sto
r
or
ci t
pa
nn
HDI
(Hig
s
rid
SEMB
SEMB
CD
Vibrato
r
Package
Substrate
OMS Division
ule
Camera Mod
Linear
or
Vibrat
HDD
or
Mot
ivis
Ne
C(
ion
ion
S
ar
CD
is
Div
un
Co
mm
ld
Bluetooth Module
)
Solution
ESL(ESL
Cellu
la
r Mo
dule
le
ule
odu
le)
od
rM
le
odu
Fi M
Fi M
du
we
ule
Mo
Po
Wie
odul
lar M
ion)
L Solut
ESL(ES
ule
Bluetooth Mod
Cellu
we
rM
od
on
ati
nic
mu
er
n
Tu
Fie
om
er
ar
C
ld
ica
Fie
Tu
n
Ne
NF
SD
)
)
Camera Module
or
tion
ule
Application Guide
SAMSUNG ELECTRO-MECHANICS
Mot
nec
te
OMS Division
HDD
con
rid
2012
Linear
nter
od
Substra
ity I
nM
Package
ens
tio
g
I(Hi
hD
NF
C(
um
tal
Tra
n
rco
nte
ity I
Po
Layer
Ca
n
Wi-
Indu
ctor
Chi
p
Ceram
Chip
ic Chip
Capac
itor
LCR Divisio
n
Res
i
sio
)
on
ecti
it
itor
ivi
Capac
(Multi-
c Chip
erami
MLCC
ye r C
ID
Un
ion
-La
(Multi
MLCC
AC
al
or
cit
is
Div
yst
pa
ion
Ca
y
m
Cr
I
AC
HD
tor
u
tal
it
Un
en
hD
ctor
Indu
Chip
s
esi
ip R
Ch
n
Tra
Cr
l
sta
LCR Divis
www.samsungsem.co.kr
C O N T E N T S
LCR Division
02
ACI Division
03
CDS Division
04
OMS Division
05
Smart Phone / Feature Phone
06
Desktop / Tablet Computer
08
LCD TV(LED TV)
10
PDP TV
11
LCD Monitor
12
Set-top Box
13
Game Console
14
Digital Still Camera
15
Digital Video Camcoder
16
Navigation
17
Portable Multimedia Player
18
MP3 Player
19
e-Book
20
Laser Printer
21
Copy Machine
22
Projector
23
Hard Disk Drive
24
Solid State Drive
25
Electronic Shelf Label
26
LED Lighting
27
Automotive
28
www.samsungsem.com
2012
Application Guide
SAMSUNG ELECTRO-MECHANICS
LCR Division
Linkage of Magnetic Flux Coil
Capacitor
Resistor
LCR division stands for Linkage of Magnetic Flux Coil, Capacitor and Resistor. Main products are
passive components such as MLCC, Chip Resistors, Chip inductors, crystal unit and Solid tantalum.
Premium MLCCs, designed to restrain the mechanical crack appearances and malfunctions, are
suitable for applications requiring high reliability such as automotive and industrial applications.
ACI Division
Advanced
Circuit
Interconnection
ACI division stands for Advanced Circuit Interconnection. Main products are HDI, RF-PCB, FCxGA
and BGA. PCB (printed circuit board) is a device that provides electrical interconnections and
a surface for mounting electronic components. Most PCBs are made from a flat rigid or flexible
material layered between insulating and conductive element through which electrical currents travel.
1. MLCC (Multi-Layer Ceramic Chip Capacitor)
1. HDI (High Density Interconnection)
As a major passive component, MLCC is the most prevalent type of capacitor
It refers to high-density PCBs created with fine pattern and pitch to exchange
today which temporarily stores electrical charge and decouples the noise in
electrical signals between electrical components mounted onto a PCB
electronic circuits its main body is made up of interleaved layers of dielectric
and metal inner electrode which is usually nickel. The external electrodes or
2. SEMBrid
terminations provide physical and electrical connection of MLCC to printed
SEMBrid is the acronym of “SEM” + “Hybrid”, meaning multi-layer rigid-flex PCB
circuit board or hybrid IC module
manufactured by Samsung Electro-Mechanics
2. Chip Inductor
3. Package Substrate
Chip inductor is a kind of SMD type passive component of inductance. It
Package substrate is a substitution technology of lead frame in chip packages.
is made by thick film multi-layer process. It is mainly used for impedance
The sort of package substrates is UT-CSP, BOC, RF-Sip, FC-CSP and others
matching of telecommunication devices, LC resonance circuits and elimination
These products are used in Application processor, DRAM module, RF-Module,
electromagnetic noise of digital devices.
