Nicholas Palumbo
Engineering Project
9/12/2012
Potential Project
Perform a thermal analysis of a power electronics module. Today’s increasing demand to cool
high power electronics has driven industry to innovative technologies through the development of
coldplates and heat pipes. Power density, efficiency, and reliability are of ultimate concern.
Certain applications favor different methods of cooling. My goal would be to perform a thermal
analysis of a power electronics module varying cooling method and application. A detailed
coldplate design, heatpipe design and electronics packaging design based on the applications
initial parameters will allow me to obtain a strong background in thermal dynamics and piping
systems. In addition this project will allow me to expand my electrical knowledge of power
electronic circuitry, packaging, and heat dissipation.
Involves:
-Electronic Circuitry
-Heat Transfer
-Natural Convection
-Forced Convection
-Pressure Drop
-Coldplate Design
-Heat Pipe Design
-Electronics packaging
-Thermodynamics