Publications for Paul Conway
Santaniello, T, Yan, Y, Tocchio, A, Martello, F, Gassa, F, Webb, P, Zhao, W,
Tamplenizza, M, Schulte, C, Liu, Y, Hutt, D, Milani, P, Conway, P, Lenardi, C (2015)
On-chip single cell funneling operated by microfabricated thermo-responsive hydrogel
layers, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 25(7), ISSN:
0960-1317. DOI: 10.1088/0960-1317/25/7/075004.
Mirgkizoudi, M, Liu, C, Conway, PP, Riches, S (2015) Mechanical and electrical
characterisation of Au wire interconnects in electronic packages under the combined
vibration and thermal testing conditions, MICROELECTRONICS RELIABILITY, 55(6),
pp.952-960, ISSN: 0026-2714. DOI: 10.1016/j.microrel.2015.02.023.
Conway, PP (2015) Embedded Intelligence. In 8th National Electrical and Computer
Engineering Conference (SFHMMY 8), University of Patras, Patras, Greece.
Kaur, N, Velandia, DS, Whittow, W, Barwick, D, Iredia, E, Parker, N, Porter, N,
Conway, PP, West, AA (2015) Design and performance of a flexible metal mountable
UHF RFID tag. In , Proceedings - Electronic Components and Technology Conference,
pp.2120-2126, ISBN: 9781479986095. DOI: 10.1109/ECTC.2015.7159895.
Mirgkizoudi, M, Liu, C, Conway, PP, Riches, S (2015) Mechanical and electrical
characterisation of Au wire interconnects in electronic packages under the combined
vibration and thermal testing conditions, Microelectronics Reliability, 55(6), pp.952-960,
ISSN: 0026-2714. DOI: 10.1016/j.microrel.2015.02.023.
Xiong, H, Huang, Z, Conway, P (2014) Effects of Stress and Electromigration on
Microstructural Evolution in Microbumps of Three-Dimensional Integrated Circuits, IEEE
TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 14(4), pp.995-1004,
ISSN: 1530-4388. DOI: 10.1109/TDMR.2014.2356714.
Conway, PP and Huang, Z (2014) Quantitative characterisation of multi scale
microstructures in interconnects for multi-chip stacking. In International Stress
Workshop, Austin. Tx, USA.
Conway, PP (2014) Multidisciplinary network-based research supporting the UK’s
micro-machines sector. In 20th World MicroMachine Summit, Sao Paulo.
Huang, Z, Xiong, H, Wu, Z, Conway, P, Davies, H, Dinsdale, A, En, Y, Zeng, Q (2014)
Microstructure-based multiphysics modeling for semiconductor integration and
packaging, CHINESE SCIENCE BULLETIN, 59(15), pp.1696-1708, ISSN: 1001-6538.
DOI: 10.1007/s11434-013-0103-7.
Chakravorti, N, Lugo, H, Philpott, LK, Conway, PP, West, AA (2014) Automated cycling
ergometer with built-in ability to produce resistance profiles. In , Conference
Proceedings - IEEE International Conference on Systems, Man and Cybernetics,
pp.2977-2982, DOI: 10.1109/smc.2014.6974383.
Philpott, LK, Weaver, S, Gordon, D, Conway, PP, West, AA (2014) Assessing wireless
inertia measurement units for monitoring athletics sprint performance. In , Proceedings
of IEEE Sensors, pp.2199-2202, DOI: 10.1109/ICSENS.2014.6985476.
Banwell, G, Sharpe, R, Conway, P, West, A (2014) Evaluating the optimal location for
embedded accelerometers using experimentally validated computer algorithms. In ,
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014,
pp.294-297, ISBN: 9781479969944. DOI: 10.1109/EPTC.2014.7028395.
Sharpe, R, Banwell, G, Conway, PP, West, AA (2014) Sensor-enabled PCBs to aid
right first time manufacture through defect prediction. In , Proceedings of the 16th
Electronics Packaging Technology Conference, EPTC 2014, pp.366-371, ISBN:
9781479969944. DOI: 10.1109/EPTC.2014.7028396.
Chakravorti, N, Lugo, HL, Philpott, LK, Conway, PP, West, AA (2014) Model Based
Automated Cycling Ergometer, ENGINEERING OF SPORT 10, 72, pp.180-185, ISSN:
1877-7058. DOI: 10.1016/j.proeng.2014.06.030.
Xiong, H, Huang, Z, Conway, P (2014) A method for quantification of the effects of size
and geometry on the microstructure of miniature interconnects, Journal of Electronic
Materials, 43(2), pp.618-629, ISSN: 0361-5235. DOI: 10.1007/s11664-013-2907-2.
Wu, Z, Huang, Z, Ma, Y, Xiong, H, Conway, PP (2014) Effects of the Microstructure of
Copper Through-Silicon Vias on their Thermally Induced Linear Elastic Mechanical
Behavior, ELECTRONIC MATERIALS LETTERS, 10(1), pp.281-292, ISSN: 1738-8090.
DOI: 10.1007/s13391-013-3053-y.
Xiong, H, Huang, Z, Conway, P (2013) Size and geometry effects on microstructural
evolution in Sn microbumps during isothermal aging, Proceedings of the 2013 IEEE
15th Electronics Packaging Technology Conference, EPTC 2013, pp.466-471, DOI:
10.1109/EPTC.2013.6745764.
Chakravorti, N, Conway, PP, West, AA, Slawson, SE (2013) A novel instrumented
cycle ergometer with automated in-situ capabilities, Proceedings - 2013 IEEE
International Conference on Systems, Man, and Cybernetics, SMC 2013, pp.15991604, DOI: 10.1109/SMC.2013.276.
Rathnayake Arachchige, D, Hutt, DA, Conway, PP, D'Auria, M, Lucyszyn, S, Lee, RM,
Robertson, ID (2013) Patterning of Electroless Copper Deposition on Low Temperature
Co-fired Ceramic. In IEEE 15th Electronics Packaging Technology Conference (EPTC),
Singapore, pp.635-639, ISBN: 978-1-4799-2834-7.
Conway, PP, Rathnayake-Arachchige, D, Hutt, DA, Conway, PP, D'Auria, M,
Lucyszyn, S, Lee, R, Robertson, ID (2013) Patterning of Electroless Copper Deposition
on Low Temperature Co-fired Ceramic. In Anand, A and Yeo, A (ed) 15th IEEE
Electronics Packaging Technology Conference, Proc 15th IEEE Electronics Packaging
Technology Conference, Singapore, p.208.
Huang, Z, Xiong, H, Wu, Z, Conway, P, Altmann, F (2013) Multiscale microstructures
and microstructural effects on the reliability of microbumps in three-dimensional
integration, Materials, 6(10), pp.4707-4736, DOI: 10.3390/ma6104707.
Rathnayake-Arachchige, D, Hutt, DA, Conway, PP (2013) Excimer Laser Machining of
Fired LTCC for Selectively Metallized Open Channel Structures. In Schieman, B (ed)
46th International Symposium on Microelectronics, Proc 46th International Symposium
on Microelectronics, Orlando, Florida.
Le Sage, T, Conway, P, Cossor, J, Slawson, S, West, A (2013) A wireless sensor
system for monitoring the performance of a swimmer's tumble turn, PROCEEDINGS OF
THE INSTITUTION OF MECHANICAL ENGINEERS PART P-JOURNAL OF SPORTS
ENGINEERING AND TECHNOLOGY, 227(3), pp.161-171, ISSN: 1754-3371. DOI:
10.1177/1754337112467881.