Flash memory, Main purpose is mobile phone.
3. Chip Resistor
Chip resistor is general passive components which are useful for controlling
current and duration voltage in the circuit. Also it can be mounted on the
surface of the PCB.
4. Tantalum Capacitor
Tantalum capacitors are designed with excellent performance characteristics
for filtering, by-passing, coupling, blocking and R.C tuning circuit. They are
used extensively in industrial, commercial, entertainment and medical electronic
equipments.
5. Crystal Unit
Quartz crystal units are passive components used reverse-piezoelectricity.
Samsung’s crystal units are designed to be applicable for the requirement of
high precision specification such as mobile devices.
CDS Division
Circuit
Drive
Solution
CDS division stands for Circuit Drive Solution. Main products are digital tuners, network modules,
power modules, and ubiquitous modules. We are continuing making an effort to boost sales of
premium products, such as power module and network module products keep developing for
customer diversification.
OMS Division
Opto &
Mechatronics
Solution
OMS division stands for Opto and Mechatronics Solution. Main Products are camera modules,
precision, motors and HDD Motor. We are also expanding into camera modules specifically for smart
phones and tablet PCs as well as new areas into the new markets automotive electronic system and
sensing applications.
1. Power Module
1. Camera Module
The power module converts externally supplied electricity to the required output
Camera modules, akin to an “electronic eye,” transform images that pass
voltage for electronic products.
through the lens into digital signals for taking pictures and recording video.
- SMPS for LED TV, LCD TV etc
SEM is working on exceptional camera modules for smart phones with high
- Adapter for Note PC, Tablet PC etc
resolution solution, subminiature camera, auto focus, vibration compensation
- Power module for LED Lighting, Data Server
and high quality actuators/lens. The company is also expanding into camera
modules specifically for smartphones and tablet PCs as well as new areas into
2. Tuner
The digital tuner is an essential component for the digital broadcasting industry.
This front-end component is built into LCD TVs and other broadcasting
receivers to select the right signals from broadcasters so that viewers can watch
their desired channels.
3. NFC (Near Field Communication Module)
the new markets, automotive electronic system and sensing applications
2. Linear Vibrator
Precision motors are built inside smartphones and game consoles to generate
vibrations that convey messages such as silent alerts of incoming calls or text
messages. With today’s popular smartphones, the use of vibration is evolving
NFC module is device that enables wireless communication for unencrypted
to include haptic functions, which interface with the user through the sense
information exchanges in a short distance within 10 cm by using RFID
of touch. In addition, R&D resources are being focused on the development
technology.
of smaller, thinner, and more durable precision motors suitable for mobile
applications.
4. Wi-Fi Module
The Wi-Fi module is a sophisticated device that enables personal computers,
3. HDD Motor
smart phone and other products to access the internet in real time.
Hard Disk Drive Motor revolves the disks installed in HDD of computers, while
Samsung Electro-Mechanics is manufacturing a various combo module such as
Optical Disc Drive Motor is used in CD and DVD players at rated speed.
