Electronic Packaging
Master of Science in
Electronic Packaging
An Industry Perspective
For more information contact:
Donald C. Price, Ph.D., P.E.
Industry Professor of Mechanical Engineering
Director of Special Programs
Department of Mechanical Engineering
Southern Methodist University
214-768-xxxx (office)
dprice@smu.edu
Front page
Purpose of Electronic Packaging Program
SMU has revised the previous MS degree program
in Electronic Packaging in order to provide
complete instruction in the design, development,
and manufacture of electronic components and
systems. SMU believes that the electronics industry
requires engineers with multidisciplinary skills in the
fields of electronic materials science, mechanical
design, and thermal management. SMU seeks to
develop students uniquely able to contribute to the
growth of the electronics industry in the Dallas-Ft.
Worth area and around the world. We believe that
the electronics industry seeks to hire engineers with
a cross-disciplinary educational background,
possessing skills and capabilities in mechanical
modeling, mechanical design, and thermal design,
as well as an understanding of electronic materials
and material properties. To this end, we believe
that the program described in this brochure meets
that need.
Master of Science in Electronic Packaging
Distance Learning
All courses being taught in the Electronic Packaging
Program are being taught on-campus and across the
nation in the format of Distance Learning. Local students
may attend classes on campus or elect to receive DVDs
by mail and study the class material at any time that fits
within their busy schedules. Busy working professionals
can take advantage of this flexibility and convenience to
achieve an advanced education. Degree studies may
now be balanced against work priorities. It is easy to
communicate with professors via telephone, fax, and
email. The courses are offered via DVDs mailed to the
students following the classroom instruction. Lecture
notes are provided to the student via email attachment,
so that the notes are available when the student views
the DVD.
The degree program totals 30 semester credit hours (ten
3-hour courses) with no on-campus or thesis
requirement. The program is designed to further your
career goals and is ideally suited for military personnel,
whether stationed in the US or abroad. Additional
information may be found in the DANTES catalog or
online.
Admission Requirements
Bachelor of Science in one of the engineering
disciplines, or in a closely related scientific field
with a GPA of at least 3.00 on a 4.00 scale
Degree Requirements
Thirty (30) term-credit hours (TCH) with a minimum
GPA of 3.00 on a 4.00 scale
Completion of the required electronic packaging
core curriculum consisting of twelve (12) semester
hours in four 3-hour courses
Completion of electronic packaging electives
consisting of fifteen (15) semester hours in
five (5) 3-hour courses from a selection of eight (8)
courses
Completion of one 3-hour manufacturing elective
chosen from an approved list of three (3)
manufacturing courses
Suitable for Undergraduate Electives
Electronic Packaging Courses listed in this program
are suitable for undergraduate senior electives and
undergraduates are encouraged to enroll. Classes
are purposely scheduled so that they do not
interfere with other senior classes
Page 2
Core Courses
ME 5334-7334 - Fundamentals of Electronic Packaging
Introduction to microsystems packaging, electronic package design,
electronics reliability, thermal management, single- and multi-chip
modules, integrated circuit assembly, optoelectronics, RF
packaging, MEMs, and system-level PWB technologies.
ME 5342-7242 – Mechanical Engineering Aspects of Electronic
Packaging
Basics of heat transfer and fluid mechanics as applied to the
thermal design of electronic components and systems.
ME 5343-7343 – Electronic Packaging Materials
Overview of materials used in electronic packaging, solderability,
alloy selection, conducting polymer-matrix composites, metal films,
component encapsulation, measurement of electronic material
thermal properties, physical properties, manufacturing properties.
ME 5358-7358 – Design of Electronic Packaging
Basics of mechanical design and fundamentals of vibrations as
applied to the mechanical design of electronic components and
systems
ME 5190-7190 – Ethics in Engineering and Technology
This is a one-hour per week, non-credit, voluntary, seminar series
on ethical situations in engineering, science, technology, and
everyday life as an engineer in today’s society. A must for every
engineer or engineer-to-be in the Engineering School at SMU
Electronic Packaging Electives (Select five of seven)
ME 5314/7314 – Introduction to Microelectromechanical Systems and
Devices
Fundamentals of MEMS components, devices, and systems will be
covered
ME 5360/7360 – Electronic Product Design and Reliability
Sources of failure in electronic systems and failure modes and
mechanisms,.
ME 5359/7359 – Analysis and Design of Optoelectronic Packages
Optical fiber interconnections, packaging for high-density optical
back planes, selection of fiber technologies, semi-conductor laser
and optical amplifier packaging, optical characteristics, wave-guide
technologies, and optical alignment
ME 5335/7335 – Convective Cooling of Electronics
Application of convective principals to the cooling of natural- and
forced- convection heat sinks, fan and pump selection, piezoelectric
fans and micropumps, acoustic fan noise, augmentation of
convection heat transfer, including the establishment of Fanning ffactor and Colburn j-factor correlations for a variety of surfaces,
special convective techniques as spray cooling, jet-impingement
cooling, microchannel cooling, heat pipes, and capillary pumped
loops, pool- and flow-boiling, and electronic chassis with flow
through coldwalls and edge-cooled PWBs.
