THERMAL CONDUCTION LABORATORY
Dr. E. Marotta
Department of Mechanical Engineering
Clemson University
Clemson, SC
THERMAL CONDUCTION LABORATORY
Agenda
• Research Areas
• Research Graduate Students
• Possible Research Topics - Honors
THERMAL CONDUCTION LABORATORY
Research Areas
•
•
•
•
Thermal Contact Conductance between Interfaces
Measurement of Thermophysical Properties of Materials
Thin Film Deposition via Sol-Gel Processes
Microscale Heat Transfer
THERMAL CONDUCTION LABORATORY:
Research Areas
Thermal Contact Conductance between Interfaces
• Measurement and Prediction of Thermal Interface Resistance
- High powered electronic packages
- Removal of the heat generated during normal operation
- Heat sinks are low cost means of increasing the surface area
- Dissipate the heat by means of convective air cooling
- Lowers the fluid-side thermal resistance but introduces interface resistance
THERMAL CONDUCTION LABORATORY:
Research Areas
Thermal Contact Conductance between Interfaces
• Measuring Thermal Interface
Resistance
- Ceramic Package - Aluminum
Heat Sink Assembly
THERMAL CONDUCTION LABORATORY:
Research Areas
Thermal Contact Conductance between Interfaces
• Measuring Thermal Interface
Resistance
- Contact Configurations
THERMAL CONDUCTION LABORATORY:
Research Areas
Thermal Contact Conductance between Interfaces
• Calculating Thermal Interface
Resistance
hj  hc  hg
m P 

hc  1.25 ks 
H
 c
0.95
hg 
kg
YM
THERMAL CONDUCTION LABORATORY:
Research Areas
Thermal Contact Conductance between Interfaces
• Measuring Thermal Interface
Resistance
- Interstitial material layers
- Elastomers or adhesive tapes
hj  hc,1 
t
kelast
 hc,2
THERMAL CONDUCTION LABORATORY:
Research Areas
Thermal Contact Conductance between Interfaces
High Powered Electronic Packages
- Removal of the heat generated
during normal operation
- Heat Sinks are low cost means of
increasing the surface area
- Dissipate the heat by means of
convective air cooling
THERMAL CONDUCTION LABORATORY:
Research Areas
Thermophysical Properties of Materials
• Measuring thermal properties:
- Thermal conductivity
- Thermal diffusivity
- Specific Heat, cp, of solids
- Directional thermal conductivity
Composite Materials
Ceramics (Bulk and Thin Films)
Polymers (Thin Films)
THERMAL CONDUCTION LABORATORY:
Research Areas
Thermophysical Properties of Materials
• Experimental facility
- TCC apparatus
THERMAL CONDUCTION LABORATORY:
Research Areas
Thermophysical Properties of Materials
• Experimental facility
- TCC apparatus
- Exploded View
THERMAL CONDUCTION LABORATORY:
Research Areas
Thin Film Deposition by Sol-Gel
•
•
•
•
Objective of the proposed research
program is to investigate solution
deposition process variables
Systems of single component or
multi-component species
Fundamental understanding of the
process-property relationships
inherent in the sol-gel fabrication
process
Impact the film’s thermophysical
characteristics
THERMAL CONDUCTION LABORATORY:
Research Areas
Thin Film Deposition by Sol-Gel
Microscale Heat Transfer
•
•
•
•
Typical structure of pyroelectric
infra-red detector
Elements with sol-gel deposited
PZT thin film fabricated by means
of micromachining
Electroceramic thin film such as
PZT is an especially important
material for thermal imaging
Heat conduction to the substrate
(acting as a heat sink) plays a key
role in the functionality of these
devices; Rb is very important
THERMAL CONDUCTION LABORATORY:
Research Areas
Thin Film Deposition by Sol-Gel
Microscale Heat Transfer
•
Laser Spectroscopy Technique
Film Thermal Conductivity
Interface Resistance, Rb
•
Interface Adhesion
Bond Strength
THERMAL CONDUCTION LABORATORY:
Graduate Students
Graduate Students
•
2
.
0
1
0
Jason Fuller, M.S.
-Modeling Metal-Polymers
Joint Thermal Resistance
Cristana Dita, Ph.D.
3
.
0
1
0
2
- Microscale Heat Transfer
Electroceramic Films
Sol-Gel Deposition
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THERMAL CONDUCTION LABORATORY:
Graduate Students
Research Topics
•
Thermal Contact Conductance
Ceramic Interfaces
Ceramic Thin Films
•
Thermal Contact Conductance
Periodic Contacts
Internal Combustion Engines
•
Sol-Gel Deposition
Electroceramic (PZT) Films
Thermophysical Properties