WLAN + BT
5. Cellular Module
The cellular module uses broadband frequencies for mobile phones to provide
smart phones, tablet PCs and other handhelds with high-speed internet
connectivity. This device is expected to be a requirement for operating in a
mobile internet environment
6. ESL (ESL Solution)
S-Label Tag is a product that displays price electronically and it can display
information customer’s needs such as price, discount rate and sale signs on the
tag. And it is capable of supporting a multi-mode which can display additional
information such as producing center, manufacturer, inventory and sales volume
for the store managers, A safety lock has been added to prevent theft of the
tag, and various colors and designs are available for displaying store logos
Application GUIDE
SAMSUNG ELECTRO-MECHANICS
1
6
3
Smart Phone
/ Feature Phone
Power Control
Motor
4
MLCC
Vibration motor
Tantalum capacitor
Linear vibrator
Power inductor
Chip bead
Chip resistor
Wireless power transfer
8
8
RF Front End
Adapter
7
1
5
Application IC
Transceiver
7
1
Baseband
Memory
Multimedia RF Front End
Baseband
Display
6
Transceiver
Rigid-flex
Camera module
Application IC
Memory
5
5
Mobile tuner
Camera
Motor
Camera
Motor
4
Optical navigation module
Mobile TV Tuner
Mobile TV Tuner
3
3
PMIC
2
7
8
Main Board
PMIC
Wireless LAN
Bluetooth
Display
6
FCCSP
RFSiP
GPS
RF Components
2
Chipset
Wireless LAN
1
4
2
Network
Bluetooth
GPS
HDI
HDI-flex
CSP(Ultra thin)
MLCC
Crystal unit
Tantalum capacitor
Power inductor
In mold antenna
WiFi+BT combo module
MLCC
Bluetooth module
Chip inductor
NFC module (Near field communication)
Chip inductor
Chip bead
Chip resistor
Chip bead
Crystal unit
Crystal unit
Hall IC
Display
6
7
Application GUIDE
SAMSUNG ELECTRO-MECHANICS
2
8
3
HDD
HDD Motor
Desktop
/ Tablet Computer
4
Network
WiFi+BT combo module
WiMAX module
Cellular module
NFC (Near Field Communication)
7
1
2
4
Keyboard Mouse
Bluetooth
Memory
5
7
DC/DC
Converter
USBIEEE1394
DVD
ODD Motor
8
1
Display
Chipset
1
Chipset
CPU
DVD
5
HDD
3
LAN
2
4
Memory
CSP(Ultra thin)
BOC
FCCSP
MLCC
MLCC
Chip resistor
WLAN
4
Power System
Adapter
Server Power
6
1
6
SMPS/
Adapter
7
Main Board
8
Display
HDI
Camera module
MLCC
LED driver IC
Tantalum capacitor
Linear vibrator
Chip inductor
Chip bead
Chip resistor
Crystal unit
9
Application GUIDE
SAMSUNG ELECTRO-MECHANICS
3
10 11
4
LCD TV (LED TV)
PDP TV
4
3
Decorder & Image Engine
Network
DeMUX
tuner
Power Control
3
Decorder &
Image Engine
Network
Memory
DeMUX
T-CON Board
2
Power system
1
4
2
LCD Panel
5
Logic Board
1
Tuner
Super IP board
Digital tuner (Silicon tuner)
SMPS(LCD)
Slim tuner for LED TV
Power 1
System
Memory
tuner
1
Power System
SMPS
2
PDP Panel
2
Tuner
Digital tuner (Silicon tuner)
Inverter
Power driver for LED TV
LED Driver
3
Network
WiFi module
5
LCD Panel
LED driver IC
4
Main Board
PBGA
3
Network
WiFi module
4
Main Board
PBGA
FCBGA
FCBGA
MLCC
MLCC
Chip inductor
Chip inductor
Chip bead
