FUTURE NEEDS IN EMC OF ICS
ARE YOU HEARING THE
VOICE OF INDUSTRY?
Etienne SICARD
Professor
etienne.sicard@insa-toulouse.fr
INSA TOULOUSE - FRANCE
www.etienne-sicard.fr
www.ic-emc.org
TOULOUSE
Edinburgh
Home of Airbus A380
2850 Km
Home of Rugby (& INSA engineer)
Toulouse
Home of some past
EMC Compo’s
SUMMARY
I.
QUESTIONS ASKED
II.
CURRENT CHANGES
III.
CHALLENGES
IV.
OPPORTUNITIES
V.
THREATS
VI.
CONCLUSION
QUESTIONS ASKED
“Would be interested to give one of the keynote talks on
‘state of the industry’ such as current changes, challenges
and opportunities / threats to the EMC of ICs … or
generally related to that?”
Alistair
I would be pleased to accept the challenge, however
my experience and vision is mostly academic.
I suggest to contact ASAP industrial EMC VIP's and
compile their opinion about the very sensitive
questions you have listed.
Etienne
QUESTIONS ASKED
•
Email to a selection of
industrial colleagues
•
“Would you accept to send
me some keywords to feed
the following sections
1.
Current changes
2.
Challenges
3.
Opportunities
4.
Threats
•
Thank you… »
•
15 answers received
THE VOICES OF INDUSTRY
•
Jan Niehof, NXP Semiconductors
•
Frank Klotz, Infineon Tech. AG
•
Bernhard Weiss, AMS
•
Sebastien Serpaud, Nexio
•
Jean-Luc Levant, Atmel
•
Kieran Heffernan, Analog Devices
•
Frédéric Lafon, VALEO
•
Abhishek Ramanujan, Valeo
•
Erping LI, IHPC
•
Adil El Abazzi, Serma
•
Jounghuo Kim, KAIST
•
Olivier Maurice, IRSEEM
•
Sebastien Serpaud, NEXIO
•
Renaud Gillon, ON Semi
•
Hyun Ho PARK, Samsung
•
Christian Marot, Airbus Group
Innovation
THE VOICES OF INDUSTRY
OPERATING MODE
•
Regroup comments by
relevance
•
Add illustrations
•
Add some
explanations
« Let me introduce
the Industrial
Needs »
CURRENT CHANGES
DEPARTMENT OF ELECTRICAL &
COMPUTER ENGINEERING
CURRENT CHANGES
Industry
•
Meeting the Industrial 4.0 challenge : cyber-physics systems
Productivity, Efficiency, Safety, Connectivity
CURRENT CHANGES
Technology
•
Faster and faster memory
•
DDR4, LPDDR is on the market
•
DDR5, LPDDR5 is under development
DDR4: 250ps
Data Rate
per pin
(Gb/s)
We are Here
100 Gb/s
Mobile
Memory
3D
WideIO2
WideIO
2D
LPDDR4
10 Gb/s
LPDDR3
LPDDR2
DDR5
DDR4
DDR3
Laptop Memory
DDR2
LPDDR1
1 Gb/s
2010
2012
2014
2016
2018
2020
CURRENT CHANGES
Technology
•
2.5D high bandwidth and
high density DRAM with TSV
and Si Interposer
•
1 tera-bit/cm2 achieved 5
years ahead from roadmaps
We are Here
CURRENT CHANGES IN EMC OF ICS
Design
•
EMC concerns move from
system-level to IC-level
•
EMC/interference is taken
into account from the very
early design phases
•
Increased use of
simulation & modeling
•
Measurement should
(preferably ) only confirm a
good EMC modeling /
simulation work
Tools
DESIGN PHASE
System
Architecture
Guidelines
Models
System Design
EMC Simulations
Compliance ?
