ECE 477 Design Review Team 01 Fall 2012 Brennan Tran Jonah Ben Kevin Ea Pluckebaum Meyer Outline • • • • • • • • • • Project overview Project-specific success criteria Block diagram Component selection rationale Packaging design Schematic and theory of operation PCB layout Software design/development status Project completion timeline Questions / discussion Project Overview • Interactive sound board • LED button matrix to receive input and display feedback • Adjust volume and BPM • Save and load configurations to flash • Save music sample to midi file on SD card • (Flash Application: Tone Matrix) Project-Specific Success Criteria • An ability to poll an array of pushbuttons to manipulate the musical configuration and display a visual pattern using LEDs. • An ability to output multi-tone audio. • An ability to adjust the volume and BPM of the output audio. • An ability to save and load musical configurations to and from flash memory. • An ability to save a configuration as a MIDI file to an SD card. Block Diagram Component Selection Rationale • Microcontroller: TM4C123GH6PM (Tiva C) – 80 MHz Operating Frequency – 256 KB Flash Memory – Floating Point Unit – 4 SPI Modules – 43 Max GPIO pins Component Selection Rationale • RGB LED Matrix – Multiple LED colors – Breakout boards for easy interface – SN74HC595 shift registers • 35 mA max source current • 22 mA constant current required for eight LEDs in parallel Component Selection Rationale • DAC8571 Digital-Analog Converter – I2C Interface for reduced pin count – 16 bit resolution (same as CD’s) • Amplifier – LM324 Quad Op Amp (1.5 gain) – LM4902 Audio Amplifier under consideration Component Selection Rationale • LM317M Adjustable Regulator – Simple for 5V voltage regulation – Over 500 mA output current • TPS73633 Low-Dropout Regulator – 400 mA output current – Fixed 3.3 output voltage Packaging Design • 23 x 33 x 10 cm (9 x 13 x 4 in) • RGB LED Matrix (8x8) • 2 Speakers • 1 LCD • 4 Pushbuttons • 2 Rotary Encoders Packaging Design • Reset Switch • Power Switch • SD Card Slot • Power Jack – 1.35 mm ID – 3.5 mm OD – 6.2 mm depth Schematic – Power Circuit Schematic – Microcontroller Schematic – LED Matrix Schematic – Button Matrix Schematic – Audio Circuit Schematic – LCD Schematic – Function Controls Schematic – SD Card PCB Layout PCB – Power Circuit PCB – Microcontroller PCB – Audio Circuit PCB – LED Matrix PCB – Button Matrix PCB – LCD Software Development Status • Utilizing Code Composer Studio to prototype with the TI Stellaris LaunchPad • Testing SPI using 74HC595 shift registers to output to LEDs • Interfacing DAC using I2C • Begin interfacing with flash memory • Outlined a flowchart for basic behavior Software Design – Flowchart Project Completion Timeline Part Ordering Schematic/PCB Software Development/Testing Peripheral Assembly/Testing PCB Soldering/Testing Packaging/Assembly Product Testing/Debugging Documentation 3/2/2014 3/12/2014 3/22/2014 4/1/2014 4/11/2014 4/21/2014 5/1/2014 Questions / Discussion