Chip bead
Chip resistor
Chip resistor
nd
Application GUIDE
SAMSUNG ELECTRO-MECHANICS
5
12 13
6
LCD Monitor
Set-top Box
4
3
Decorder & Image Engine
Network
2
DeMUX
Memory
T-CON Board
LCD Panel
DeMUX
3
Memory
2
tuner
Decorder & Image Engine
Network
tuner
8
Power
System
1
1
Power System
7
1
Baseband
1
Transceiver
Power
System
Application IC
Memory
IP board
2
Tuner
Digital tuner (Silicon tuner)
1
Tuner
Digital tuner(Silicon tuner)
2
Network
WiFi module
Camera
Motor
4
Mobile TV Tuner
3
LCD Panel
LED driver IC
Wireless LAN
Bluetooth
GPS
3
2
4
Main Board
3
Main Board
4
Power System
PMIC
Display
PBGA
MLCC
MLCC
MLCC
Chip inductor
Chip resistor
Chip inductor
Chip bead
SMPS
Chip bead
Chip resistor
Chip resistor
T-CON Board
4
Application GUIDE
SAMSUNG ELECTRO-MECHANICS
7
8
Game Console
Digital Still
Camera
4
8
1
CPU
1
7
2
Controller
4
1
Video Out
3
DVD
Motor
4
HDD
3
Image
Processing IC
USB I/F
Memory 1
Lens
Motor
Adapter
4
CCD
DC/DC
Converter
Memory
Camera
4
Memory
Display 3
1
Lens
Application IC
Main Control Processor
GPU
4
USB / HDMI
Baseband
Transceiver
1
14 15
Motor DRV
Audio
Network
Micro Controller
1
Strobe
Input Device
Mobile TV Tuner
3
1
Chipset
2
PMIC
Wireless LAN
FCBGA
Bluetooth
PBGA
GPS
MLCC
2
Controller
Vibration motor
Camera module
Display
4
Main Board
DVD · HDD
HDD Motor
MLCC
PDIC
Chipset
4
Main Board
HDI
CSP
HDI
BOC
FCCSP
MLCC
MLCC
2
Network
Tantalum capacitor
Chip inductor
Crystal unit
Tantalum capacitor
Chip inductor
WiFi+BT combo module
Chip bead
Chip resistor
3
1
Power inductor
Chip bead
3
Display
Linear vibrator
Chip resistor
Crystal unit
Network 2
Application GUIDE
SAMSUNG ELECTRO-MECHANICS
9
1
16 17
10
Digital Video
Camcoder
Navigation
8
7
Baseband
Application IC
Transceiver
Memory
2
Camera
LensMotor
4
CCD
4
CDS AGC
Mobile TV Tuner
Memory Card
1
3
1
Main Control
PMIC
IEEE 1394 I/F
2
Bluetooth
GPS
1
Chipset
Adapter
3
DC/DC
Display
Converter
ADC / DAC
2
Main Board
CSP
HDI
FCCSP
MLCC
Tantalum capacitor
AV I/O
1
Network
Multimedia
Mobile tuner
2
Display
Crystal unit
Audio
PA
Speaker
Car
Adapter
Memory
AC
Adapter
4
Main Board
HDI
FCCSP
MLCC
Linear vibrator
Chip bead
Chip resistor
Display 2
CSP
Power inductor
Chip inductor
Application
Processor
Display
Wireless LAN
Bettery
Multimedia
T-CON
Tantalum capacitor
Chip inductor
3
Network
WiFi+BT combo module
Chip bead
Chip resistor
Crystal unit
Application GUIDE
SAMSUNG ELECTRO-MECHANICS
11
18 19
12
Portable
Multimedia Player
MP3 Player
8
7
Baseband
4
Application
IC
ansceiver
FM tuner
Memory
Camera
Motor
Video
Codec
TV Tuner
Network 5
HDD
Stereo
Codec
5
1
4
Chipset /
Memory
FM tuner
Input
Device
1
3
Stereo
Codec
Multi- 3
media
Network
Memory
Input
Device
DSP
3
2
2
Display
LCD
PMIC
Driver
Battery
2
Adapter
Display
LCD
Driver
Battery
ireless LAN
uetooth
1
Chipset / Memory
Display
6
2
Display
1
Main Board
2
Display
PS
CSP
Linear vibrator
FCCSP
3
Multimedia
Camera module
Network
WiFi+BT combo module
Linear vibrator
Tantalum capacitor
4
