Information for Contributors of Chung Hua Journal of Science and Engineering
The Chung Hua Journal of Science and Engineering publishes
contributed original archival research papers as well as
special issues on the following fields: (1) Electrical
engineering: communication, control, electronics and
opto-electronics, (2) Mechanical engineering: thermal fluid
dynamics, CAD and CAM, structure and solid mechanics,
material and control, (3) Civil engineering: structure, earth,
and water source engineering, construction technology and
environmental engineering, (4) Applied mathematics: applied
statistics, computational mathematics, mechanics, physics,
geometry, and education, (5) Communication engineering:
communication system, Broadband networking, multi-media
DSP, microwave Circuits and devices, wave propagation and
antennas., (6) Microelectronic engineering: microelectronic
system, semiconductor physics and devices, IC design and
manufacturing.
It is very important that all authors read carefully and comply
with the following guideline.
1. Submission of manuscripts: Electronic files of the
contributed manuscript (in Microsoft Word) should be
submitted via email only to the Secretariat
(ecemail@chu.edu.tw). Each author can submit only one
manuscript in each number of the journal.
2. Lengh: The maximum length of a paper is strictly 6
printed pages. There is a mandatory excess-page charge of
NT$2,000 per page for each exceeding page.
3. Paper size: Use paper of approximately 21 x 29 cm in size
(please do not change the document setting from A4 to
letter).
4. Writing: All manuscripts must be written in English.
Please keep a second copy of your manuscripts in your
office (just in case anything gets lost in the mail).
Universally accepted abbreviations and symbols may be
used without further definition, but nonstandard
abbreviations must be defined at the point the first such
abbreviations appear.
5. Typing: Typing should be single-spaced, single column
for the title, authors, abstract and keyword. For the rest of
the manuscript, typing should be single-spaced, double
column with equally column width. Keep lines fairly
uniform and leave 3 cm margin on left side and 2.5 cm
margin on the other sides.
6. Title and Author: Use a clear and descriptive title. The
title of the paper should be concise, informative and in
capital letters (using Times New Roman Bold 14). The
author’s name and affiliation (with e-mail address) should
appear below the title (using Times New Roman 12).
7. Abstract: Each paper should have abstract (not exceeding
200 words). The abstract should appear at the beginning
of the manuscript (using Times New Roman 12).. They
should not only indicate the subject and scope of coverage
but also, in the case of research paper, give major results
and conclusions.
8. Keywords: Several keywords (not more than 4 words) for
the paper should be given below the abstract (using Times
New Roman 10).
9. Text Format: The title of each section should be
numbered by I, II, III and placed in the middle of a line.
Titles of sub-sections are placed to the left with
preceding number. Times New Roman 10 should be used
in the main text throughout the manuscript.
10. Equations and Mathematical Formulas: All equations
and mathematical formulas should be typewritten.
Equations should be numbered serially on the right
hand side by Arabic numerals in parentheses. Leave
proper space above and below all the mathematical
expressions.
11. Units: The international System of Units (SI system)
should be used. Non-metric equivalents can be included
in parentheses whenever desirable.
12. Illustrations: The authors are requested to submit
professional quality illustrations with sharp lines and
good contrast. All illustrations should be numbered, titled
and have descriptive captions.
13. Acknowledgments: Acknowledgments should be kept in
minimum words and given as a paragraph at the end of
the text.
14. References: References should be numbered in the order
in which they are cited at the end of the manuscript in the
following form:
[1] Dj.M. Maric, P.F. Meier and S.K. Estreicher: Mater.
Sci. Forum Vol. 83-87 (1992), p. 119.
[2] M.A. Green: High Efficiency Silicon Solar Cells
(Trans Tech Publications, Switzerland 1987), p.42.
[3] Y. Mishing, in: Diffusion Processes in Advanced
Technological Materials, edited by D. Gupta Noyes
Publications/William Andrew Publishing, Norwich,
NY (2004), in press.
[4] G. Henkelman, G.Johannesson and H. Jónsson, in:
Theoretical Methods in Condensed Phase Chemistry,
edited by S.D. Schwartz, volume 5 of Progress in
Theoretical Chemistry and Physics, chapter 10,
p.170 , Kluwer Academic Publishers (2000).
[5] R.J. Ong, J.T. Dawley and P.G. Clem: submitted to
Journal of Materials Research (2003).
[6] P.G. Clem, M. Rodriguez, J.A. Voigt and C.S. Ashley,
U.S. Patent 6,231,666. (2001).
[7] Information on http://www.matweb.com/