3. Current-Voltage Relationships 3.1 Influence of Drain-Source Voltage Discussion of the operation of the MOS transistor up to now has assumed that the drain-source voltage, VDS, was equal to zero. This meant that conditions in the capacitive layer were controlled solely by the gate-source voltage, VGS. It is also possible to vary the drainsource voltage, VDS, so that when a conducting channel has been formed, current can flow through this channel. The conditions in the channel and the current which flows through it are also dependent on the value of the drain-source voltage applied. Zero Drain-Source Voltage with Channel Formed, VGS VT, VDS = 0 When the gate-source voltage is greater than the threshold voltage, a conducting channel is formed. The voltage VGS - VT can be thought of as the channel-forming voltage. If the drain-source voltage is zero this channel will be uniform along its length as can be seen in Fig. 3.1(a). The depletion region underneath the channel will also be uniform along the channel between source and drain. (i) Non-Saturation Region, VGS VT, 0 VDS VGS - VT When the drain-source voltage is increased above zero an electric field now exists along the length of the channel, acting from drain to source which causes electrons in the channel to flow from source to drain. This gives rise to a conventional current flowing in the opposite direction from drain to source, referred to as the drain current, iD, of the transistor. This electric field also causes the conducting channel to taper becoming narrower at the drain end as shown in Fig. 3.1(b). The depletion region also becomes wider around the drain. This tapering of the channel becomes more extensive as VDS is increased but is maintained less than the value VGS - VT. This region of operation of the transistor is known as the non-saturation region (often referred to a little confusingly as the linear region). The drain current that flows also increases with increasing VDS, for a given value of VGS, but not in a linear fashion as shall be seen. (ii) (iii) Saturation Region, VGS VT, VDS VGS - VT If the drain-source voltage is further increased, it will be accompanied by an increase in drain current. Eventually, however, it will become equal to the channel forming voltage applied to the gate, VDS = VGS - VT. When this occurs, the tapering of the channel becomes complete to the point that the channel becomes closed off at the drain 1 VDS = 0V VSB = 0V VGS >VT G B D S n+ n+ pFig. 3.1(a) Uniform Channel Formed in MOSFET with VGS > VT, VDS = 0 0<VDS<VGS-VT VSB = 0V VGS >VT G B D S n+ n+ pFig. 3.1(b) MOSFET in Non-Saturation Mode, VGS >VT, 0 <VDS < VGS -VT 2 end as shown in Fig. 3.1(c). This condition is referred to as ‘pinch-off’ of the channel. It should be noted that effectively what has happened here is that the voltage at the drain, relative to the source, has become equal to the channel forming voltage VGS - VT so that the channel cannot remain established at the drain. Once this happens the drain current becomes limited to its value at pinch-off and further increase in the drain-source voltage brings only a slight increase in drain current, i.e. the drain current saturates. Consequently, this region of operation where VDS > VGS - VT is called the saturation region. Most analogue circuits operate entirely in this region. (iv) Channel Length Modulation In older devices, where the length of the channel is greater than the minimum technology dimension (long-channel devices), the conditions in the channel remain at those of pinch-off once the saturation region is entered. Hence the value of current for a given gate-source voltage remains constant at the pinch-off value when operating in the saturation region. In more modern devices, where channel lengths are much shorter (short-channel devices), the pinchoff condition extends along the channel towards the source when VDS > VGS - VT, as shown in Fig. 3.1(d). This effectively shortens the channel slightly as VDS increases, a phenomenon referred to as channel length modulation. This, in effect, means that the depletion region begins to extend back towards the source. However, current flow is maintained by acceleration of electrons through this region in a thin film close to the surface of the semiconductor under the influence of the very high electric field here. Indeed, in saturation, the increase in VDS above the channel forming voltage is developed almost entirely across the depletion region at the shortened end of the channel. This shortening of the channel also allows the drain current to increase slightly when operating in the saturation region. 