Le Sage, T, Conway, P, Slawson, S, West, A (2013) Development of a wireless sensor
network for use as an automated system for monitoring swimming starts,
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART PJOURNAL OF SPORTS ENGINEERING AND TECHNOLOGY, 227(3), pp.184-195,
ISSN: 1754-3371. DOI: 10.1177/1754337112462945.
He, B, Petzing, J, Webb, P, Conway, P, Leach, R (2013) Characterisation of the
mechanical bond strength for copper on glass plating applications. In Characterisation
of Areal Surface Texture, pp.303-320, ISBN: 9783642364570. DOI: 10.1007/978-3-64236458-7_12.
Mirgkizoudi, M, Liu, C, Conway, PP, Riches, S (2013) Combined Temperature and
Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics,
Journal of Microelectronics an Electronic Package, 10(2), pp.80-88, ISSN: 1551-4897.
Liu, J, Liu, C, Conway, PP (2013) Kinetic Monte Carlo simulation of the
electrodeposition of polycrystalline copper: Effects of substrates and deposition
parameters on the microstructure of deposits, Electrochimica Acta, 97, pp.132-142,
ISSN: 0013-4686. DOI: 10.1016/j.electacta.2013.02.112.
Huertas, LA, Rosamond, EL, Conway, PP, West, AA (2013) Sustainable production in
the UK: a tool to support printed circuit assembly (PCA) manufacturing,
INTERNATIONAL JOURNAL OF COMPUTER INTEGRATED MANUFACTURING,
26(4), pp.346-364, ISSN: 0951-192X. DOI: 10.1080/0951192X.2012.717719.
Slawson, SE, Conway, PP, Cossor, J, Chakravorti, N, West, AA (2013) The
categorisation of swimming start performance with reference to force generation on the
main block and footrest components of the Omega OSB11 start blocks, Journal of
Sports Sciences, 31(5), pp.468-478, ISSN: 0264-0414. DOI:
10.1080/02640414.2012.736631.
Chakravorti, N, Le Sage, T, Slawson, SE, Conway, PP, West, AA (2013) Design and
Implementation of an Integrated Performance Monitoring Tool for Swimming to Extract
Stroke Information at Real Time, IEEE TRANSACTIONS ON HUMAN-MACHINE
SYSTEMS, 43(2), pp.199-213, ISSN: 2168-2291. DOI: 10.1109/TSMC.2012.2235428.
Lugo, H, Segura, D, Michopoulos, V, Conway, P, West, A (2013) Secure document and
asset tracking, Journal of Communications Software and Systems, 9(1), pp.24-34,
ISSN: 1845-6421.
Wu, Z, Huang, Z, Xiong, H, Conway, PP, Liu, C (2013) Linkages between
microstructure and mechanical properties of ultrafine interconnects, Journal of
Electronic Materials, 42(2), pp.263-271, ISSN: 0361-5235. DOI: 10.1007/s11664-0122201-8.
Xiong, H, Huang, Z, Conway, P (2013) A Method for Quantification of the Effects of
Size and Geometry on the Microstructure of Miniature Interconnects, Journal of
Electronic Materials, pp.1-12, ISSN: 0361-5235. DOI: 10.1007/s11664-013-2907-2.
Wu, Z, Huang, Z, Conway, P, Qingfeng, Z (2012) An atomistic scale study on
solidification in ultrafine interconnects, 14th International Conference on Electronic
Materials and Packaging, EMAP 2012, DOI: 10.1109/EMAP.2012.6507903.
Xiong, H, Huang, Z, Conway, P, Zeng, Q (2012) Effects of microstructure on vacancy
and stress distributions in micro joints under current stressing, 14th International
Conference on Electronic Materials and Packaging, EMAP 2012, DOI:
10.1109/EMAP.2012.6507913.
Mirgkizoudi, M, Liu, C, Conway, P, Riches, S (2012) Combined temperature and
vibration testing for wire bond interconnections in harsh environment electronics,
Proceedings - IMAPS International Conference and Exhibition on High Temperature
Electronics, HiTEC 2012, pp.335-344.
Lugo, H, Velandia, DMS, Conway, PP, Bindel, A, West, AA (2012) Secure document
and asset tracking, 2012 20th International Conference on Software,
Telecommunications and Computer Networks, SoftCOM 2012.
Zakariyah, SS, Conway, PP, Hutt, DA, Wang, K, Selviah, DR (2012) CO2 laser
micromachining of optical waveguides for interconnection on circuit boards, OPTICS
AND LASERS IN ENGINEERING, 50(12), pp.1752-1756, ISSN: 0143-8166. DOI:
10.1016/j.optlaseng.2012.07.005.
Bindel, A, Conway, PP, West, AA (2012) Information structure required for life-cycle
monitoring of electronic products, Proceedings of the Institution of Mechanical
Engineers, Part B: Journal of Engineering Manufacture, 226(10), pp.1612-1627, ISSN:
0954-4054. DOI: 10.1177/0954405412444195.
Rosamond, EL, Justham, L, Conway, P, West, A, Goodall, P (2012) A Proposed Novel
Knowledge Framework for Remanufacturing Viability in a Modern Supply Chain. In
Stjepandic, J, Rock, G, Bil, C (ed) 19th ISPE International Conference on Concurrent
Engineering, Concurrent Engineering Approaches for Sustainable Product Development
in a Multi-Disciplinary Environment, Trier, pp.861-870, ISBN: 978-1-4471-4426-7.
LeSage, T, Bindel, A, Conway, PP, Slawson, SE, West, AA (2012) Development of a
wireless sensor network for embedded monitoring of human motion in a Harsh
environment. In IEEE 3rd International Conference on Communication Software and
Networks, 8 Sep 2012t, Xi'an, China, pp.112-115, ISBN: 978-1-61284-485-5. Full text:
http://ieeexplore.ieee.org/. DOI: 10.1109/ICCSN.2011.6013555.
Slawson, SE, Chakravorti, N, Conway, PP, Cossor, J, West, AA (2012) The effect of
knee angle on force production, in swimming starts, using the OSB11 Block, Procedia
Engineering, 34, pp.801-806, DOI: 10.1016/j.proeng.2012.04.137.
Bindel, A, Rosamond, E, Conway, P, West, A (2012) Product life cycle information
management in the electronics supply chain, PROCEEDINGS OF THE INSTITUTION
OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING
MANUFACTURE, 226(B8), pp.1388-1400, ISSN: 0954-4054. DOI:
10.1177/0954405412448780.
Conway, PP, Bhatt, D, Hutt, DA (2012) Excimer laser machining of microvias in glass
substrates for the manufacture of high density interconnects, Applied Physics B: lasers
and optics, 108(4), Full text: http://www.springerlink.com/. DOI: 10.1007/s00340-0125106-6.
Cui, X, Hutt, DA, Conway, PP (2012) Evolution of microstructure and electrical
conductivity of electroless copper deposits on a glass substrate, Thin Solid Films,
520(19), pp.6095-6099, ISSN: 0040-6090. DOI: 10.1016/j.tsf.2012.05.068.