NO GO
GO
FABRICATION
EMC compliant
CURRENT CHANGES
Design
•
Reduction of external
components
•
Energy saving : low standby
and quiescent current
•
More Ios, more power pins
•
Integrated Voltage
Regulators
•
Switched-mode power
supply at faster speeds
CURRENT CHANGES IN EMC OF ICS
Internet of things
CURRENT CHANGES IN EMC OF ICS
Airplanes
•
Integrated Modular Avionics
architecture, cards and backplane
approach rather than electronic
boxes and rack
•
Context of very long life time
•
Obsolescence of components
•
Less weight
•
Lower cost
•
Safer
CURRENT CHANGES IN EMC OF ICS
Cars:
•
Semi, Automatic Drive Systems
•
Microcontrollers with medium-voltage (12V)
medium-power (1W) section for CAN
CURRENT CHANGES IN EMC OF ICS
Quad core
ARM Cortex
A15
Console quality gaming
4-channel DSP
Mobiles
•
•
Improved IC-level
system integration :
SiPs, SoCs, 3D-IC…
•
LTE, WiMax
China is the largest
Dual Image
Signal
Processing: face
detection, wide
dynamics,3D
4K mobile/TV display
producer of Mobile
devices world wide:
big EMC-IC demand
GPS, Glonass
BeiDou
satellite
constellations
in/outdoor
Capture
and play
back 4K
video
• 7.1
surround
sound
Sensor intensive
applications
Qualcomm Snapdragon
805 processor data sheet
CURRENT CHANGES IN EMC OF ICS
2,3,4,5G mobile frequencies
4G
800
Today
1 GHz
5G
700
Tomorrow
2-4G
1800
2-3G
900
5G
3600
5G
10 500
10 GHz
3G
1900
4G
2600
2 GHz
5G
17 000
5G
28 000
20 GHz
3 GHz
5G
38 000
30 GHz
CURRENT CHANGES IN EMC OF ICS
Costs
•
Pressure for cost reduction
•
EMC test costs increased
•
Late analysis of EMC
usually lead to extra costs
•
Off-the-shelf components
are become very popular,
but EMC performances are
usually unknown
CHALLENGES IN EMC OF ICS
Transient Immunity
•
Knowledge on harmonic
immunity has increased
•
Pressure for transient
immunity tests at IC level
•
Close to ESD tests,
Electrical Over Stress
•
Integrated Circuit Fast
Transient (ICFTM) under
consideration by IEC for
standardization
L. Glaesser, 2015
CHALLENGES
DEPARTMENT OF ELECTRICAL &
COMPUTER ENGINEERING
CHALLENGES IN EMC OF ICS
Technology
•
Lower operating current/voltages in
same environment
•
Lower supply voltages leads to lower
noise margins
14-nm
technology
Supply (V)
5.0
3.3
0.8 V
inside,
1.2V
outside
I/O supply
2.5
Core supply
1.8
1.2
1.0
0.35µ
0.18µ
130n
90n
65n
45n
32n
Technology node
20n
14n
10n
7n
CHALLENGES
Technology
•
Many different types of
packages available, but
information difficult to
obtain
•
Non-standard 3D
technology (various
Through-Silicon-Via
dimensions, die
thickness..)
CHALLENGES IN EMC OF ICS
Technology
•
Isolation between very low voltage (13V), medium voltage (12V) and high
voltage (48, 98, 240, 300, 400, 850V)
functions
•
ADC with 16-24bit resolution work at
10-100µV resolution while IO noise is
10-100mV dynamic range
CHALLENGES IN EMC OF ICS
Technology
•
Smart-power IC contains 100+ pockets
and 10+ power domains
•
Standard TCAD tools can not cope with
chip complexity and dimenions
•
Simulation of EMC requires
simplification & approximations for
model-order-reduction
CHALLENGES IN EMC OF ICS
Design
•
Various operating voltage
require voltage translators,
complex layout and loose
power
•
Internal supplies deliver very
high currents
•
Emebbed coils and decaps
need to be very carefully
designed and optimised
•
Package-IC co-simulation
required for optimization
CHALLENGES IN EMC OF ICS
Increased frequencies
•
EMC at IC level usually characterized upto 3GHz
•
Requests at 6 GHz for communicating cars
•
5G may operate above 20 GHz
•
Car radars 24, 77 GHz
Parasitic Emission
(dB)
Customer
Concerns in 5
years
100
80
10
years
Customer pressure
60
40
IC Parasitic Emission
20
IC technology scale down
0
10 MHz
100 MHz
1 GHz
10 GHz
100 GHz
CHALLENGES IN EMC OF ICS
Increased frequencies
•
Above 1GHz, skin effect
•
Non constant permitivity
•
Insulator structure
•
Humidity, roughness…
C. Chastang PhD 2013
CHALLENGES
Mobiles
•
As DRAM is becoming faster,
significant signal integrity issues to
meet required eye diagram and
bandwidth.