Main Board
HDI
MLCC
5
MLCC
Tantalum capacitor
Power inductor
Chip inductor
Chip bead
Chip resistor
Crystal unit
Power inductor
3
Chip inductor
Chip bead
Chip resistor
Crystal unit
CSP
Chipset / Memory
Adapter
Application GUIDE
SAMSUNG ELECTRO-MECHANICS
13
20 21
14
e-Book
Laser Printer
2
3
Battery
Network Device
1
Display
1
Network
WiFi+BT combo module
Network
Controller
Main
Processor
Display Controller
(E-Ink Controller)
1
Memory
Memory
Controller
Input
Device
2
Main Board
HDI
Motor
Power System
1
Network
WiFi module
3
2
Main Board
PBGA
CSP
MLCC
FCCSP
Tantalum capacitor
MLCC
Tantalum capacitor
Chip resistor
Crystal unit
2
Power System
SMPS
Chip inductor
Chip bead
Chip resistor
Display
Application GUIDE
SAMSUNG ELECTRO-MECHANICS
15
22 23
16
Copy Machine
Projector
8
7
Baseband
Application IC
Transceiver
Camera
Display
Controlling Circuit
Memory
Motor
2
Electrified Drum
Memory
5
Input Signal
Halogen Lamp
Dimmer Circuit
ADC
1
Network
1
DMD
Controller
Video Decoder
DMD
4
Controlling IC
le TV Tuner
Motor Driver
3
PMIC
2
SMPS
HVPS
SMPS
Lamp
Color Wheel
Wireless LAN
Bluetooth
1
Main Board
Display
6
1
DMD(Digital Micromirror Device) Controller
2
Main Board
GPS
HDI
PBGA
HDI
PBGA
MLCC
MLCC
Tantalum capacitor
Tantalum capacitor
Chip inductor
Chip inductor
Chip bead
Chip bead
Chip resistor
Chip resistor
Waveform Generator
Application GUIDE
SAMSUNG ELECTRO-MECHANICS
17
24 25
18
Hard Disk Drive
Solid State Drive
3
1
Pre-amplifier
VCM /
Head
1
Read / Write IC
Regulator
DC 12V
2
Flash memory bus
Controller IC
2
Data Buffer
Spindle
Motor
ASIC
NAND
Flash
Interface
Media
Crystal
Motor Driver
Interface
SVC Servo Control
Control signal
1
Main Board
MLCC
2
Disk Enclosure
HDD motor
1
Controller IC
2
Memory
CSP
CSP
Tantalum capacitor
MLCC
MLCC
Chip inductor
Power inductor
Chip resistor
Chip bead
Chip inductor
Chip resistor
Chip bead
Crystal unit
Chip resistor
EMI filter
Crystal unit
CSP
3
Regulator
HDI
MLCC
Chip resistor
Application GUIDE
SAMSUNG ELECTRO-MECHANICS
19
26 27
20
Electronic Shelf
Label
LED Lighting
8
7
Baseband
Application IC
Transceiver
1
S-Label
Memory 2
Gateway
LAN
or
W-LAN
Print
ESL+ Client
Network
Dimming
(PWM/Analog)
DALI
TCP/IP Network
5
Memory
Camera
Motor
4
ile TV Tuner
PAD
PMIC
2
Monitor
Server
3
Store
Server
Power System
Wireless LAN
Bluetooth
GPS
1
S-Label
EPD Type ESL Tag
Display
6
2
Gateway
Gateway
1
Power System
SMPS
TN LCD Type ESL Tag
Bulb
Active Matrix Tag
Down Light
L-Tube
Flat Panel Light
Street Light
1
LED
Lighting
Application GUIDE
SAMSUNG ELECTRO-MECHANICS
28 29
21
Automotive
2-2
1
2-2
2-2
4
3
2-2
2-1
2-1
2-1
1
Information, Comfort
MLCC
2
Safety
2-1. TPMS(Tire Pressure Monitoring System)
3
Car Connectivity
Telematics System
Bluetooth Module
2-2. Camera Module
- SVM : Side View Monitoring
- NVC : Night Vision Camera
- RVC : Rear View Camera
WiFi Module
Cellular Module
4
xEV Powertrain
On-Board Charger
MEMO
MEMO
Head Office & Worksites (Korea)
Head office & Sales Dept.