Petzing, JN, He, B, Webb, DP, Leach, RK, Conway, PP (2012) The assessment of
areal surface texture parameters for characterizing the adhesive bond strength of
copper plated micro-machined glass.. In 12th International Conference of the European
Society for Precision Engineering & Nanotechnology, Stockholm, Sweden, pp.92-95,
ISBN: 978-0-9566790-0-0. Full text: http://www.euspen.eu/ .
Zakariyah, S, Conway, PP, Hutt, DA, Suyal, N, Selviah, DR (2012) Integrated in-plane
mirror and multimode waveguide fabrication using 248nm excimer laser ablation for
optical interconnects on PCBs, Circuit World, 38(2), pp.59-63, ISSN: 0305-6120. DOI:
10.1108/03056121211222255.
Chakravorti, N, Slawson, SE, Cossor, J, Conway, PP, West, AA (2012) Image
processing algorithms to extract swimming tumble turn signatures in real-time,
Proceedings of the Mediterranean Electrotechnical Conference - MELECON, pp.352355, DOI: 10.1109/MELCON.2012.6196447.
Le Sage, T, Bindel, A, Conway, P, Justham, L, Slawson, S, Webster, J, West, A (2012)
A multi-sensor system for monitoring the performance of elite swimmers,
Communications in Computer and Information Science, 222 CCIS, pp.350-362, ISSN:
1865-0929. DOI: 10.1007/978-3-642-25206-8_23.
Slawson, SE, Justham, LM, Conway, PP, Le-Sage, T, West, AA (2012) Characterizing
the swimming tumble turn using acceleration data, Proceedings of the Institution of
Mechanical Engineers, Part P: Journal of Sports Engineering and Technology, 226(1),
pp.3-15, ISSN: 1754-3371. DOI: 10.1177/1754337111428395.
Flaherty, OM, Cui, X, Rajamohan, D, Hutt, D, Denning, C, Conway, PP, West, AA
(2012) A multi-electrode array (MEA) biochip with excimer laser-produced micro-well
features, Circuit World, 38(1), pp.30-37, ISSN: 0305-6120. DOI:
10.1108/03056121211195030.
Petzing, JN, He, B, Conway, P, Leach, R, Webb, P (2012) The use of areal surface
texture parameters to characterize the mechanical bond strength of copper on glass
plating applications, pp.1-25, National Physical Laboratory, Full text:
http://www.npl.co.uk/ .
Gordon, D, Mullane, SL, Conway, PP, West, AA (2012) Development of a Novel
System for Monitoring Strength and Conditioning in Elite Athletes. In Drane, P and
Sherwood, J (ed) 9th Conference of the International-Sports-Engineering-Association
(ISEA), ENGINEERING OF SPORT CONFERENCE 2012, Univ Massachusetts Lowell,
Lowell, MA, pp.496-501, DOI: 10.1016/j.proeng.2012.04.085.
Slawson, SE, Chakravorti, N, Conway, PP, Cossor, J, West, AA (2012) The Effect of
Knee Angle on Force Production, in Swimming Starts, using the OSB11 Block. In
Drane, P and Sherwood, J (ed) 9th Conference of the International-Sports-EngineeringAssociation (ISEA), ENGINEERING OF SPORT CONFERENCE 2012, Univ
Massachusetts Lowell, Lowell, MA, pp.801-806, DOI: 10.1016/j.proeng.2012.04.137.
Chakravorti, N, Slawson, SE, Cossor, J, Conway, PP, West, AA (2012) Swimming Turn
Technique Optimisation by Real-Time Measurement of Foot Pressure and Position. In
Drane, P and Sherwood, J (ed) 9th Conference of the International-Sports-EngineeringAssociation (ISEA), ENGINEERING OF SPORT CONFERENCE 2012, Univ
Massachusetts Lowell, Lowell, MA, pp.586-591, DOI: 10.1016/j.proeng.2012.04.100.
Petzing, JN, He, B, Conway, P, Webb, P, Leach, R (2012) The use of areal surface
texture parameters to characterize the mechanical bond strength of copper on glass
plating applications, pp.1-25, National Physical Laboratory.
Rathnayake-Arachchige, D, Hutt, DA, Conway, PP, IEEE, (2012) Adhesion
Improvement of Electroless Copper (Cu) Thin Films Deposited on Low Temperature Cofired Ceramics (LTCC). In , 2012 4TH ELECTRONIC SYSTEM-INTEGRATION
TECHNOLOGY CONFERENCE (ESTC).
Flaherty, OM, Cui, X, Rajamohan, D, Anderson, D, Hutt, D, Denning, C, Conway, PP,
West, AA (2011) Fabrication of a novel Multi-Electrode Array (MEA) biochip using
polyester insulated electrodes with microwell features for cardiomyocyte analysis,
EMPC-2011 - 18th European Microelectronics and Packaging Conference,
Proceedings.
Wu, Z, Huang, Z, Conway, PP, MA, Y (2011) Effect of Microstructure on ThermalMechanical Stress in 3D Copper TSV Structures. In Khan, N and Lu, A (ed) 13th IEEE
Electronics Packaging Technology Conference, Singapore, pp.450-454, ISBN: 978-14577-1981-3. Full text: http://ieeexplore.ieee.org/ .
Zakariyah, SS, Conway, PP, Hutt, DA, Selviah, DR, Wang, K, Rygate, J, Calver, J,
Kandulski, W (2011) Fabrication of polymer waveguides by laser ablation using a 355
nm wavelength Nd:YAG laser, Journal of Lightwave Technology, 29(23), pp.3566-3576,
ISSN: 0733-8724. DOI: 10.1109/JLT.2011.2171318.
Lugo, H, Viret, J, Bindel, A, Conway, P, West, A (2011) Distributed monitoring system
for material handling, 2011 International Conference on Software, Telecommunications
and Computer Networks, SoftCOM 2011, pp.87-92.
mullane, S, chakravorti, N, Conway, PP, west, A (2011) Design and implementation of
a user-centric swimming performance monitoring tool, Proc IMechE Part P: J Sports
engineering and Technology, 225(4), pp.213-229, ISSN: 1754-3371. DOI:
10.1177/1754337111405271.
Lugo, H, viret, J, Bindel, A, Conway, PP, West, A (2011) Distributed monitoring system
for material handling. In 19th International Conference on Software,
Telecommunications and Computer Networks, Split, Croatia, pp.1-6, ISBN: 978-1-45771439-9. Full text:
http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6064374&isnumber=606435
4.
Le Sage, T, Bindel, A, Conway, P, Slawson, S, West, A (2011) Development of a
wireless sensor network for embedded monitoring of human motion in a Harsh
environment, 2011 IEEE 3rd International Conference on Communication Software and
Networks, ICCSN 2011, pp.112-115, DOI: 10.1109/ICCSN.2011.6013555.
viret, J, Bindel, A, Conway, PP, Justham, L, Lugo, H, West, AA (2011) Embedded RFID
TAG inside PCB board to improve supply chain management. In Holland, A and
Sinnadurai, N (ed) 18th European Microelectronics Packaging Conference, Brighton
UK, pp.1-5, ISBN: 978-0-9568086-0-8. Full text: http://www.imapseurope.org/ .
Flaherty, OM, Cui, X, Rajamohan, D, Anderson, D, Hutt, DA, Denning, C, Conway, PP,
West, AA (2011) Fabrication of a Novel Multi-Electrode Array (MEA) Biochip Using
Polyester Insulated Electrodes with Microwell Features for Cardiomyocyte Analysis. In
Holland, A and Sinnadurai, N (ed) 18th European Microelectronics Packaging
Conference, Brighton UK, pp.1-6, ISBN: 978-0-9568086-0-8. Full text:
http://www.imapseurope.org/ .
