Wisconsin Center for Applied Microelectronics
1550 Engineering Drive
Madison, WI 53706
Phone: 608/262-6877
Fax: 608/265-2614
WESTBOND 747677 ALUMINUM WEDGE BONDER
Process Description:
Once a die chip has been attached to a package, wire
bonding is one method of making the connection
between the die and the package. Aluminum and gold
are typically used as bonding wire. Bonding has three
basic methods: ultrasonic, thermo-compression and
thermo-sonic. The ultrasonic method uses ultrasonic
energy to attach the wire. Thermo-compression uses
heat and pressure to attach the wire. For thermosonic, the wire is fed through a capillary; an electrical
spark melts the tip to form a ball; and then the capillary
moves downward to touch the bonding pad. After
pressure, the capillary moves upward release some wire and then positioned to make the second
bond.
Equipment Description:
The West Bond model has been set up as an ultrasonic 45-degree wedge bonder. The ultrasonic
energy attaches a 0.001” aluminum wire at room temperature. The wire is clamped and threaded
diagonally under the bonding wedge, allowing independent feeding action but requiring front-to-back
bonding direction. The tool is guided manually by the operator and uses hand/eye reference to bond
targets and elevations.
Approved Materials for use in this equipment:
Check the APPROVED MATERIALS for this equipment on http://mywebscape.wisc.edu under
WCAM in the group directories.
Date last modified: 2/17/2016
Date created: 8/18/10
Content by: Rebecca Bauer