206, Cheomdansaneop Road, YeongtongGu, Suwon City,
Kyeonggi Province 443-743, Korea
Tel: 031-210-5114
Fax: 031-210-6363
Daejeon Plant
581, Myeonghah-ri, Dong-myeon, Yeongigun, Chungnam Province
339-860, Korea
Tel: 041-861-1214
Fax: 041-861-1333
Busan Plant
114, Noksansaneopjung Road, Gangseogu,
Busan 618-270, Korea
Tel: 051-970-7114, 8114
Fax: 051-970-8702
Seoul office
21st Fl, Samsung Seocho-Tower 1320-10,
Seocho 2-dong,Seocho-gu, Seoul 137857, Korea
Tel: 02-2255-2840~49
Fax: 02-2-2255-2850
Hungary Branch Factory
Samsung Electro-Mechanics Hungary
branch, H-2310 Leshegy utca 2-4
Szigetszentmiklos Pest megye, Hungary
Tel:+36-24-551-144
Fax:+36-24-551-104
Istanbul office
Harman Caddesi, Polat Plaza B-Block
No.4, Kat4 Levent-80640 Istanbul, Turkey
Tel:+90-212-324-0856,8
Fax:+90-212-270-0077
Southeast Asia
Global Network
Production
Manufacturing Sites
Dongguan Samsung ElectroMechanics Co., Ltd.(DSEM)
Hengkeng Management Area,
Liaobu Town, Dongguan City, Guangdong
Province, China 523413
Tel:+86-769-8330-5000
Fax:+86-769-8330-5001
Tianjin Samsung Electro-Mechanics
Co., Ltd.(TSEM)
27, Heiniucheng-Road, Tianjin, China
300210
Tel:+86-22-2830-3333
Fax:+86-22-2830-7436, 2831-6600
Samsung High-Tech ElectroMechanics(Tianjin) Co., Ltd.(STEM)
Xiqing Dist. Micro-Electronics Industrial
Park, Jingang Highway, Tianjin, China
300385
Tel:+86-22-2397-9000
Fax:+86-22-2396-2532
Kunshan Samsung Electro-Mechanics
Co., Ltd.(KSEM)
8, Yaoning Rd, Kunshan City, Jiangsu, China
215300
Tel:+86-512-5790-8888(899)
Fax:+86-512-5771-1065
Samsung Electro-Mechanics
Philippines Co., Ltd. (SEMPHIL)
Block No. 5, Calamba Premiere International
Park, Barangay Batino, Calamba, Laguna,
The Philippines
Tel:+63-49-508-8311
Fax:+63-49-508-8450
Sales Offices
The AMERICAS
Samsung Electro-Mechanics America
3333 Michelson Drive Suite 500,
Irvine, CA. 92612, U.S.A
Tel:+1-949-797-8000~8059
Fax:+1-949-797-8060~8062
Sao Paulo Office
04578-910 Av. Das Nações Unidas,
12399, Edificio Landmark, 89B Sao Paulo
SP
Tel:+55-11-3544-5600
Fax:+55-11-3544-5629
San Jose Office
85 W Tasman Drive, San Jose, CA. 95134
U.S.A.
Tel:+1-408-544-5274
Fax:+1-408-544-4967
Chicago Office
1870 West Winchester Blvd. Suite #247
Libertyville IL, 60048 U.S.A
Tel:+1-847-549-9421~4
Fax:+1-847-549-9419
Phoenix Office
4505 E. Chandler Blvd., Suite
#115, Phoenix, AZ 85048 U.S.A.
Tel:+1-480-592-0180
Fax:+1-480-592-0186
Helsinki office
02601 Lars Sonckin Kaari 14 Espoo
Finland
Tel:+358-9-8531-132
Fax:+358-9-2517-2258
China
Samsung Electro-Mechanics(H.K) Ltd.