Le Sage, T, Bindel, A, Conway, PP, Justham, LM, Slawson, SE, West, AA (2011)
Embedded programming and real-time signal processing of swimming strokes, Sports
Engineering, 14(1), pp.1-14, ISSN: 1369-7072. DOI: 10.1007/s12283-011-0070-7.
Segura Velandia, DM, West, AA, Conway, PP (2011) A database system for decision
support in low-volume electronics assembly, Proceedings of the Institution of
Mechanical Engineers Part B: Journal of Engineering Manufacture, 225(8), pp.14111430, ISSN: 0954-4054. DOI: 10.1177/2041297510393566.
Webster, JM, West, AA, Conway, PP, Caine, MP (2011) Development of a pressure
sensor for swimming turns. In 5th Asia-Pacific Congress on Sports Technology
(APCST), Melbourne, Australia, pp.126-132, DOI: 10.1016/j.proeng.2011.05.062.
Webster, J, West, AA, Conway, PP, Caine, MP (2011) Development of an automated
cycle ergometer. In 5th Asia-Pacific Congress on Sports Technology (APCST),
Melbourne, Australia, pp.69-74, DOI: 10.1016/j.proeng.2011.05.053.
Slawson, SE, Conway, PP, Cosser, J, Chakravorti, N, Le Sage, T, West, AA (2011)
The effect of start block configuration and swimmer kinematics on starting performance
in elite swimmers using the Omega OSB11 block. In 5th Asia-Pacific Congress on
Sports Technology(APCST), Melbourne, Australia, pp.141-147, DOI:
10.1016/j.proeng.2011.05.064.
Cossor, J, Slawson, SE, Shillabeer, B, Conway, PP, West, AA (2011) ARE LAND
TESTS A GOOD PREDICTOR OF SWIM START PERFORMANCE?. In Vilas-Boas, M,
KIm, L, Veloso, P (ed) 29th Biomechanics in Sport, Porto, Portugal, pp.183-186, Full
text: http://w4.ub.uni-konstanz.de/cpa/index .
slawson, S, Cossor, J, Conway, PP, Chakravorti, N, LeSage, T, West, AA (2011) The
effect of start block configuration and swimmer kinematics on starting performance in
elite swimmers using the Omega OSB11 block, Procedia engineering, 13, pp.141-147,
DOI: 10.1016/j.proeng.2011.05.064.
Huertas-Quintero, LAM, Conway, PP, Segura-Velandia, DM, West, AA (2011) Root
cause analysis support for quality improvement in electronics manufacturing,
ASSEMBLY AUTOMATION, 31(1), pp.38-46, ISSN: 0144-5154. DOI:
10.1108/01445151111104155.
Cui, X, Hutt, DA, Scurr, DJ, Conway, PP (2011) The Evolution of Pd/Sn Catalytic
Surfaces in Electroless Copper Deposition, JOURNAL OF THE ELECTROCHEMICAL
SOCIETY, 158(3), pp.D172-D177, ISSN: 0013-4651. DOI: 10.1149/1.3536543.
Xiong, H, Huang, Z, Wua, Z, Conway, PP (2011) A generalised computational interface
for combined thermodynamic and kinetic modeling, CALPHAD: Computer Coupling of
Phase Diagrams and Thermochemistry, 35, pp.391-395.
Segura Velandia, DM, Conway, PP, Pourtafreshi Monfared, R, West, AA (2011)
Combining business process and failure modelling to increase yield in electronics
manufacturing, Proceedings of the Institution of Mechanical Engineers, Part B: Journal
of Engineering Manufacture, p.18, ISSN: 2041-2975. Full text:
http://dx.doi.org/10.1243/09544054JEM1794. DOI: 10.1243/09544054JEM1794.
Le Sage, T, Conway, P, Justham, L, Slawson, S, Bindel, A, West, A (2010) A
component based integrated system for signal processing of swimming performance,
SIGMAP 2010 - Proceedings of the International Conference on Signal Processing and
Multimedia Applications, pp.73-79.
Huertas Quintero, LAM, Conway, PP, Whalley, DC, West, AA (2010) Deployment of a
Reflow Process Model to Support Quality and Reliability in PCA Manufacturing,, ISBN:
978-1-4244-8561-1.
Huertas Quintero, LAM, Conway, PP, Whalley, DC, West, AA (2010) Deployment of a
Reflow Process Model to Support Quality and Reliability in PCA Manufacturing. In
Proceedings of the 12th IEEE Electronics Packaging Technology Conference (EPTC
2010), IEEE catalog No CFP10453-USB, Singapore, p.6, ISBN: 978-1-4244-8561-1.
Huertas Quintero, LAM, Segura Velandia, DM, Conway, PP, Pourtafreshi Monfared, R,
West, AA (2010) A Framework for Quality Data Capitalisation for UK Electronics
Manufacturing. In Proceedings of the 12th International Conference on Electronics
Materials and Packaging (EMAP), Singapore, p.6.
Huang, Z, Conway, PP, Davies, H, Dinsdale, A, Wu, Z, Wang, B (2010) An Integrated
Materials Modelling Platform for Electronic Packaging. In Proceedings of the 12th
International Conference on Electronics Materials and Packaging (EMAP), Singapore,
p.7.
Huertas Quintero, LAM, Conway, PP, Segura Velandia, DM, West, AA (2010) An
Integrated Approach to Design for Quality (DfQ) in the High Value Added Printed Circuit
Assembly (PCA) Manufacturing: A Pilot Tool. In Proceedings of the 3rd IEEE
International Conference on Electronics Systems and Integration Technologies (ESTC
2010), Berlin, p.6.
Knauf, BJ, Liu, C, Webb, DP, Conway, PP (2010) Polymer Bonding by Induction
Heating for Microfluidic Applications. In Proceedings of the 3rd IEEE International
Conference on Electronics Systems and Integration Technologies (ESTC 2010), Berlin,
p.8.
Le Sage, T, Bindel, A, Conway, PP, Justham, LM, Slawson, SE, West, AA (2010)
Kalman Filter Design for Application to an INS Analysing Swimmer Performance. In
Proceedings of the 18th European Signal Processing Conference (EURASIP), Aalborg,
Denmark, pp.1723-1727.
Knauf, BJ, Webb, DP, Liu, CC, Conway, PP (2010) Low frequency induction heating for
the sealing of plastic microfluidic systems, Microfluidics and Nanofluidics, 9(Issue 2-3),
pp.243-252, ISSN: 1613-4990. DOI: 10.1007/s10404-009-0539-x.
Huertas-Quintero, LAM, Conway, PP, Segura-Velandia, DM, West, AA (2010) A
systems integration perspective to manufacturing modelling and simulation: An
application tool to support electronics manufacturing systems design, 2010 IEEE
International Systems Conference Proceedings, SysCon 2010, pp.415-420, DOI:
10.1109/SYSTEMS.2010.5482347.
Mullane, SL, Justham, LM, West, AA, Conway, PP (2010) Design of an end-user
centric information interface from data-rich performance analysis tools in elite
swimming. In , Procedia Engineering : The Engineering of Sport 8 - Engineering
Emotion, pp.2713-2719, Full text: http://www.sciencedirect.com/science/article/B9869508WXJK-20/2/7b9a0aa7e05fb5f75dc552b562b24e67. DOI:
10.1016/j.proeng.2010.04.056.
