Microelectronics LOGIC SYNTHESIS OF VLSI CIRCUITS c GDM Enabling and strategic technology. Primary markets: { Information systems. { Telecommunications. { Consumer. c Giovanni De Micheli Stanford University Secondary markets: { Systems (e.g., transportation). { Manufacturing (e.g., robots). Computer-Aided Design c GDM Electronic market Enabling design methodology. Makes electronic design possible: { Large scale design management. { Design optimization. { Reduced design time. Application of VSLI circuit technology. Key strategic importance. SYSTEMS ELECTRONIC SUB−SYSTEMS INTEGRATED CIRCUITS EDA c GDM Moore's law Trends in microelectronics c GDM Improvements in device technology: { Smaller circuits. { Higher performance. { More devices on a chip. PENTIUM−II 7 10 PENTIUM PENTIUM−III P−PRO D−AXP I−486 6 10 I−386 M−68020 I−286 5 10 I−186 M−68000 10 4 I−8086 3 10 c GDM Higher degree of integration. 10 I−8080 2 I−8008 10 { More complex systems. { Lower cost of computation. { Higher reliability. 1 1960 1965 1970 1975 1980 1985 1990 1995 2000 Integration-scale limitations c GDM Intrinsic physical scaling limits. Capital investment for fabrication. Microelectronic design problems c GDM { To be competitive in performance. { Use of appropriate design styles. Large-scale design management. Use most recent technologies. Reduce design cost. { To be competitive in price. { Use of CAD design tools. Speed-up design time. { Time-to-market is critical. Microelectronic economics Microelectronic circuits c GDM Design cost: { Design time and fabrication cost. { Large capital investment. { Near impossibility to repair. c GDM General-purpose processors: { High-volume sales. { High performance. Application-Specic Integrated Circuits (ASICs): { Varying volumes and performances. Recapture costs: { Large volume production is benecial. { Zero-defect designs are essential. { Follow market evolution. Prototypes. Special applications (e.g. space). Microelectronic design styles Semicustom design c GDM c GDM Adapt circuit design style to market requirements: SEMI−CUSTOM Parameters: { Cost. { Performance. { Volume. Custom and semi-custom design. CELL−BASED CELL−BASED STANDARD−CELLS Hierarchical cells Hierarchical cells ARRAY−BASED MACRO−CELLS PRE−DIFFUSED PRE−WIRED Memory generators PLA generators Sparse logic generators Gate matrix generators Gate arrays Sea of gates Compacted arrays Anti−fuse based Memory−based Standard cells Macro-cells c GDM Cell library: Layout style: MPGAs c GDM Pre-diused arrays: { Personalization by metalization/contacts. { Mask-Programmable Gate-Arrays. Features: { Layout can be highly optimized. { Structured-custom design. Compatible with macro-cells (e.g. RAMs). Array-based design Examples: { RAMs, ROMs, PLAs, general logic blocks. { Cells are placed in rows. { Channels are used for wiring. Module generators: { Synthesized layout. { Variable area and aspect-ratio. { Cells are designed once. { Cells are highly optimized. c GDM Pre-wired arrays: { Personalization on the eld. { Field-Programmable Gate-Arrays. c GDM Array of sites: { Each site is a set of transistors. Batches of wafers can be pre-fabricated. Few masks to personalize chip. Lower cost than cell-based design. FPGAs c GDM Semi-custom style trade-o c GDM Array of cells: { Each cell performs a logic function. Personalization: Density Performance Flexibility Design time Man. time Cost - lv Cost - hv { Soft: memory cell (e.g. Xilinx). { Hard: Anti-fuse (e.g. Actel). Immediate turn-around (for low volumes). Inferior performances and density. Good for prototyping. Custom Very High Very High Very High Very Long Medium Very High Low Cell-based High High High Short Medium High Low Pre-di. High High Medium Short Short High Low Pre-wired Medium-Low Medium-Low Low Very Short Very Short Low Medium-High Microelectronic circuit design and production c GDM Microelectronic circuit design c GDM DESIGN TESTING idea MODELING SYNTHESIS & OPTIMIZATION tester FABRICATION MASK FABRICATION WAFER FABRICATION { Hardware Description Languages (HDLs). 10000 01001 11100 VALIDATION Conceptualization and modeling: Synthesis and optimization: { Model renement. PACKAGING SLICING PACKAGING Validation: { Check for correctness. Modeling abstractions c GDM Modeling abstractions c GDM ARCHITECTURAL LEVEL ... PC = PC + 1; FETCH (PC); DECODE (INST); ... Architectural level: { Operations implemented by resources. LOGIC LEVEL Logic level: { Logic functions implemented by gates. GEOMETRICAL LEVEL { Devices are geometrical objects. Modeling views c GDM be ha w ie vi v al or al vi r tu Modeling views c GDM Behavioral view: { Abstract function. c ru st ew Geometrical level: Structural view: physical view { An interconnection of parts. Physical view: { Physical objects with size and positions. Circuit synthesis Modeling views and abstractions c GDM b−view c GDM Architectural-level synthesis: { Determine the macroscopic structure: s−view Interconnection of major building blocks. a−level Logic-level synthesis: { Determine the microscopic structure: l−level g−level p−view Interconnection of logic gates. Geometrical-level synthesis: (Physical design) { Determine positions and connections. Modeling views Microelectronic circuit optimization c GDM c GDM b−view { Delay and cycle-time. { Latency. { Throughput (for pipeline applications). s−view a−synthesis a−level l−synthesis l−level g−level Performance: Power consumption. Area (yield and packaging cost). Testability. p−design p−view Design space and evaluation space c GDM Optimization trade-o in combinational circuits c GDM Area EVALUATION FUNCTION DESIGN Cycle−time SPACE Area Area Max Latency Delay Delay Max Optimization trade-o in sequential circuits Pareto points c GDM Area Area Cy cl e− t Multi-criteria optimization. Multiple objectives. Pareto point: c GDM e im Area Area Max Cy cl t e− im e Latency Latency Latency Latency Max { A point of the design space is a Pareto point if there is no other point with: at least one inferior objectives. all other objectives inferior or equal. Example design space Example design evaluation space c GDM c GDM Area 7 (a) 6 a (c,d) b (b) 5 4 3 c d 2 1 Delay Implement f = p q r s with: 1 { 2-input or 3-input AND gates. Area and delay proportional to number of inputs. Summary c GDM Computer-aided design methodology: { Capture design by HDL models. { Synthesize more detailed abstractions. { Optimize circuit parameters. Logic synthesis and optimization: { Manipulate and optimize circuit models at the logic abstraction levels. 2 3 4 5 6 7