8/F., Central Plaza, 18 Harbour Road, Wanc
hai, Hongkong, China
Tel:+852-2862-6340, 6350, 6360
Fax:+852-2862-6362~4
Shenzhen Office
46 F, New World Center, Yitian Road, Futian
District, Shenzhen, China 518026
Tel:+86-755-8608-5581
Fax:+86-755-8608-5566
Shanghai office
Rm. 1211, Shanghai International Trade
Center No.2201 Yan An(W) Rd., Shanghai,
China 200335
Tel:+86-21-6270-4168(Ext.200)
Fax:+86-21-6219-6640
Beijing office
24F, China Merchants Tower, No.118,
Jianguo Rd., Chaoyang District,
Beijing, China 100022
Tel:+86-10-6566-8100(#6600)
Fax:+86-10-6566-8146
Taiwan
Samsung Electro-Mechanics Thailand
Co., Ltd. (SEMTHAI)
Wellgrow Industrial Estate, 93 Moo 5T.
Bangsamak, A. Bangpakong, Chachoengsao
24180, Thailand
Tel:+66-38-562-000
Fax:+66-38-562-177~9
R&D center(Atlanta)
6 Concourse Parkway, Suite 900 Atlanta,
GA 30328 U.S.A
Tel : +1-770-542-2220
Fax : +1-770-542-2225
Taipei office
9F-1, No.399, Ruey Kuang Road, Neihu
District, Taipei City 114, Taiwan R.O.C
Tel:+886-2-2656-8350
Fax:+886-2-2656-8388
Europe
Japan
Branch Factories
Samsung Electro-Mechanics GmbH.
Samsung Haus, Am Kronberger Hang 6,
65824 Schwalbach/TS, Germany
Tel:+49-6196-66-7250, 7265, 7254
Fax:+49-6196-66-7744, 7766, 7755
Samsung Electro-Mechanics Japan
Co., Ltd
Roppongi T-Cube Building, 3-1-1,
Roppongi, Minato-Ku, Tokyo 106-8532,
Japan
Tel:+81-3-6234-2569, 2573, 2405
Fax:+81-3-6234-2568
Suzhou Branch Factory
Suchuan #17D Industrial Square, No.428
Xinlong Street, Suzhou Indusrial Park,
Suzhou, China 215000
Tel : +86-512-8716-9898(100)
Fax : +86-512-8716-9896
Binhai Branch Factory
No 80 xiaqing road, TEDA west
District, China
Tel : +86-22-2830-3333(3500)
Fax : +86-22-6686-3333~3628
London office
Samsung House 3000, Hillswood Drive
Chertsey Surrey KT16 0PS, U.K.
Tel:+44-1932-45-5480, 5483
Fax:+44-1932-45-5484
Osaka Office
6th Fl., Crystal Tower, 1-227, Shiromi, Chuo-ku, Osaka 540-6006,
Japan
Tel:+81-6-6949-3406~9
Fax:+81-6-6949-3047
Samsung Electro-Mechanics Private
Limited
3 Church Street Samsung Hub #23-02
Singapore 049483
Tel:+65-6833-3215~31
Fax:+65-6833-3243~4
Bangkok Office
23rd Floor, Lake Rajada Office Complex
193/52 Rachadapisek Road,
Klongtoey, Bangkok 10110 Thailand
Tel:+662-661-8004~5
Fax:+662-661-8006
Penang Office
1-05-3A Menara IJM Land Lebuh Tunku
Kudin 3, 11700 Gelugor, Penang, Malaysia
Tel:+60-4-660-6120,2
Fax:+60-4-660-6123
Manila Office
4027 Block No. 5, Calamba Premiere
International Park, Barangay Batino,
Calamba, Laguna, The Philippines
Tel:+63-49-508-8446
New Delhi Office
A-25, GF, Mohan Co-operative Industrial
Estate, New Delhi-110044, India
Tel:+91-11-49661241
Fax:+91-11-43661299
Hanoi Office
1st floor, Technosoft building, Dich Vong
Hau Cau Giay, Hanoi Vietnam
Tel:+84-4-6673-1200
Fax:+84-16-9259-6656
R&D Center(Bengaluru)
201, World Trade Centre,Rajkumar Rd,
Malleshwaram Bangalore Karnataka India
Tel:+91-80-6726-0888
Fax:+91-80-67260876