Le Sage, T, Bindel, A, Conway, PP, Justham, LM, Slawson, SE, West, AA (2010)
Development of a real time system for monitoring of swimming performance. In ,
Procedia Engineering: The Engineering of Sport 8 - Engineering Emotion, pp.27072712, Full text: http://www.sciencedirect.com/science/article/B9869-508WXJK1Y/2/0f8ad6445efd5f699c459c5d98bdc867. DOI: 10.1016/j.proeng.2010.04.055.
Slawson, SE, Conway, PP, Justham, LM, Le Sage, T, West, AA (2010) Dynamic
signature for tumble turn performance in swimming. In , Procedia Engineering : The
Engineering of Sport 8 - Engineering Emotion, pp.3391-3396, DOI:
10.1016/j.proeng.2010.04.163.
Cosser, J, Slawson, SE, Justham, LM, Conway, PP, West, AA (2010) The
Development of a Component Based Approach for Swim Start Analysis. In Proceedings
of the 11th International Symposium for Biomechanics and Medicine in Swimming,
Oslo, Norway, pp.59-61, ISBN: 978 82 502 0439 3.
Slawson, SE, Conway, PP, Justham, LM, West, AA (2010) The development of an
inexpensive passive marker system for the analysis of starts and turns in swimming. In ,
Procedia Engineering: The Engineering of Sport 8 - Engineering Emotion, pp.PP 18777058, DOI: 10.1016/j.proeng.2010.04.058.
Gong, J, Liu, C, Conway, PP, Silberschmidt, VV (2010) Formation of Ag3Sn plates in
SnAgCu solder bumps, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL
MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 527(10-11),
pp.2588-2591, ISSN: 0921-5093. DOI: 10.1016/j.msea.2009.12.020.
Huertas Quintero, LAM, Conway, PP, Segura Velandia, DM, West, AA (2010) A
systems integration perspective to manufacturing modelling and simulation. In 4th
Annual IEEE International Systems Conference, San Diego, pp.415-420, ISBN: 978-14244-5884-4. Full text: http://dx.doi.org/10.1109/SYSTEMS.2010.5482347. DOI:
10.1109/SYSTEMS.2010.5482347.
Le Sage, T, Conway, PP, Justham, LM, Slawson, SE, Bindel, A, West, AA (2010) A
Component Based Integrated System for Signal Processing of Swimming Performance.
In SIGMAP 2010, International Conference on Signal Processing and Multimedia
Applications [Best student paper award], Athens, Greece.
Huertas Quintero, LAM, Rosamond, EL, Conway, PP, West, AA (2010) A Novel Tool to
Support Manufacturing Sustainability in UK Electronics Manufacturing from a Quality
Perspective. In Proceedings of the 5th International Conference on Advances in
Production Management Systems (APMS), Como, Italy, p.6.
Webb, DP, Jaggernauth, WA, Cottrill, MCW, Palmer, PJ, West, AA, Conway, PP (2010)
Design and construction of large-area flexible printed-circuit automotive electrical
interconnection harnesses, Proceedings of the Institution of Mechanical Engineers, Part
D: Journal of Automobile Engineering, 224(D6), pp.785-797, ISSN: 2041-2991. DOI:
10.1243/09544070JAUTO1175.
Bindel, A, Justham, LM, Conway, PP, Lugo, H, Viret, JGE, West, AA (2010)
Development of an Embedded RFID Tag for End-of-Life Management within an
Electronics Manufacturing Supply Train. In Proceedings of the 5th International
Conference on Advances in Production Management Systems (APMS), Como, Italy,
p.6.
Hin, TY, Liu, C, Conway, PP, Yu, W, Cargill, S, Desmulliez, MPY (2010) Fabrication of
a polymeric optical waveguide-on-flex using electrostatic-induced lithography, IEEE
Photonics Technology Letters, 22(13), pp.957-959, ISSN: 1041-1135. DOI:
10.1109/LPT.2010.2048310.
Selviah, DR, Walker, AC, Hutt, DA, Conway, PP, Chappell, J, Zakariyah, EASS (2010)
Integrated Optical and Electrical Interconnect PCB Manufacturing Research, Circuit
World, 36(2), pp.5-10, DOI: 10.1108/03056121011041654.
Bindel, A, Conway, PP, Justham, LM, West, AA (2010) New lifecycle monitoring system
for electronic manufacturing with embedded wireless components, Circuit World, 36(2),
pp.33-39, DOI: 10.1108/03056121011041681.
Gong, J, Conway, PP, Liu, CC, Silberschmidt, V (2009) Heterogeneous Intragranular
Inelastic Behavior of a Sn-Ag-Cu Alloy, Journal of Electronic Materials, Vol 38(12),
pp.2429-2435, ISSN: 0361-5235. DOI: 10.1007/s11664-009-0941-x.
Liu, J, Liu, C, Conway, PP, Zeng, J, Wang, C (2009) Growth and recrystallization of
electroplated copper columns, 2009 International Conference on Electronic Packaging
Technology and High Density Packaging, ICEPT-HDP 2009, pp.695-700, DOI:
10.1109/ICEPT.2009.5270660.
Webb, DP, Knauf, B, Liu, C, Hutt, D, Conway, P (2009) Productionisation issues for
commercialisation of microfluidic based devices, Sensor Review, 29(4), pp.349-354,
ISSN: 0260-2288. DOI: 10.1108/02602280910986601.
Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP, Pourtafreshi
Monfared, R (2009) Integrated Modelling for Simulation in the Electronics Manufacturing
Domain. In (ISC 2009), Proceedings of the 7th International Industrial Simulation
Conference, Loughborough, UK.
Webb, DP, Conway, PP, Hutt, DA, Knauf, BJ, Liu, CC (2009) Processes for Integration
of Microfluidic Based Devices. In 17th European Microelectronics and Packaging
Conference (EMPC), Rimini, Italy, pp.1-7.
Knauf, BJ, Webb, DP, Liu, CC, Conway, PP (2009) Packaging for Polymer Microfluidic
Systems Using Low Frequency Induction Heating (LFIH). In Proceedings of the 3rd
Annual Lab-on-a-Chip European Congress (LOACEC2009), Stockholm, Sweden, p.27.
Webb, DP, Knauf, BJ, Liu, CC, Hutt, DA, Conway, PP (2009) Productionisation issues
for commercialisation of microfluidic based devices. In Proceedings of Microtech 2009,
Edinburgh, UK, pp.1-10.
Quintero, LAMH, West, AA, Velandia, DMS, Conway, PP, Monfared, R (2009) A
HIERARCHICAL OBJECT-ORIENTED SOFTWARE STRUCTURE FOR
MANUFACTURING SIMULATION. In Das, DB, Nassehi, V, Deka, L (ed) 7th
International Industrial Simulation Conference, 7TH INDUSTRIAL SIMULATION
CONFERENCE 2009, Loughborough, ENGLAND, pp.79-85, ISBN: 978-9-07738-148-9.
Liu, J, Liu, C, Conway, PP, Zeng, J, Wang, C (2009) Growth and Recrystallization of
Electroplated Copper Columns. In Bi, K and Cai, J (ed) International Conference on
Electronic Packaging Technology & High Density Packaging, 2009 INTERNATIONAL
CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY
PACKAGING (ICEPT-HDP 2009), Beijing, PEOPLES R CHINA, pp.619-624, ISBN:
978-1-4244-4658-2.
