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Understanding and Protecting Against Electrical

Overstress (EOS) of Operational-Amplifiers

By Thomas Kuehl – Senior Applications Engineer

Precision Analog – Linear Applications Engineering

This is your IC

This could be your IC after an electrical overstress event!

Presentation Subjects

• ESD and EOS definitions

• Amplifier input range

• ESD models

• Internal ESD and consequently EOS protection circuits

• Amplifier EOS operating situations

• External EOS protection

ESD and EOS: What’s the difference?

• Electrostatic Discharge (ESD) – The transfer of electrostatic charge between bodies or surfaces at different electrostatic potential.

Electrical Over Stress (EOS)

– The exposure of an item to current or voltage beyond its maximum ratings.

ESD

High voltage (kV’s)

Short duration event (1-100ns)

Fast edges

Low power

Out of circuit event

EOS

Low voltage >Vs

Longer duration event

Low power

In-circuit event

Two very different environments

Handling and assembly

environments

-

+

+

OP1 !OPAMP

ESD

PC Board

-5V bus

L1 50n

V1 5

C1 100n

EOS

10V

0V

VG1

R1 1k

-

+

+

R3 1k

L2 50n

R2 10k

C2 100n

OP2 !OPAMP

Vout

R4 1k

+5V bus

V2 5

The TI data sheet Absolute Maximum Ratings is a good place to check and assure EOS problems are avoided

Input voltage range of an op-amp

+

+2kV –

+100V

ESD protect region

Safe with Rs

+5.5V

+5.0V

Non-linear input

+3.5V

In-circuit max positive

Pos Safe

Pos rail

CMV input range

Input voltage

0V

-0.1V

-0.5V

Safe with Rs

-5.0V

-100V –

-2kV

ESD protect region

_

Neg rail

Neg safe

In-circuit max negative

OPA735 low

Drift CMOS

Op-amp

Vi 2.5

Rs 1k

*

-

+

+

U1 OPA735

Vo

C1 100n

V1 5

* Selected to limit input current to 10mA max.

ESD Stress Models

R1 1.5k

L1 7.5u

VG1 d

2 ( i ) dt

2

R

L di

* dt

1

LC

* i

0

ESD model

Human Body Model

Machine Model

Charged Device Model

R L C V

HBM 1.5 kΩ 7500 nH 100 pF ≥ 2kV

MM 20 Ω

CDM 20 Ω

750 nH

5 nH

200 pF

2-10pF

100 - 200V

200V - 1kV

Human Body model

Human Body ESD Model

modeled in TINA Spice

T 1.5

1.0

AM1 (Amps)

500.0m

0.0

15.0

VF1 (Volts)

10.0

5.0

0.0

0

Rdut = 10 Ohms

50n 100n

Time (s)

150n

2kV

IC1

IC L1 7.5u

R1 1.5k

SW1 t

C1 100p

C2 2p

DUT

Rdut 10

VF1

200n

Rdut is the “on” resistance of an ESD protection circuit

+

A AM1

Machine Model

T 4.0

AM1 (Amps)

2.0

0.0

-2.0

40.0

VF1 (Volts)

20.0

0.0

-20.0

0

Rdut = 10 Ohms

50n 100n

Time (s)

150n

Machine ESD Model modeled in TINA Spice

DUT

200V

IC1

IC L1 500n R1 10

SW1 t

C1 200p

C2 2p Rdut 10

VF1

+

A AM1

200n

Rdut is the “on” resistance of an ESD protection circuit

CDM - ESD by induction

T 400

200

Charge Device Model modeled in TINA Spice

250V

IC1

IC

L1 5n

C1 10p

2 - 10pF

R1 20

SW1

Rdut 10

VF1

Cp 2p

0

-200

0.0

T 5.0

2.5

+

A AM1

Rdut is the “on” resistance of an ESD protection circuit

0.0

-2.5

-5.0

0.0

1.0n

1.0n

2.0n

Time (s)

3.0n

2.0n

Time (s)