•
Display Driver IC is becoming important
sources of noise coupling to adjacent
antenna on smart phone
•
There are direct noise couplings from
IC to adjacent antenna on smart phone
•
There are noise coupling from power to
I/O causing SI-PI co-problems
CHALLENGES
Mixed-Signal Issues
•
Simulations are still a
challenge due to the lack
of good behavioral models
for analogue functions.
•
Models do not reproduce
the state-dependent
behavior of the IC
•
Meaning-full debugging
analyses at system-level
are difficult to performed
CHALLENGES
Models & tools
•
EMC predictions often far from realcase measurements
•
Difficulty to get relevant physical
data (IC, package, PCB)
•
Difficulty to convert physical data
into accurate model
•
In the case of IC obsolescence,
models could help predicting EMC
rather than requalify the full
equipment
CHALLENGES
At 1.8V,
Models & tools
•
IBIS widely available but
quality and relevance not
guaranteed
•
IBIS/EMI part empty
•
IEC 62 433 model
Ion may
be
incorrect
I/V curve
should be
monotonous
standards but very few
models available
•
Exchange of models
unclear
•
Exploitation of models
IEC 62433 series
Emission model
(ICEM)
Conducted mode
Radiated mode
ICEM-CE
IEC 62433-2 Ed. 1.0
ICEM-RE
IEC 62433-3
IEC 62433-2 Ed. 2.0
(IBIS, ICEM) in commercial
Immunity model
(ICIM)
ICIM-CI
IEC 62433-4
ICIM-RI
IEC 62433-5
tools difficult and subject
Fast Transient model
(ICFTM)
ICFTM-CI
IEC 62433-6
-
to variability
CHALLENGES
Generic IC EMC Test Specification
Design
•
Customers know their system
level EMC tests but mostly
have no idea of chip level tests.
•
System design is often not
finished when chip
development starts.
•
A bad PCB design and wrong
separate
supply
substrate
isolation
external components can
destroy a good EMC
performance of an IC
increasing
separation
between
sensitive
blocks
Adrijan Barić ,
EMC Compo
2011
CHALLENGES
System-On-Chip
immunity
•
Embedding a wide set of
heterogeneous functions
makes test conditions
difficult to specific, to
guarantee immunity of the
system in all situations
•
Functions with
compatibility risks should
be segregated
Samsung Exynos Octa
OPPORTUNITIES
DEPARTMENT OF ELECTRICAL &
COMPUTER ENGINEERING
OPPORTUNITIES
Automatic drive
•
will require highly
intensive and
reliable computing
•
Trend towards
hybrid/electrical car
for low carbon
emission
•
Multi-sensor
approach
•
A lot of EMC
concerns pending
OPPORTUNITIES
Internet of Things
•
New mass production
markets of connected
systems and their variants
will lead to much more
diversified EMC solutions,
with minimum or no
shielding, lower costs and
will generate more
intelligent solutions and
approaches for EM
compliance
OPPORTUNITIES
A
1
Co-Design
•
DQ2431
A
2
3
DQ8-15
Chip package co-design and
signal integrity simulation
•
Chip package co-design and
power integrity simulation
•
CA0-9
DQ0-7
EMC community getting closer DDR1_
CLK
to Power/Signal Integrity
community
AC1
DQ1623
AC
23
OPPORTUNITIES
Technology
•
Low-profile packages
reduce the area of
possible resonance loops
which could act as
radiating magnetic
dipoles
•
Easier integration of
decoupling or tuning
elements like capacitors,
inductances, resistors or
diodes inside the package
OPPORTUNITIES
Technology
•
GaN power
devices for
increased
efficiency
•
Operates
upto 650 V
OPPORTUNITIES
Going 3D
•
3D technology improves electronic
efficiency, and provide natural
shieldings
Paul Siblerud, www.emc3d.org
OPPORTUNITIES
Processor die
Going 3D
•
Possible 3rd die
3D technology
uses stacked
dies, TSV, DBI,
Thinned
memory
die
10 µm
Upper die
etc
•
•
Enables 10-20
Multicore
Gb/s/pin at 1.0V
350 µm
thickness
Bottom die
Samsung 3D vs
PoP:
30% faster
Package
leadframe
(GND)
20% less power
Less heat
http://www.youtube.com/watch?v=Rw9fpsigCfk
Through Silicon
Via (TSV)
Direct bond
interconnect
(DBI)
OPPORTUNITIES
Measurement methods
•
Develop measurement