Huang, Z, Conway, PP, Qin, R (2009) Modeling of interfacial intermetallic compounds
in the application of very fine lead-free solder interconnections, Microsystem
Technologies, 15(1 SPEC. ISS.), pp.101-107, ISSN: 0946-7076. DOI: 10.1007/s00542008-0629-9.
Zakariyah, SS, Conway, PP, Hutt, DA, Selviah, DR, Wang, K, Baghsiahi, H, Rygate, J,
Calver, J, Kandulski, W (2009) Polymer Optical Waveguide Fabrication Using Laser
Ablation. In 11th Electronics Packaging Technology Conference, 2009 11TH
ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), Shangri
La, SINGAPORE, pp.936-941, ISBN: 978-1-4244-5099-2. DOI:
10.1109/EPTC.2009.5416408.
Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2009) Formation of Sn dendrites and
SnAg eutectics in a SnAgCu solder, Scripta Materialia, 61(7), pp.682-685, DOI:
10.1016/J.scriptamat.2009.05.034.
Cui, X, Bhatt, D, Khoshnaw, FM, Hutt, DA, Conway, PP (2009) Glass as a Substrate for
High Density Electrical Interconnect. In 10th International IEEE Electronics Packaging
Technology Conference, Proceedings of the 10th International IEEE Electronics
Packaging Technology Conference, Singapore, December 2008, pp.12-17, ISBN:
9781424421183.
Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2009) Initial formation of CuSn
intermetallic compounds between molten SnAgCu solder and Cu substrate, Scripta
Materialia, 60, pp.333-335.
Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP, Whalley, DC
(2009) Integrated modelling for simulation in the electronics manufacturing domain. In
Proceedings of the 11th Electronics Packaging Technology Conference, Singapore,
pp.260-266, ISBN: 978 1 4244 5099 2. Full text:
http://dx.doi.org/10.1109/EPTC.2009.5416541. DOI: 10.1109/EPTC.2009.5416541.
Liu, J, Liu, CC, Conway, PP (2009) Kinetic Monte Carlo Simulation of Kinetically-limited
Copper Electro-crystallisation on an Atomically Even Surface, Electrochimica Acta,
54(27), pp.6941-6948, DOI: 10.1016/j.electacta.2009.07.019.
Liu, JJ, Liu, CC, Conway, PP (2009) Kinetic Monte Marlo Simulation of
Electrodeposition of Polycrystalline Cu, Electrochemistry Communications, 11(11),
pp.131-135, DOI: 10.1016/j.elecom.2009.09.032.
Webb, DP, Hutt, DA, Hopkinson, N, Conway, PP, Palmer, PJ (2009) Packaging of
microfluidic devices for fluid interconnection using thermoplastics, Journal of
Microelectromechanical Systems, 18(2), pp.354-362, ISSN: 1057-7157. Full text:
http://dx.doi.org/10.1109/JMEMS.2009.2013404. DOI: 10.1109/JMEMS.2009.2013404.
Webb, DP, Knauf, B, Liu, CC, Hutt, DA, Conway, PP (2009) Productionisation issues
for commercialisation of microfluidic based devices, Sensor Review, 29(4), pp.349-354,
ISSN: 0260-2288. Full text: http://dx.doi.org/10.1108/02602280910986601. DOI:
10.1108/02602280910986601.
Hin, TY, Liu, CC, Conway, PP (2009) Surface characterisation of plasma treated
flexible substrates for waveguide-on-flex application, Surface and Coatings Technology,
203, pp.3741-3749, DOI: 10.1016/j.surfcoat.2009.06.015.
Segura Velandia, DM, Pourtafreshi Monfared, R, West, AA, Conway, PP, Whalley, DC,
Huertas Quintero, LAM (2008) Role of CAD Post-Processing in a Quality Tool for Low
Volume High-Complexity Electronics Manufacture. In Proceedings of the 10th
International IEEE Electronics Packaging Technology Conference, Singapore, pp.14361441, ISBN: 978-1-4244-2118-3.
Cui, X, Hutt, DA, Conway, PP (2008) Investigation of the adhesion of electroless
copper to glass substrates. In , Materials Research Society Symposium Proceedings,
pp.19-24, ISBN: 9781615677597.
Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP, Whalley, DC,
Wilson, C, Pourtafreshi Monfared, R (2008) Component Based Simulation as a
Predictive Tool for High Value Added Electronics. In Proceedings of the 2008 European
Electronis Assembly Reliability, Tallin.
Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP, Wilson, AR
(2008) Integrated simulation tool for quality support in low-volume high-complexity
electronics manufacturing domain, International Journal of Production Research, 48(1),
pp.45-68, ISSN: 0020-7543. Full text: http://dx.doi.org/10.1080/00207540802427886.
DOI: 10.1080/00207540802427886.
Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP, Whalley, DC,
Wilson, AR, Pourtafreshi Monfared, R (2008) A simulation module for supporting the
manufacture of high value added electronics manufacturing. In Proceedings of the 2nd
IEEE CPMT Electronic System integration Technology Conference, Greenwich, pp.365370, ISBN: 978-1-4244-2813-7.
Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP, Whalley, DC,
Wilson, AR, Pourtafreshi Monfared, R (2008) A simulation module for supporting the
manufacture of high value added electronics manufacturing. In Proceedings of the 2nd
IEEE CPMT Electronic System integration Technology Conference, Greenwich, UK,
pp.365-370, ISBN: 978-1-4244-2813-7.
Cui, X, Hutt, DA, Conway, PP (2008) An Investigation of Electroless Copper Films
Deposited on Glass. In IEEE Electronics System-Integration Technology Conference,
Proceedings of 2nd IEEE Electronics System-Integration Technology Conference,
London, 1st - 4th September 2008, pp.105-110, ISBN: 978-1-4244-2814-4.
Wilson, AR, West, AA, Segura Velandia, DM, Conway, PP, Whalley, DC, Huertas
Quintero, LAM, Pourtafreshi Monfared, R (2008) Characterization of Printed Solder
Paste Excess and Bridge Related Defects. In Proceedings of the 2nd IEEE CPMT
Electronic Systemintegration Technology Conference, Greenwich, UK, pp.1305-1310,
ISBN: 978-1-4244-2813-7.
Wilson, AR, West, AA, Segura Velandia, DM, Conway, PP, Whalley, DC, Huertas
Quintero, LAM, Pourtafreshi Monfared, R (2008) Characterization of Printed Solder
Paste Excess and Bridge Related Defects. In Proceedings of the 2nd IEEE CPMT
Electronic Systemintegration Technology Conference, Greenwich, pp.1305-1310, ISBN:
978-1-4244-2813-7.
Segura Velandia, DM, West, AA, Conway, PP, Wilson, A, Whalley, DC, Monfared, R,
Huertas Quintero, LAM (2008) Integration Issues in the Development of a Modelling and
Simulation Tool for Low Volume High-Complexity Electronics Manufacture. In
Proceedings of the 2nd IEEE CPMT Electronic Systemintegration Technology
Conference, Greenwich, pp.1097-1102, ISBN: 978-1-4244-2813-7. DOI:
10.1109/ESTC.2008.4684504.