ME 5344/7344 – Conductive Cooling of Electronics
Application of conductive principals to the cooling of electronic
components and systems, covering such special topics as: contact
conductance, interface resistance, heat spreaders, thermal
interface materials, phase change materials (PCMs), and
thermoelectric devices. Applications of conduction to the cooling of
special electronic components, such as multi-chip modules, power
modules, high density power supplies, and printed wiring boards,
will be covered.
ME 5346/7346 – Application of Computational Techniques to the
Mechanical and Thermal Design of Electronic Systems
Mechanical and thermal performance of electronic devices and
systems evaluated through the use on computational techniques,
using commercial codes such as Icepak, TAS (Harvard Thermal),
MacroFlow, CLDPLT, HTEX, EVAPFIN, CONDFIN, and ANSYS.
Concepts of structural modeling of components mounted on printed
wiring boards in a vibrational environment will be featured.
ME 5384/7348 – Thermal, Fluid, and Mechanical Measurements in
Electronic Systems
Velocity, temperature, and pressure measurements, thermal
conductivity and thermal diffusivity measurements, heat flux
measurements, flow visualization techniques, characterization of
electronic components, experimental procedures used for vibration
and shock testing of electronic equipment.
Page 3
Manufacturing Elective (Select one of three)
ME 5-7354 – Total Quality Management in Manufacturing
Overall total quality management perspective for the
design of quality management systems. Managing product
quality from inception to deployment. Topics include
acquiring and stabilizing new production processes, data
collection and analysis for improvement and decision
making. Purchasing, process control, reliability are
covered Taguchi and other methods are examined as
tools for implementing TQM.
ME 5-7367 – Electronic Manufacturing Technology
Topics include an introduction to the electronics industry,
electronic components, the theory and methods of
manufacture of solid state devices, packaging techniques
such as wire bonding flip chip and TAB, printed wiring
board, soldering and solderability, leaded and surface
mounted components, electro-magnetic interference,
electrostatic discharge prevention, testability and
electronic stress screening.
ME 5-7368 – Project and Risk Management
Specific concepts, techniques and tools for managing
projects successfully. Network planning techniques,
resource allocation, models for multi-project scheduling,
methods of controlling costs, determining schedules and
performance parameters. The basics of risk management
including hard analysis, risk analysis, risk control, and risk
financing are covered. The focus of the course is to
integrate risk assessment with managerial decision
making. Examples and case studies are emphasized.
Additional Feature
ME 5150/7150 – Ethics in Engineering and Technology
(One-hour, non-credit, seminar series – voluntary, but
highly recommended)
Ethical issues, hard choices, and human failures will be
the focus of this class. Practical, ethical issues will be
described with examples from everyday life. Ethics in
technology issues, such as those encountered in the
Space Shuttle Challenger Disaster will be featured. Ethical
issues encountered in copyrights and intellectual property
issues will be discussed. The ethical issues of telephone
communications and email will be presented. Principles,
methods, and bases for ethical decision-making and
action will be discussed.
Page 4
Electronic Packaging Instructors
Kevin Cluff, Ph.D.
University of Maryland
Abbott Laboratories
Dallas, TX
Adjunct Professor of Mechanical Engineering
Mechanical Engineering Department
Southern Methodist University
Dallas, TX
Rod Pipinich, Dr. Engr., P.E.
Southern Methodist University
Lockheed Martin Aeronautics
Ft. Worth, TX
Adjunct Professor of Mechanical Engineering,
Southern Methodist University
Dallas, TX
Gemunu Happawana, Ph. D.
Purdue University
Assistant Professor of Mechanical Engineering
Mechanical Engineering Department
Southern Methodist University
Dallas, TX
Donald C. Price, Ph.D., P.E.
Oklahoma State University
Industry Professor of Mechanical Engineering
Director of Electronic Packaging Program
Southern Methodist University
Dallas, TX
David Nowacki, MBA and M.S. in Finance
Louisiana State University
DJN Investments
Dallas, TX
Adjunct Professor of Mechanical Engineering
Southern Methodist University
Dallas, TX
Nuraj I. Rajapakse, Ph.D.
Southern Methodist University
Lennox Industries, Inc.