3.0n

4.0n

4.0n

Common input/output ESD protection circuits

Input steering diodes

Vdd / Vcc bus

Pad input or output circuit

D2 1N914

D1 1N914

-Vdd / Vee bus

Vcer input clamp

Pad

Absoption

circuit

Rb

Vee

CMOS input/output protection output

pad

Ouput Pad

V+

C1 20f

Pad/Pin

SCR

R1 190

R2 74

R3 74

C1 20f

V-

IC level SCR model

D1 PMLL4448 T1 Noname is more complex

OR

Input Pad input

pad

C1 20f

V-

Supply clamp circuits

Bipolar BVcer Clamp

V+

T1 !NPN

Avalanche generating

IS1 1u current - internal or external source

RB 500 RB s et by des ign

and process

V-

V+

T2 Noname

V-

NMOS Clamp

V+

NMOS parasitic

NPN trans istor

RB 500

T3 !NPN

V-

Rsub 500

NPN bipolar on high-speed process

ON →

← OFF

NMOS parasitic bipolar transistor

Drain

(collector)

Gate n

I sub

Sub (base)

I

DS

I

C

R sub

P-sub/epi n p

Source

(emitter)

A commonly applied ESD protection method for analog integrated circuits

In+

In-

Input protection ultra low leakage diodes

Rs 1k

Rs 1k

V+

+

-

IOP1

Output protection

T1 !NPN

Rb 2k

Vo

V-

Power supply absorption device

INA168 ESD cell layouts

Input pin

ESD2 N-sinker – BL

ESD1 NPN B-E

Supply clamp

NPN transistor / resistor

Output pin

ESD7 NPN B-E

ESD8 N-sinker – BL

ESD pulse source

In+

VG1

In-

Rs 1k

Rs 1k

The ESD protection paths

V+

V+ pin at GND

+

-

IOP1

T1 !NPN

Rb 2k

Vout at

GND

Vo

V-

V- pin at GND

Input overdrive may activate

ESD protection circuits

VG2

VG1

VG2 unintended trans ients, noise

impuls es , etc.

Vi n+

TL1

V-

-

+

+

V+

VG1 intended

linear range signal

Vp = 2.25V, f = 100Hz

V+

V1 2.5

C1 100n

V2 2.5

U1 OPA364

V-

Vo

R3 10k

T

VG1

2.25

0.00

-2.25

1.00

VG2

500.00m

0.00

3.25

Vin+

500.00m

Vo

-2.25

2.50

0.00

-2.50

0.00

C2 100n

VG1 + VG2 sum may activate

ESD circuit on peaks

5.00m

10.00m

Time (s)

15.00m

20.00m

Intended signal

VG1

VG2

Input

EOS source

RI 1k

ESD cell paths may be activated during an

EOS event

V2 5

L2 50n

C2 1u

+ -

* L4 10n

Rs 1k

Rs 1k

+

-

IOP1

T1 can become a near short between supplies!

Vout

T1 !NPN

RL 10k

Rb 2k

V1 5

L1 50n

* L3 10n

C1 1u

+

RF 10k

* may no longer represent a nearzero impedance at high frequencies

A supply clamp transistor failure during resulting from an input EOS/ESD event

VG1

One channel of RGB

amplifier application

TL1 GRN OUT

R1 500

GRN IN

R4 75

R2 500

C2 10u

V-

+

-

R3 75

V+

+

+

C1 10u

+ -

OP1 !OPAMP

OUT

TERM

R5 2k

T1 !NPN

V+/V- wall-wart power s upply

without on/off switch

Vcer clamp transistor

EOS-related CMOS operational-amplifier field failures

TI quad CMOS operational amplifier failing unexpectedly in air conditioner application

• TI FA report indicated the operational amplifier die had carbonized material on die and pin 4 (V+) to pin 11 (V-) short

EOS analysis of the customer application input and output ESD circuits did not reveal any likely candidates

EOS-related CMOS operational-amplifier field failures

20 Vpk EOS on V+ line

A request for the Field Applications Engineers to observe and monitor the amplifier pins during the various operational cycles was made and provided

They found that a 20 Vpk pulse was appearing on the V+ line during operation of the air conditioner. The nominal supply voltage was +5 V

• The EOS was causing either the supply-to-supply ESD clamp to break down, or voltage breakdown of the amplifier transistor structures

• A higher voltage operational amplifier and a transient voltage suppressor on the V+ line were recommended

Input current limiting by external series-R

Where does the 10mA

I

OVERLOAD maximum originate?

