Gallium Nitride (GaN) PHYS 571 Gugun Gunardi Heath Kersell Damilola Daramola Gallium Nitride (GaN) Introduction Properties Crystal Structure Bonding Type Application Introduction The next important semiconductor material after silicon. http://www.phy.mtu.edu/yap/images/g alliumnitride.jpg Can be operated at high temperatures. The key material for the next generation of high frequency and high power transistors. Wide band gap energy. Properties PROPERTY / MATERIAL . Structure Stability Cubic (Beta) GaN . Zinc Blende Meta-stable Lattice Parameter(s) at 300K 0.450 nm Density at 300K Nature of Energy Gap Eg 6.10 g.cm-3 Direct Energy Gap Eg at 293-1237 K Hexagonal (Alpha) GaN . Wurzite Stable a0 = 0.3189 nm c0 = 0.5185 nm 6.095 g.cm-3 Direct 3.556 - 9.9x10-4T2 / (T+600) eV Ching-Hua Su et al, 2002 Properties 3.44 eV 3.23 eV Ramirez-Flores et al 1994 Energy Gap Eg at 300 K . 3.25 eV Logothetidis et al 1994 Monemar 1974 . 3.45 eV Koide et al 1987 . 3.457 eV Ching-Hua Su et al, 2002 Energy Gap Eg at ca. 0 K 3.30 eV 3.50 eV Ramirez-Flores et al1994 Ploog et al 1995 Dingle et al 1971 Monemar 1974 Properties Comparison between Common Semiconductor Material Properties and GaN Hole Mobility (cm2/Vs) Critical Field Ec (V/cm) Thermal Conductivity sT (W/mK) Coefficient of Thermal Expansion (ppm/K) Material Bandgap (eV) Electron Mobility (cm2/Vs) InSb 0.17, D 77,000 850 1,000 18 5.37 InAs 0.354, D 44,000 500 40,000 27 4.52 GaSb 0.726, D 3,000 1,000 50,000 32 7.75 InP 1.344, D 5,400 200 500,000 68 4.6 GaAs 1.424, D 8500 400 400,000 55 5.73 GaN 3.44, D 900 10 3,000,000 110 (200 Film) 5.4-7.2 Ge 0.661, I 3,900 1,900 100,000 58 5.9 Si 1.12, I 1,400 450 300,000 130 2.6 GaP 2.26, I 250 150 1,000,000 110 4.65 SiC (3C, b) 2.36, I 300-900 10-30 1,300,000 700 2.77 SiC (6H, a) 2.86, I 330 - 400 75 2,400,000 700 5.12 SiC (4H, a) 3.25, I 700 3,180,000 700 5.12 C (diamond) 5.46-5.6, I 2,200 6,000,000 1,300 0.8 1,800 Crystal Structure GaN grown in ◦ Wurtzite crystal structure ◦ Zinc-blende crystal structure The band gap, Eg, effected by crystal structure Wurtzite Crystal Structure •Wurtzite crystal structure is a member of the hexagonal crystal system •The structure is closely related to the structure of hexagonal diamond. • Energy gap: 3.4 eV http://en.wikipedia.org/wiki/Image: Wurtzite-unit-cell-3D-balls.png Wurtzite Crystal Structure An ideal angle: 1090 Nearest neighbor: 19.5 nm Energetically favorable Several other compounds can take the wurtzite structure, including Agl, ZnO, CdS, CdSe, and other semiconductors. Zinc-blende Crystal Structure • Energy gap 3.2 eV • An ideal angle: 109.470 • Nearest neighbor: 19.5 nm http://en.wikipedia.org/wiki/Image:Sphaleriteunit-cell-depth-fade-3D-balls.png GaN Bonding Properties Tetrahedral bonds ◦ sp3 hybridization ◦ Bonding angle: 109.47° ◦ Bond Length: 19.5 nm Ga-N bonds significantly stronger than Ga-Ga interactions (based on distance) Ionicity •GaN exhibits mixed ionic-covalent bonding •Ionicity of a bond is the fraction fi of ionic character compared to the fraction of fh of covalent character •By Pauling’s definition •Modern definition • is the ionicity phase angle 1http://www.bcpl.net/~kdrews/bonding/bonding2.html GaN Bonding Properties Based on calculations using both methods, typical values are Compound Pauling ionicity Modern ionicity2 AlN 0.430 0.449 AlP 0.086 0.307 AlAs 0.061 0.274 GaN 0.387 0.500 GaP 0.061 0.327 GaAs 0.039 0.310 InN 0.345 0.578 InP 0.039 0.421 InAs 0.022 0.357 NaCl 0.668 > 0.9 C (Diamond) 0 0 Bond Character dependent on electronegativity χN >> χP > χAs > χSb 2J.C. Phillips, Bonds and Bands in Semiconductors 1973 GaN Bonding Properties • • Bonding strength determines energy gap size Large band gap evidence of strong bonding in GaN • Strongly Ionic Compounds (also insulators) LiF – 11eV; NaCl – 8.5eV; KBr – 7.5 eV • Other III-V compounds e.g. GaN GaP AlSb InP – – – – 3.2 eV/3.4 eV 2.3 eV 1.5 eV 1.3 eV Applications Gallium Nitride Typical Applications: New Kind of Nanotube Laser diodes High-resolution Printings Microwave radio-frequency power amplifiers Solar Cells New Kind of Nanotube • Single Crystal Nanotubes Fabricated • Gallium Nitride nanotubes have diameter between 30 – 200 nm • Potential for mimicking ion channels GaN Laser Diode Normally emit ultraviolet radiation Indium doping allows variation in band gap size Band gap energies range from 0.7eV – 3.4eV http://www.lbl.gov/ScienceArticles/Archive/assets/images/2002/Dec17-2002/indium_LED.jpg GaN Laser Diodes Applications in: ◦ ‘Blu-Ray’ technology ◦ Laser Printing http://www.aeropause.com/archives/Blu-raycover_plat.jpg GaN Solar Cells Indium doped (InGaN) Conversion of many wavelengths for energy Theoretical 70% maximum conversion rate. Multiple layers attain higher efficiency. Need many layers to attain 70% Lattice matching not an issue GaN Solar Cells Advantages: High heat capacity Resistant to effects of strong radiation High efficiency Difficulties: Too many crystal layers create system damaging stress Too expensive References http://www.reade.com/Products/Nitrides/Gallium-Nitride-(GaN)Powder-&-Crystals.html http://www.semiconductors.co.uk/nitrides.htm#GaN http://www.onr.navy.mil/sci_tech/31/312/ncsr/materials/gan.asp http://www.lbl.gov/Science-Articles/Archive/MSD-gallium-nitridenanotube.html http://www.lbl.gov/Science-Articles/Archive/MSD-full-spectrumsolar-cell.html http://www.lbl.gov/Science-Articles/Archive/blue-light-diodes.html http://www.ioffe.ru/SVA/NSM/Semicond/GaN/bandstr.html#Basic http://nsr.mij.mrs.org/4S1/G6.3/article.pdf http://nsr.mij.mrs.org/news/industapp97.html