methods above 1 GHz
•
X-DPI upto 16 GHz
•
GTEM cell upto18 GHz
•
Near-field scan with
miniature probes upto
several GHz
•
yincheng.chang@narlabs.org.tw: XDPI proposal
Novel materials or
design concepts for
more efficient
measurements (ferrites)
•
Integrated probes
A. Boyer EMC Compo 2015
OPPORTUNITIES
Models & Simulation
•
A fast, reliable and easy to handle
EMC simulation software to simulate
the whole chip for system and predict
chip level EMC tests
•
Multi-physics (electrical, thermal,
mechanical) modeling, simulation,
and design for System ICs and 3DICs
OPPORTUNITIES
Board
Models & Simulation
•
Component
The IC-level EMC models
are inspiring electronic
system designers to
build and exchange
models
•
ICEM and ICIM models
will provide a basis to
treat aging and
obsolescence
PhD A. C. Ndoye, INSA, 2010
Equipment
OPPORTUNITIES
Instrumental ICs
•
Configurable IC for
EMC optimization
•
Embedded on-chip
measurement systems
•
EMC sensors on-chip
M. Deloge, 2015
Sampling command
Sensor
S/H cell
Attenuator
+
Output
amplifier
_
High impedance
probe
Signal to measure
S. Ben Dhia, 2012
Sampled
data
OPPORTUNITIES
Costs savings
•
First-time EM compatible
design/product helps saving a
lot of money
•
EMC optimization for IC
product, definition,
Fail
measurement and technical
support can be a potential
differentiator
Pass
OPPORTUNITIES
Cost savings
•
Reorient EMC tests to more
relevant constraints
•
Consider reasonnable limits,
linked to real-case
applications, instead of
default limits
•
Develop low cost
investigation tools for early
handling of EMC (scanner,
on-chip)
OPPORTUNITIES
•
More and more, consumers
expect detailed explanations
of unforeseen failures, but
in return expect corrective
actions and the setting of a
methodology so that the
failure do not occur again.
•
EMC is an opportunity and
leverage to be a market
leader in components &
systems, rather than as a
constraint to be treated at
the last minute.
P. Schroter, 2015
THREATS
DEPARTMENT OF ELECTRICAL &
COMPUTER ENGINEERING
THREATS IN EMC OF ICS
Cost of nano-CMOS
Design cost (M$)
•
Much more complex process
•
Challenges in nano-scale
160
patterning
140
•
20 companies in 130nm
120
•
4 companies (alliances) in 14nm
100
•
7 Billion $ fab cost
80
•
IC design cost explosion:
60
40
1 IC DESIGN
150 M$
20
0
1 RUN
ITERATION
10 M$
130nm 90nm 65nm 40nm 28nm 14nm
A. Manocha, Foundry driven innovation in the
mobility era, Global Foundries, 2013
THREATS IN EMC OF ICS
Humans
•
Lack of EMC engineers with knowledge on Ics
•
Not enough engineers who can design and
simulate chip and package together
•
Not enough engineers who can handle signal
& power integrity together
•
Non-EMC aware project management
Tool Efficiency
•
Communication and data sharing between IC,
package, and PCB design level very difficult
•
Limits of CAD and computational resources
•
Efficient modeling and simulation methods
simulating “Tera-device” problems not
(never?) available
THREATS IN EMC OF ICS
Design
•
Enormous problems to isolate
LV from HV
•
Radiated and conducted
emission of HV perturbates LV
•
Multi Giga bit/s Video and
entertainment processors
sensitive to RF noise
•
EMI compliant systems rely
on immunity models of
components that are hardly
available
CONCLUSION
DEPARTMENT OF ELECTRICAL &
COMPUTER ENGINEERING
CONCLUSION
•
Industrial participants to EMC Compo and
some “VIPs” close to industry have shared
keywords about future needs in EMC of ICs
•
Industry 4.0
•
Automated cars
•
Connected objects
•
Higher complexity
•
Higher frequencies
•
Needs for models, simulations, predictions
•
Cost issues
•
Skilled engineer issues
CONCLUSION
Thank you for your
attention
Thanks to the industrial
partners
and to Alistair Duffy
Preferably ask questions to
Industry, not to me 
DEPARTMENT OF ELECTRICAL &
COMPUTER ENGINEERING
Inf
DEPARTMENT OF ELECTRICAL &
COMPUTER ENGINEERING