Carrolton, TX
Adjunct Professor of Mechanical Engineering
Southern Methodist University
Dallas, TX
Electronic Packaging Curriculum Calendar of Offerings
Year
07
08
09
10
Semester
Sp Su Fall Sp Su Fall Sp Su Fall Sp Su Fall
Core Courses (four credit courses required / one non-credit seminar recommended)
Course Title
Instructor
ME 5358/7358 Vib of Elec Sys
Nuraj Rajapakse
X
X
X
X
ME 5343/7343 Elec Materials
Donald Price
X
X
X
X
ME 5342/7342 Th Design of Elec Sys
Donald Price
X
X
X
X
ME 5392/7392 Fund of Elec Pkg
Donald Price
X
X
X
X
ME 5150/7150 Ethics Seminar
Donald Price
X
X
X
X
Packaging Electives (select 5 of 7)
Course Title
Instructor
ME 5314/7314 MEMS
Kevin Cluff
X
X
ME 5359/7359 Optoelectronics Pkg
Gemunu Happawana
X
X
ME 5384/7384 Convective Cooling
Donald Price
X
X
X
X
ME 5385/7385 Conductive Cooling
Donald Price
X
X
X
X
ME 5394/7394 Computational Methods Donald Price
X
X
X
X
ME 5395/7395 Exp Measurements
Donald Price
X
X
X
X
ME 5360/7360 Mechanical Reliability
Donald Price
X
X
X
X
Manufacturing Elective (select 1 of 3)
Course Title
Instructor
ME 5363/7363 Elec Mfg Technology
Gemunu Happawana
X
X
X
ME 5354/7354 Total Quality Mgt in Mfg Kevin Cluff
X
X
ME 5368/7368 Proj and Risk Mgt
Rod Pipinich / David Nowacki
X
X
Page 5
Donald C. Price, Ph.D., P.E.
Director - Electronic Packaging Program
Donald C. Price, Ph.D., P.E. is Industry Professor of
Mechanical Engineering and Director of the Electronic
Packaging Program and the Manufacturing Systems
Management Program within the Mechanical
Engineering Department. Dr. Price was formerly a
Principal Engineering Fellow at Raytheon Electronic
Systems, a military electronics contractor. Dr. Price
has more than 32 years experience in the electronic
packaging industry.
Dr. Price received the BSME and MSME degrees from
Southern Methodist University and the PhD degree
from Oklahoma State University. Dr. Price served as
a member of the faculty of the Mechanical Engineering
Department at Southern Methodist University from
1965 to 1970 and left, as an Associate professor, for a
position in industry. While employed at Texas
Instruments and Raytheon, Dr. price served as an
Adjunct Professor from 1985 until 2006. In December
of 2006, Dr. Price retired from Raytheon and joined
the Mechanical Engineering Department at SMU on a
full-time basis.
While employed at Texas Instruments and Raytheon,
Dr. Price was responsible for the thermal
management of a wide range of Raytheon products,
including airborne missile systems, airborne- and
ground-based electro-optics systems, and phasedarray radar systems. This activity involved thermal
model simulations of military systems and the
computer-aided design of coldplates and heat
exchangers. The work also includes the thermal
design of airborne electronic pods cooled by vaporcycle or air-cycle refrigeration systems.
Dr. Price has been a member of a number of
University Industry Advisory Boards, including the
SMU Mechanical Engineering Department Board for
Knowledge, where he served as chair of the
curriculum committee. Dr. Price is a member of
several technical and professional societies: ASME,
IEEE, AIAA, IMAPS, TSPE, NSPE, and ASEE. The
ASME North Texas Section (NTS) Electronic and
Photonic Packaging Division (EPPD) selected Dr.
Price as Engineer-of-the-Year for 1997, and the ASME
NTS selected him as the Engineer-of-the-Year for
1998. The Dallas Chapter of the Texas Society of
Professional Engineers honored Dr. Price as
Engineer-of-the-Year for 2001-02. Dr. Price was
further honored as an ASME Fellow in 2002 and was
designated as an ASME Life Fellow in 2004. Dr. Price
served as Chairman of the ASME North Texas Section
Industry Advisory Board from to 2006.
Donald C. Price, Ph.D., P.E.
Director – Electronic Packaging
At the national level of ASME, he has been a
member of the K-16 Committee on Heat Transfer in
Electronic Systems since 1996. He served as ViceChair of this committee from 2000 to 2003 and as
Chair from 2003-05. Dr. Price has been a member
of the ASME Electronic and Photonic Packaging
Division (EPPD) since 1996. He became a
member of the EPPD Executive Committee in 2001
and served the executive committee as Secretary
from 2002-03, Treasurer from 2003-04, ViceChairman from 2004-05, and Chairman for 200506. Dr. Price served the ASME InterPack
Conference as a Session Chair in 1997, Thermal
Management Track Chair in 1999, Conference
Program Chair in 2001, and General Chair of the
conference in 2003. Dr. Price currently serves as a
technical reviewer for the ASME J. of Heat Transfer
and the ASME J. of Electronic Packaging.
As an employee of Raytheon, Dr. Price has been
issued five US patents and three foreign patents. In
addition, he is co-inventor of two US Patent
applications, which are currently pending. He has
published numerous technical papers in referred
journals and conference proceedings, and he has
made technical presentations at society
conferences. Dr. Price has made numerous
presentations on professionalism (Ten Keys to a
Successful Engineering Career) to a wide variety of
engineering and student groups. Dr. Price has been
married to his wife, Barbara, for almost 49 years,
and they consider themselves fortunate to have
been parents to four children and are most proud of
their seven grandchildren.
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