Introduction
• Background
– Executive Director of QPL in 1992.
– Co-founder of Compass Technology
Co,. Ltd..
– Executive Director since Oct, 1997 and
as CEO since June 2000
• Non-performer in school
Survey
What is your expectation as Start-ups?
Smooth Sailing
Roller Coaster
Company Profile
Company Profile
 Compass Technology Co., Ltd.
 Founded in June 11,1997.
 Area: HK-150,000ft2. (13,935m2)
China-21,528ft2. (2,000m2)
 Paid-up Capital-HK$429M. (USD 55M)
 Investor Base- Employee owned with
additional investment by blue chip Asian,
European VC Funds.
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GEMS
General Oriental Investments (HK) Ltd.
Temasek Holdings Ltd.
Value Partners.
Compass Technology
Business nature
 Manufacture state-of-the-art Semiconductor IC
packaging interconnect materials.
Application
 Flexible Substrates
( TCP, LCD Driver, Flip Chip, TBGA, mBGA,
m*BGA, CSP, MCM)
Capacity
 250,000 linear meters per month by year 2003
Manufacturing Quality System
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ISO 9002 - certified on Dec, 1999
ISO 14001- certified on Dec, 2000
ISO 9001- by Q3 2003
QS 9000 - by Q2 2004
State-of-the-art Production Line
Semiconductor IC packaging interconnect materials
Sample of Packaging Materials
Essence of a package
Compass
IC
SUBSTRATE
Printed Circuit Board
Chip
Substrate
1st level
interconnect
PCB
2nd level
interconnect
Source: Hong Kong University of Science & Technology
Semiconductor IC packaging interconnect materials
Function of Electronic Packaging
Essence of a package
Compass
IC
Packaging & Assembly
Chip protection
SUBSTRATE
Power distribution
Printed Circuit Board
Signal passage
Heat dissipation
Chip
Substrate
Geometry transformer
1st level
interconnect
PCB
2nd level
interconnect
Source: Hong Kong University of Science & Technology
Product Applications
• Communications
– Broadband
– Internet
– Wireless
– Network
– Multi-Media
– Cable Modems
– Cable Set-Top Boxes
– WAP Cellular Phone
– Switch Controllers
Product Applications
• Computer
– Laser printer
– Micro Processor
– Memory (Rambus, Flash)
• Consumer Electronics
– Digital Signal Processors
– Video Camcorder
– Digital Camera
Current Customer Base
Mitsui
I-Cube
EEMS
CARSEM
ASE
Direct Customers
Indirect Customers
Start up Experience in our business
Start up Experience
Corporate Responsibilities
Co-operative Education Scheme, CityU (協助教育計劃)
–
1 year on-the-job Training Program for under-graduates
Industrial Attachment Scheme, CityU (暑期就業計劃)
–
Summer Internship for under-graduates
Youth Work Experience and Training Scheme, Labour Dept.
(勞工處青少年就業計劃)
–
1 year training program for youth between 15 to 24
Selective Placement, Labour Dept. (勞工處展能就業計劃)
–
Recruitment of employees with physical disabilities
Production Technician Pre-Employment Training Scheme, ERB
(僱員再培訓局生產技術員再培訓計劃)
–
Training & recruitment Program for the unemployed
Youth Pre-Employment Scheme, Labour Dept. (勞工處展翅計劃)
–
6 months training & recruitment program for F.5 graduates.
Green company
1. ISO140001 certified
- Recycle the wasted material through recyclers.
- Reduce in consumption of office paper and
electricity.
- Provide training program to employee preserving
environment.
2.Gas filters incorporated on all machines
to prevent air pollution.
3.Certified Waste Water Treatment Plant
that meet Hong Kong Government EP
Regulations.
Technology Development Collaboration Programs with Universities
• City
University of Hong Kong
(EPA Center)
- Failure Analysis
- Reliability Testing
- Tape Substrate Functional Testing
• Hong
Kong Polytechnic University
(PCB Technology Transfer Unit)
- Via formation by UV YAG or CO2 laser drilling on blind and
through hole
- Laser drilling on 2metal & multi-layer PI substrates
Development
• Hong
Kong University of Science & Technology
(EPACK LAB)
- Material characterization & testing
- Research in advance engineering materials & technology
- Blind & through via hole metallization on 2 metal layer
substrate
Technology Development Collaboration Programs with Universities
‧ Xiamen University (China)
(Department of Chemistry & Institute of Physical Chemistry)
- Metal Finish Process Study and Development
- Plating Solution Analysis and Maintenance
‧ Georgia Tech (Package Research Center)
- Research and development in advance packaging
materials
(Material research & development for tape substrate) solder
resist - evaluate % cure under different thermal condition )
* Students exchange program with Georgia Tech to do
material research in polymers
* Current member of Package Research Center.
* Programs supported by HKSAR Applied Research Council.
Conclusion
“If you help enough people to get what
they want, you will get what you want.”