Foreign Language Math Science Social Science Business Engineering & Technology Arts & Humanities History Miscellaneous Standardized tests
  1. Engineering & Technology
  2. Electrical Engineering
  3. Microelectronics
On working with LKMs Using Linux Kernel Modules to
On working with LKMs Using Linux Kernel Modules to
On the Tradeoff Between Input Current Quality and Efficiency of High
On the Tradeoff Between Input Current Quality and Efficiency of High
ON THE SHOCKLEY–READ–HALL MODEL: GENERATION
ON THE SHOCKLEY–READ–HALL MODEL: GENERATION
On the Mechanism for Interface Trap Generation Stressing
On the Mechanism for Interface Trap Generation Stressing
on the analysis of (un)true root mean square measurement
on the analysis of (un)true root mean square measurement
on syllabus-1
on syllabus-1
On May 4, 2011, Intel Corporation announced what it called... most radical shift in semiconductor technology in 50 years.
On May 4, 2011, Intel Corporation announced what it called... most radical shift in semiconductor technology in 50 years.
On Implementation of MPEG-2 like Real-Time Cradle Architecture Ganesh Yadav
On Implementation of MPEG-2 like Real-Time Cradle Architecture Ganesh Yadav
On GPU Bus Power Reduction with 3D IC Technologies
On GPU Bus Power Reduction with 3D IC Technologies
On Data Forwarding in Deeply Pipelined Soft Processors ABSTRACT
On Data Forwarding in Deeply Pipelined Soft Processors ABSTRACT
On Backscattering and Mobility in Nanoscale Silicon MOSFETs Please share
On Backscattering and Mobility in Nanoscale Silicon MOSFETs Please share
Omirbek lab-4
Omirbek lab-4
OLF300ET: Extended Temperature High
OLF300ET: Extended Temperature High
OLEDs * Theory and Fabrication
OLEDs * Theory and Fabrication
older ups, newer it loads
older ups, newer it loads
OL2300 Fractional-N PLL based transmitter
OL2300 Fractional-N PLL based transmitter
OKI Advanced Array Processor (AAP) Hardware Description
OKI Advanced Array Processor (AAP) Hardware Description
OHMIC CONTACTS TO N-TYPE INDIUM PHOSPHIDE BY P
OHMIC CONTACTS TO N-TYPE INDIUM PHOSPHIDE BY P
Ohmic Contacts
Ohmic Contacts
PowerPCB Training Manual, Your First Design
PowerPCB Training Manual, Your First Design
PowerPAD™ Thermally Enhanced Package (Rev. G)
PowerPAD™ Thermally Enhanced Package (Rev. G)
PowerFLEX (TM) -- Surface-Mount Alternative for Through
PowerFLEX (TM) -- Surface-Mount Alternative for Through
PowerEdge R210 II
PowerEdge R210 II
Power4 system design for high reliability
Power4 system design for high reliability