3 VDS = VGS-VT VSB = 0V channel pinched off at drain end VGS >VT G B D S n+ n+ pFig. 3.1(c) MOSFET at Channel Pinch-Off, VGS > VT, VDS = VGS -VT VDS > VGS-VT VSB = 0V VGS >VT shortened or modulated channel G B D S n+ n+ pFig. 3.1(d) Channel Length Modulation in MOSFET, VGS >VT, VDS >VGS-VT 4 3.2 Current-Voltage Relationships (i) Non Saturation Region, VGS VT, 0 VDS VGS - VT Fig. 3.2 shows a diagram representing the channel induced in the MOS Transistor underneath the oxide when operating in the nonsaturation region. It can be seen to be wedge-shaped due to the influence of the drain-source voltage. The x-direction will be taken as the vertical direction under the oxide while the y-direction will be taken as horizontal distance along the channel as shown. It is assumed, for simplicity of analysis, that the threshold voltage is constant along the length of the channel and that the distribution of charge is uniform in any elemental section dy, having a depth xc. As already outlined, when the drain-source voltage is zero, VDS = 0, the effective voltage forming the channel is the gate-source voltage over and above the threshold voltage, VGS - VT. When the drain-source voltage is not zero, the effective voltage forming the channel is reduced by an opposing contribution from the drain-source voltage Vy and is modified to VGS - VT – Vy. This channel voltage varies as a function of y depending on location in the channel with Vy = 0 at y = 0, the source end and Vy = VDS at y = L, the drain end. The total charge induced in the channel per unit area of oxide at the point y, the location of the elemental section dy, is then given as: Qy COX VGS VT Vy The charge per unit volume in this section is then given as: ρy Qy xc It will be recalled that the drift current for electrons caused by an electric field E is given as: Idrift JA ρμnEA where the direction of current flow is the same as the direction of the electric field. Applied to the elemental section of the channel, dy, this gives for the drain current: ID ρyμnEy Wxc 5 direction of electric field 0 x y y=L E L Source W Drain xc elemental section of channel dy Fig. 3.2 inverted Channel VDS < VGS - VT Elemental Section of Channel with 0<VDS < VGS - VT 6 since the electric field is acting in the negative y direction. Substituting for y and taking the electric field as constant along the elemental length, E y dVy dy gives: Qy ID xc μn dVy Wxc QyμnW dy dVy dy This expression applying to the elemental length dy can now be integrated along the length of the channel from source, y = 0 to drain, y = L so that: L 0 IDdy VDS 0 QyμnWdVy Substituting for Qy from above gives: L 0 IDdy μnWCOX VDS V GS 0 VT Vy dVy so that: 0 IDdy μnWCOX 0 L VDS VGS VT dVy 0 VDS VydVy Integrating then gives: 2 VDS IDL μnWCOX VGS VT VDS 2 and finally: ID 1 W 2 μnCOX 2VGS VT VDS VDS 2 L The prefix constant term is referred to as the transconductance parameter for the MOSFET Kn 1 W μnCOX 2 L and has dimensions of AV-2 so that 2 ID K n[ 2VGS VT VDS VDS ] It can be seen from this that the level of current flow in the MOS transistor can be controlled by the physical dimensions of length, L and width, W in its fabrication. In fact it is these dimensions which are the principal tool at the disposal of the circuit design engineer. 7 ID in A Boundary VDS =VGS - VT Non-saturation (linear) region Saturation region VGS = V5 VGS = V4 VGS = V3 VGS = V2 VGS =V1 0 VDS in Volts Fig. 3.3(a) Drain Current vs Drain-Source Voltage in a Long-Channel MOSFET 8 Fig. 3.3(a) shows a plot of the drain current vs drain-source voltage with the gate source voltage as an individual parameter. It can be seen that these curves have a hyperbolic shape. However, it is important to remember that this relationship is valid only for operation in the non-saturation region where VDS VGS - VT. Of interest is the point where the maximum occurs on the curves. This can be found by differentiating the above expression for drain current with respect to VDS and equating to zero: ID Kn 2VGS VT 2VDS 0 VDS which is satisfied for VDS = VGS - VT. This shows that the drain current reaches a maximum value at the boundary between the non-saturation and the saturation region as shown in Fig. 3.3(a). (ii) Saturation Region For long-channel devices it has been seen that the drain current saturates at its pinch-off value at VDS = VGS - VT and remains at this value in the saturation region. Hence, an expression for the drain current in saturation can be obtained by simply substituting the boundary condition into the expression obtained for operation in the non-saturation region. This gives: ID Kn[2VGS VT VGS VT VGS VT ] 2 which gives: ID Kn VGS VT 2 This relationship is shown in Figure 3.3(a). 9 (iii) Channel Length Modulation For short-channel devices, the effect of channel length modulation must be accounted for. It can be seen in Fig. 3.3(b) that the drain current in these devices increases slightly in the saturation region as the drain-source voltage is increased. However, it can also be seen that the slope in this region is constant indicating a linear dependency. This can be accounted for relatively simply by including the channel length modulation factor, , which is applied to the drain current in the saturation region. The expression for the drain current is then modified to become: ID K n VGS VT 1 λV 2 DS where has dimensions of V-1 and has a typical value of 0.005 to 0.05. 10 ID in A Boundary VDS =VGS - VT Non-saturation (linear) region Saturation region VGS = V5 VGS = V4 VGS = V3 VGS = V2 VGS = V1 VDS in Volts 0 Fig. 3.3(b) Drain Current vs Drain-Source Voltage for Short-Channel MOSFET 11