MEDIA ADVISORY
Entegris, Inc.
Corporate Headquarters
3500 Lyman Boulevard
Chaska Minnesota 55318 USA
Tel. 952-556-3131
Fax 952-556-1880
Bill Paterson
Public Relations Manager
Tel. 952-556-4155
Bill_paterson@entegris.com
FOR IMMEDIATE RELEASE
Monday, September 11, 2006 – FOR IMMEDIATE RELEASE – SEMICON Taiwan Exclusive
Entegris Introduces Industry Leading Wafer, Reticle Handling Products
Latest Technology Ideal For The Taiwan Semiconductor Industry
CHASKA (Minneapolis), Minnesota/TAIPEI,Taiwan – September 11, 2006 – Entegris, Inc. (NASDAQ: ENTG)
brings its industry leading wafer and reticle handing products to SEMICON Taiwan 2006 this week in Taipei. Three
leading products that Entegris will showcase this week are the 300 mm FOSB (Front Opening Shipping Box), the
Spectra™ FOUP (Front Opening Unified Pod) and the RSP 200 PEEK™ dome unit. Entegris is the global market leader
in purifying, protecting and transporting critical materials used in manufacturing by semiconductor companies.
“Entegris’ industry standard wafer and reticle handling technology, products and services are driving the kind of
advancements that deliver solutions for customers, and enable continued process development and yield improvements
in the semiconductor market, here in Taiwan and worldwide,” said Patrick McKinney, vice president of wafer handling.
Entegris 300 mm FOSB (photo below)
As 300 mm wafer processing moves more and more to fully automated transport of wafers, the Entegris FOSB features
state-of-the art technology that helps customers to realize process consistency and cost savings. With its unique FIMS
compatible door, Entegris’ FOSB enables fabs to more efficiently and effectively complete their transition to a full
automation environment.
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The materials integrity management company
ENTEGRIS BRINGS PRODUCT INNOVATIONS TO SEMICON TAIWAN…September 11, 2006…….…page 2
Entegris Spectra™ FOUP (photo below)
The Spectra™ features the newest and best technology for 300 mm wafer transport, enabling customers to reach
advanced technology nodes of 90nm and lower. It is fully compatible with all process tools and automation equipment
to achieve the highest tool uptime available. The Spectra™ FOUP promises higher yields due to a proven design to
protect wafers from particles, airborne molecular contamination, shock and vibration better than any other FOUP in the
market. Entegris On-Site Services experts maintain the Spectra™ FOUP at the customer site. The Spectra™ FOUP
features an advanced ESD path to ground, and supports many types of identification strategies.
Entegris RSP 200 PEEK™ Dome
Higher cleanliness standards (both particulate and molecular) are driving the need for improved performance by the
products designed to transport and store masks during manufacturing. Entegris introduces this month a technological
advancement unmatched in the industry with its RSP 200 PEEK™ dome unit mask handler. Entegris developed the
product in collaboration with the Advanced Mask Technology Center (AMTC). The Advanced Mask Technology
Center GmbH & Co. KG (AMTC), a joint venture of Advanced Micro Devices, Inc., Infineon Technologies AG and
Toppan Photomasks, Inc., is one of the world's leading centers for the research and development, as well as pilot
production of, optical photomasks for the latest lithographic generations.
The RSP 200 features significant abrasion improvement by incorporating PEEK material in the dome unit that better
protects load ports and storage areas, provides improved sealing between the dome and the door, reduced outgassing and
greater ESD protection – thereby providing overall greater contamination control, reduced risk of mask damage and
enhanced yields. This new Entegris innovation (in comparison to the previous dome design) provides 12 times the
abrasion resistance, 50 times sealing improvement and 1,500 times the improvement in reducing outgassing. Its interior
is 18 percent smaller than the earlier dome, creating a smaller area in which to control contamination. The product is
now available for orders and shipping.
ABOUT ENTEGRIS
Entegris (merged with Mykrolis in August 2005) is the global leader in materials integrity management – delivering a
wide range of products for purifying, protecting and transporting critical materials used IN processing and manufacturing
in semiconductor and other high tech industries. Entegris is ISO 9001 certified and has manufacturing, customer service
or research facilities in the United States, China, France, Germany, Japan, Malaysia, Singapore, South Korea and
Taiwan. Additional information can be found at www.entegris.com.
PEEK™ is a registered trademark of Victrex, Corp.
The materials integrity management company