Parasitic circuit latch testing

Compliance

Range +/-7.5V

I max 150mA

VG1

-

+

VCCS1

+

VS1 5

I/O hi gh

I/O low

Pi n under

test

+

A AM1

U1 OPA348

+

+

-

SW1

Input pins connected together

during output pin test

VS2 0

+

Ouput floats during input pi n tests

Current injection latch test

The continuous input overload current is set to < 1/10 th the JEDEC maximum latch test current (t ≤ 10ms)

Watch Vin during power up!

I in excessively high while supply ramps

T 30.0m

AM1

15.0m

0.0

3.50

VG1

1.75

0.00

5.00

VG2

2.50

0.00

3.50

VM1

1.75

0.00

0 10m 20m

Time (s)

30m 40m 50m

Instrumentation amplifier input protection

RG 25k

EXT

Vi n+

Vi n-

V+

Over-Vol tage

Protection

+

IOP1

-

R2 25k

Over-Vol tage

Protection

R1 25k

-

+

IOP2

R3 60k R5 60k

R4 60k

-

+

IOP3

R6 60k

V-

Vcm 0

Vd/2 1

Vo

Ref

Vi n+

Ib Comp 1n

Vbias 0

Vbias

+

IS1 10u

A1

+

-

IOP2

T1 !NPN

C1 6p

R1 25k

A3 +i n

A3 -in

A2 +

Mirror of

A1circuit

RG 25k

Ext

Vd/2 1

Vi n-

Over-Vol tage

Protecti on

T1 Noname T2 Noname D1 1N914

Excessive differential input over-voltage

Bipolar input operational amplifier

VG1

U1 OPA227

R2 1k

R1 500

V-

-

+

+

V+

V+

V1 15 V2 15

C1 100n C2 100n

V-

Vo

R3 1k

T 10

90%

8

6

4

2

10%

0

0.0

Possible occurrences

– When operating an operational amplifier as a comparator

– During slewing

Input-output voltage difference

1.0u

SR = 2.3V/us

2.0u

Time (s)

3.0u

4.0u

5.0u

Plot for illustrative purposes only!

OPA277 input-to-input differential over-voltage protection modern bipolar op-amps have input clamps

R1 500

V2 15

I in

20mA max

Vin-

Pulse

Source

Vin+

VG1

T28 !NPN

Gain stages and bias circuits

T23 !NPN

T41 !NPN

T44 !NPN

Vo

RL 1k

V1 15

V

G1

= 2V

D

+ (I in

R

1

) + V o

If V

O

= 0V, then:

I in

= (V

G1

– 2V

D

) ∕ R

1

Input overdrive of CMOS rail-to-rail IO chopper amplifiers

Back-to-back clamp diodes are inherent and internal to the chopper switch structures

When Vin exceeds a Vcm maximum Vo is forced to an output rail level

• The op-amp is forced outside of its linear operating range

• The feedback loop collapses and an input differential voltage develops

One clamp diode or the other becomes forward biased and the input bias current can increase tremendously

