 2004. EE105 Spring 2008 Lecture 17, Slide 11 Prof. Wu, UC Berkeley VTH Design Trade‐Off • Low VTH is desirable for high ON‐state current: 1 < η < 2 ID,sat ∝ (VDD ‐ VTH)η • But high VTH is needed for low OFF‐state current: log ID Low VTH ÆVTH cannot be reduced aggressively aggressively. High VTH IOFF,low VTH IOFF,high VTH 0 EE105 Spring 2008 EE105 Fall 2007 VGS Lecture 17, Slide 12 Prof. Wu, UC Berkeley 6 4/1/2008 MOSFET Large‐Signal Models (VGS > VTH) • Depending on the value of VDS, the MOSFET can be represented with different large‐signal models. VDS << 2(VGS-VTH) RON = 1 W μ nCox (VGS − VTH ) L Triode Region Saturation Region VDS < VD,sat VDS > VD,sat I D,tri = μnCox EE105 Spring 2008 V ⎤ W⎡ (VGS −VTH ) − DS ⎥VDS L ⎢⎣ 2⎦ 1 W 2 ID,sat = μnCox (VGS −VTH) [1+λ(VDS −VD,sat)] 2 L or ID,sat = vsatWCox(VGS −VTH)[1+λ(VDS −VD,sat)] Lecture 17, Slide 13 Prof. Wu, UC Berkeley MOSFET Transconductance, gm • Transconductance (gm) is a measure of how much the drain current changes when the gate voltage changes. gm ≡ ∂I D ∂VGS • For amplifier applications, the MOSFET is usually operating in the saturation region. – For a long‐channel MOSFET: g m = μn Cox { } W 2I D (VGS − VTH ) 1 + λ (VDS − VD, sat ) = L VGS − VTH – For a short‐channel MOSFET: { } g m = vsatWCox 1 + λ (VDS − VD , sat ) = EE105 Spring 2008 EE105 Fall 2007 Lecture 17, Slide 14 ID VGS − VTH Prof. Wu, UC Berkeley 7 4/1/2008 MOSFET Small‐Signal Model (Saturation Region of Operation) • The effect of channel‐length modulation or DIBL (which cause ID to increase linearly with VDS) is modeled by the transistor output resistance ro. output resistance, r ro ≡ EE105 Spring 2008 ∂V DS 1 ≈ λI D ∂I D Lecture 17, Slide 15 Prof. Wu, UC Berkeley Derivation of Small‐Signal Model (Long‐Channel MOSFET, Saturation Region) 1 W 2 I D = μnCox (VGS − VTH ) ⎡⎣1 + λ (VDS − VD,sat ) ⎤⎦ 2 L ∂I ∂I ∂I 1 id = D vgs + D vbs + D vds ≡ gmvgs + gmbvbs + vds ∂VGS ∂VBS ∂VDS ro gmvgs gmbvbs id vgs EE105 Spring 2008 EE105 Fall 2007 Lecture 17, Slide 16 Prof. Wu, UC Berkeley 8 4/1/2008 PMOS Transistor • A p‐channel MOSFET behaves similarly to an n‐channel MOSFET, except the polarities for ID and VGS are reversed. Circuit symbol S h Schematic ti cross-section ti • The small‐signal model for a PMOSFET is the same as that for an NMOSFET. – The values of gm and ro will be different for a PMOSFET vs. an NMOSFET, since mobility & saturation velocity are different for holes vs. electrons. EE105 Spring 2008 Lecture 17, Slide 17 Prof. Wu, UC Berkeley PMOS I‐V Equations 1 W μ pCox 2 L 1 W = μ p Cox 2 L Long Channel: I D ,tri = 2 ⎡⎣ 2 (VSG − VTH ) VDS − VDS ⎤⎦ DS ↔ SD GS ↔ SG 2 ⎡⎣ 2 ( VGS − VTH ) VDS − VDS ⎤⎦ 1 W 2 μ p Cox (VSG − VTH ) ⎡⎣1 + λ (VSD − VSD , sat ) ⎤⎦ 2 L 2 1 W = μ p Cox ( VGS − VTH ) ⎡1 + λ VDS − VD , sat ⎤ ⎣ ⎦ 2 L Short Channel: I D , sat = ( I D , sat = vsatWCox (VSG − VTH ) ⎡⎣1 + λ (VSD − VSD , sat ) ⎤⎦ ( ) ) = vsatWCox ( VSG − VTH ) ⎡1 + λ VDS − VD , sat ⎤ ⎣ ⎦ Note: VGS < 0, VDS < 0,VD , sat < 0,VTH < 0 in PMOS EE105 Spring 2008 EE105 Fall 2007 Lecture 17, Slide 18 Prof. Wu, UC Berkeley 9 4/1/2008 CMOS Technology • It possible to form deep n‐type regions (“well”) within a p‐type substrate to allow PMOSFETs and NMOSFETs to be co‐fabricated on a single substrate. • This is referred to as CMOS (“Complementary MOS”) technology. Schematic cross-section of CMOS devices EE105 Spring 2008 Lecture 17, Slide 19 Prof. Wu, UC Berkeley Comparison of BJT and MOSFET • The BJT can achieve much higher gm than a MOSFET, for a given bias current, due to its exponential I‐V characteristic. (Long-Channel) (Short-Channel) MOSFET Linear VGS > VDsat ; VDsat = Esat L VGS < VDsat EE105 Spring 2008 EE105 Fall 2007 Lecture 17, Slide 20 Prof. Wu, UC Berkeley 10