Segura Velandia, DM, West, AA, Conway, PP, Wilson, AR, Whalley, DC, Pourtafreshi
Monfared, R, Huertas Quintero, LAM (2008) Integration Issues in the Development of a
Modelling and Simulation Tool for Low Volume High-Complexity Electronics
Manufacture. In Proceedings of the 2nd IEEE CPMT Electronic Systemintegration
Technology Conference, Greenwich, UK, pp.1097-1102, ISBN: 978-1-4244-2813-7.
Li, JF, Mannan, SH, Clode, MP, Liu, CC, Chen, K, Whalley, DC, Hutt, DA, Conway, PP
(2008) Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P
Coatings for Liquid Solder Interconnects, IEEE Transactions on Components and
Packaging Technologies, 31(3), pp.574-585, DOI: 10.1109/TCAPT.2008.2001160.
Bhatt, D, Williams, K, Hutt, DA, Conway, PP (2008) Excimer laser micromachining of
glass substrates. In , 2008 Conference on Quantum Electronics and Laser Science
Conference on Lasers and Electro-Optics, CLEO/QELS,ISBN: 9781557528599. DOI:
10.1109/CLEO.2008.4552251.
Li, J, Mannan, SH, Clode, MP, Liu, C, Chen, K, Whalley, DC, Hutt, DA, Conway, PP
(2008) Interfacial reaction between molten Sn-Bi based solders and electroless Ni-p
coatings for liquid solder interconnects, IEEE Transactions on Components and
Packaging Technologies, 31(3), pp.574-585, ISSN: 1521-3331. DOI:
10.1109/TCAPT.2008.2001160.
Knauf, JB, Webb, DP, Liu, CC, Conway, PP (2008) Packaging of polymer based
microfluidic systems using low frequency induction heating (LFIH). In Proceedings of
the 2008 International Conference on Electronic Packaging Technology & High Density
Packaging (ICEPT-HDP 2008), Shanghai, PRC, pp.1-6.
Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2008) Evolution of CuSn
intermetallics between molten SnAgCu solder and Cu substrate, Acta Materiala, p.7,
ISSN: 1359-6454. Full text: http://dx.doi.org/10.1016/j.actamat.2008.04.063. DOI:
10.1016/j.actamat.2008.04.063.
Li, D, Conway, PP, Liu, CC (2008) Corrosion characterization of tin-lead and lead free
solders in 3.5 wt.% NaCl solution, Journal of Corrosion Science, 50(4), pp.995-1004,
ISSN: 0010-938X. Full text: http://dx.doi.org/10.1016/j.corsci.2007.11.025. DOI:
10.1016/j.corsci.2007.11.025.
Selviah, DR, Fernández, FA, Papakonstantinou, I, Wang, K, Bagshiahi, H, Walker, AC,
McCarthy, A, Suyal, H, Hutt, DA, Conway, PP, Chappell, J, Zakariyah, SS, Milward, D
(2008) Integrated optical and electronic interconnect printed circuit board
manufacturing, Circuit World, 34(2), pp.21-26, ISSN: 0305-6120. Full text:
http://dx.doi.org/10.1108/03056120810874546. DOI: 10.1108/03056120810874546.
Huang, Z, Conway, PP, Qin, R (2008) Modeling of interfacial intermetallic compounds
in the application of very fine lead-free solder interconnections, Microsystem
Technologies, p.7, ISSN: 1432-1858. Full text: http://dx.doi.org/10.1007/s00542-0080629-9. DOI: 10.1007/s00542-008-0629-9.
Huang, Z, Conway, PP, Thomson, RC, Dinsdale, AT, Robinson, JAJ (2008) A
computational interface for thermodynamic calculations software MTDATA, Journal of
Computer Coupling of Phase Diagrams and Thermochemistry (Calphad), 32(1), pp.129134, ISSN: 0364-5916. Full text: http://dx.doi.org/10.1016/j.calphad.2007.07.003. DOI:
10.1016/j.calphad.2007.07.003.
Pourtafreshi Monfared, R, West, AA, Vera, DA, Conway, PP (2008) Evaluating a new
flexible soldering system for electronics small and medium enterprises, Proceedings of
the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture,
222(2), pp.273-283, ISSN: 0954-4054. Full text:
http://dx.doi.org/10.1243/09544054JEM792. DOI: 10.1243/09544054JEM792.
Li, D, Liu, CC, Conway, PP (2008) Reliability of Fine Pitch Sn-3.8AG-0.7Cu Flip Chip
Solder Joints With Different Connection Pads on PCB, Transactions of the ASME:
Journal of Electronic Packaging, Paper 011005, 130(1), p.7, Full text:
http://dx.doi.org/10.1115/1.2837522. DOI: 10.1115/1.2837522.
Bhatt, D, Williams, K, Hutt, DA, Conway, PP (2008) Excimer laser micromachining of
glass substrates, Optics InfoBase Conference Papers.
Justham, L, Slawson, S, West, A, Conway, P, Caine, M, Harrison, R (2008) Business
process modelling and its use within an elite training environment. In Estivalet, M and
Brisson, P (ed) ISEA 2008 Conference on Engineering of Sport 7, ENGINEERING OF
SPORT 7, VOL 1, Biarritz, FRANCE, pp.73-80, ISBN: 978-2-287-09410-1. DOI:
10.1007/978-2-287-09411-8_9.
Justham, L, Slawson, S, West, A, Conway, P, Caine, M, Harrison, R (2008) Enabling
technologies for robust performance monitoring. In Estivalet, M and Brisson, P (ed)
ISEA 2008 Conference on Engineering of Sport 7, ENGINEERING OF SPORT 7, VOL
1, Biarritz, FRANCE, pp.45-54, ISBN: 978-2-287-09410-1. DOI: 10.1007/978-2-28709411-8_6.
Slawson, SE, Justham, LM, West, AA, Conway, PP, Caine, MP, Harrison, R (2008)
Accelerometer profile recognition of swimming strokes. In Estivalet, M and Brisson, P
(ed) ISEA 2008 Conference on Engineering of Sport 7, ENGINEERING OF SPORT 7,
VOL 1, Biarritz, FRANCE, pp.81-87, ISBN: 978-2-287-09410-1. DOI: 10.1007/978-2287-09411-8_10.
Bhatt, D, Williams, K, Hutt, DA, Conway, PP (2008) Excimer Laser Micromachining of
Glass Substrates. In Conference on Lasers and Electro-Optics/Quantum Electronics
and Laser Science Conference (CLEO/QELS 2008), 2008 CONFERENCE ON LASERS
AND ELECTRO-OPTICS & QUANTUM ELECTRONICS AND LASER SCIENCE
CONFERENCE, VOLS 1-9, San Jose, CA, pp.2623-2624, ISBN: 978-1-55752-859-9.
Knauf, BJ, Webb, DP, Liu, C, Conway, PP (2008) Packaging of Polymer Based
Microfluidic Systems Using Low Frequency Induction Heating (LFIH). In Bi, KY and
Xiao, F (ed) International Conference on Electronic Packaging Technology and High
Density Packaging, 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC
PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2,
Shanghai, PEOPLES R CHINA, pp.57-62, ISBN: 978-1-4244-2739-0.
Vera, DA, Conway, PP, Pourtafreshi Monfared, R, West, AA (2008) Virtual prototyping
of flexible soldering cells for electronics manufacture, Proceedings of the IMechE Part B
Journal of Engineering Manufacture, 222(6), pp.711-722.