• This may limit the use of this type of operational amplifier as a comparator

Overload Recovery

Auto-zero CMOS

Operational-amplifiers

OPA335

Av = -50V/V

R1 2k R2 100k

Stepped from

50m V to 0m V

VG1

C1 100n

U1 OPA335

V-

-

+

+

V1 2.5

+ VM1

-

C2 100n

V2 2.5

V-

Vin

≥ Vs / Gain

Positive input

+50mV

0mV

0V

Negative output

≥ -2.5V

Negative input

0mV

-50mV

≤ 2.5V

Positive output

0V

Output inversion during input overdrive

U1 OPA234

VG1

Vi n 5Vp-p

+ 2.0Vdc

-

+

+

+

-

VM1

R1 50 V1 5 C1 10n

+4.5V

VG1

-0.5V

+4.5V

VM1

0V

Output inversion

Supply pin over-voltage protection

VG1

L1 100u Rs 5

5V Power

supply

LOAD

C1 1u RL 1k

+ VM1

-

Smoothing a transient with an RLC filter

• Transient amplitude effectively reduced

• Ringing dependent on

RLC values and load R

• Amplifier PSRR becomes important

T 10.0

VG1

7.5

5.0

5.5

VM1

5.0

4.5

0

1us transient riding

on 5V supply voltage

20u 40u

Time (s)

60u 80u 100u

Supply pin over-voltage protection

LOAD

Rs 10

VG1

5V Power

supply

Transient voltage suppression (TVS) diode

• 6.8V- 550V reverse standoff voltage

•Unidirectional & bidirectional models

•Ppk = 1.5kW (10 x 1000us) @ 25C

•Cj ≥ 1nF @ 20V

•Littlefuse no. 1.5KE6.8, etc.

C1 10n RL 1k

+ VM1

-

Vz = 6.8V

T 10.0

Z1 1N5342

VG1

7.5

5V 1us transient riding

on +5V supply line

5.0

7.0

VM1

5.8

4.5

0 20u zener diode used in simulation

no TVS model available

40u

Time (s)

60u 80u 100u

Supply pin over-voltage protection

Features

• Multilayer ceramic construction

• Operating voltage range V

M(DC)

= 5.5 to 120V

• Non-repetitive surge current (8/ 20us)

• Non-repetitive energy (10/ 1000us)

• response time <1ns for zinc oxide

• Inherent bidirectional clamping

• Wider temperature range and flatter response than solid-state TVS

Externally connected input protection devices

Transient voltage suppressors

For CMOS, bipolar and SiGe

Features:

Available from 5.6 to 18V

DC working voltage ≤ 18V

AC working voltage ≤ 14V

Turn-on-time <1ns

Repetitive spike capability watch capacitance uA J A pF

Externally connected input protection devices

Externally connected input protection devices

Schottky diodes provide enhanced input protection

VG1

V1 5

SD1 BAS40 C1 100n

U1 OPA374

+

+

SD2 BAS40

-

R1 5k

R2 5k

+ VM1

-

Features:

• Forward voltage V

F

≤ 380mV, I

F

= 1mA

• Forward current I

F

= 200mA max (cont.)

• Leakage current * I

R

≤ 100nA, V

R

= 30V

• Diode capacitance C tot

≤ 5pF, V

R

= 0V

* A small-signal silicon diode (IN4148) will likely turn on at lower voltage than the internal

ESD silicon diode and may exhibit lower leakage current than a Schottky diode.

Externally connected input protection devices

An important point about added protection devices in the signal circuit

• Protection components such as transient voltage suppressors (TVS), diodes and zener diodes all exhibit capacitance even when biased off

• The capacitance will vary to some extent with the voltage applied across the protection device

• Most often the capacitance does not have a linear capacitance to voltage relationship (voltage coefficient)

This non-linear capacitance to voltage relationship may increase distortion in the protected circuit

• It will be most evident in a very low THD circuits, but may not degrade performance significantly

Power Line Communications (PLC)

EOS environment – IEC61000-4-5

Open-circuit surge pulse test

4kV, 1.2us t front

, 50us t half-value

PLC – EOS protection

Actual protection scheme will vary with application and layout

High voltage MOV and low-voltage TVS clamping

Fast rectifier and

Schottky clamps

The internal output ESD cell is unlikely to withstand the open-circuit HV pulse

- latching is probable

In Summary

• EOS and ESD events may activate ESD protection but result in different outcomes

• Internal ESD circuits may sufficiently handle EOS

• Be aware of unique EOS situations such as power up and input slewing

• External EOS protection circuits will be required if device damage is likely to occur without it

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