Hin, TY, Liu, CC, Conway, PP (2008) Controlling Interfacial Interpenetration of Polymer
Waveguide Deposited on Plasma Treated Flexible Substrate. In 10th International IEEE
Electronics Packaging Technology Conference, Proceedings of the 10th International
IEEE Electronics Packaging Technology Conference, Singapore, 9th - 12th December
2008, pp.828-833, ISBN: 9781424421183.
Pourtafreshi Monfared, R, West, AA, Vera, DA, Conway, PP (2008) Evaluating a new
flexible soldering system for electronics small and medium enterprises, Proceedings of
the IMechE Part B Journal of Engineering Manufacture, 222(2), pp.273-283.
Liu, J, Liu, CC, Conway, PP (2008) Growth Mechanism of Copper Column by
Electrodesposition for Electronic Interconnections. In 2nd International IEEE Electronics
System-Integration Technology Conference, Proceedings of 2nd International IEEE
Electronics System-Integration Technology Conference, London, 1st - 4th September
2008, pp.679-684, ISBN: 9781424428144.
Selviah, DR, Hutt, DA, Walker, AC, Wang, K, Fernandez, FA, Conway, PP, Milward, D,
Papakonstantinou, I, Baghsiahi, H, Chappell, J, Zakariyah, SS, McCarthy, A, Suyal, H
(2008) Innovative optical and Electronic Interconnect Printed Circuit Board
Manufacturing Research. In 2nd International IEEE Electronics System-Integration
Technology Conference, Proceedings of the 2nd International IEEE Electronics SystemIntegration Technology Conference, London, 1st - 4th September 2008, pp.867-872,
ISBN: 9781424428144.
Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2008) Mesomechanical modelling of
SnAgCu solder joints in flip chip, Computational Materials Science, 43(1), pp.199-211,
ISSN: 0927-0256. Full text: http://dx.doi.org/10.1016/j.commatsci.2007.07.039. DOI:
10.1016/j.commatsci.2007.07.039.
Knauf, BJ, Webb, DP, Liu, CC, Conway, PP (2008) Plastic Packaging Using Low
Frequency Induction Heating (LFIH) for Microsystems. In 10th International IEEE
Electronics Packaging Technology Conference, Proceedings of the 10th International
IEEE Electronics Packaging Technology Conference, Singapore, 9th - 12th December
2008, pp.172-180, ISBN: 9781424421183.
Segura Velandia, DM, Pourtafreshi Monfared, R, West, AA, Conway, PP, Whalley, DC,
Huertas Quintero, LAM (2008) Role of CAD Post-Processing in a Quality Tool for Low
Volume High-Complexity Electronics Manufacture. In 10th International IEEE
Electronics Packaging Technology Conference, Proceedings of the 10th International
IEEE Electronics Packaging Technology Conference, Singapore, 9th - 12th December
2008, pp.1436-1441, ISBN: 9781424421183.
Hin, TY, Liu, CC, Conway, PP (2008) The Effect of Surface Modification on Adhesion of
Polymer Waveguide on Flexible Substrate. In 2nd International IEEE Electronics
System-Integration Technology Conference, Proceedings of the 2nd International IEEE
Electronics System-Integration Technology Conference, London, 1st - 4th September
2008, pp.969-976, ISBN: 9781424428144.
Chappell, J, Hutt, DA, Conway, PP (2008) Variation in the Line Stability of an Inkjet
Printed Optical Waveguide-Applicable Material. In 2nd International IEEE Electronics
System-Integration Technology Conference, Proceedings of the 2nd International IEEE
Electronics System-Integration Technology Conference, London, 1st - 4th September
2008, pp.1267-1272, ISBN: 9781424428144.
Hin, TY, Liu, C, Conway, PP (2007) 3D approaches of optical waveguide fabrication on
flexible substrate and its application, 16th European Microelectronics and Packaging
Conference and Exhibition 2007, EMPC 2007, pp.50-55.
Cui, X, Bhatt, D, Hutt, DA, Williams, K, Conway, PP (2007) Copper deposition and
patterning for glass substrate manufacture. In Proceedings of the 9th Electronics
Packaging Technology Conference, EPTC, Singapore, pp.37-42, ISBN: 1-4244-1323-0.
Khoshnaw, F, Conway, PP, Hutt, DA, Williams, K (2007) Glass multilayer lamination for
PCB manufacture using pressure assisted low temperature bonding. In Proceedings of
the 9th Electronics Packaging Technology Conference, EPTC, Singapore, pp.504-509,
ISBN: 1-4244-1323-0.
Huang, Z, Conway, PP, Thomson, RC (2007) Microstructural considerations for
ultrafine lead free solder joints, Journal of Microelectronics Reliability, 47(12), pp.19972006, ISSN: 0026-2714. Full text: http://dx.doi.org/doi:10.1016/j.microrel.2007.04.013.
DOI: 10.1016/j.microrel.2007.04.013.
Bhatt, D, Williams, K, Hutt, DA, Conway, PP (2007) Process optimisation and
characterisation of excimer laser drilling of microvias in glass. In Proceedings of the 9th
Electronics Packaging Technology Conference, EPTC, Singapore, pp.196-201, ISBN:
1-4244-1323-0.
Huang, Z, Conway, PP, Taplin, L (2007) Intermetallic Compounds and Void Formation
in Pb-free Solders on Different Metallizations, Pb-Free and RoHS-Compliant Materials
and Processes for Microelectronics. In ed, EC (ed) Proceedings of the Materials
Research Society Symposium, Warrendale, Philadelphia, USA. Full text:
http://www.mrs.org/s_mrs/sec_subscribe.asp?CID=8782&DID=194316 .
Segura Velandia, DM, West, AA, Conway, PP, Wilson, AR, Whalley, DC (2007)
Complex Low Volume Electronics Simulation Tool to Improve Yield and Reliability. In
Proceedings of the 32nd International Electronics Manufacturing Technology (IEMT),
Session 1: Manufacturing and Test Technology, San Jose, California, USA, pp.1-7.
Thomas, RJ, Chandra, A, Liu, Y, Hourd, P, Conway, PP, Williams, DJ (2007)
Manufacture of a human mesenchymal stem cell population using an automated cell
culture platform, Cytotechnology, 55(1), pp.31-39, ISSN: 0920-9069. Full text:
http://dx.doi.org/10.1007/s10616-007-9091-2. DOI: 10.1007/s10616-007-9091-2.
Huang, Z and Conway, PP (2007) Modelling of interfacial intermetallic compounds in
the applications (Keynote Paper). In Proceedings of the 6th Micro Nano Reliability
Conference 2007, Berlin, Germany, pp.105-106.
Liu, CC, Huang, Z, Conway, PP, Thomson, RC (2007) Materials behaviour and
intermetallics characteristics in the reaction between SnAgCu and Sn¿Pb solder alloys,
Journal of Materials Science, 42(11), pp.4076-4086, ISSN: 0022-2461. Full text:
http://dx.doi.org/10.1007/s10853-006-1335-6. DOI: 10.1007/s10853-006-1335-6.
Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2007) Modeling of thermal stress in
Sn-Ag-Cu solder joint in flip chip. In Chao, CK and eds, CYL (ed) Proceedings of the
Seventh International Congress on Thermal Stresses, TS2007, Taipei, Taiwan, pp.433436, ISBN: 978-986-00-9556-2.
Him, TY, Liu, CC, Conway, PP (2007) A Review on 3D Integrated Approaches in
Multimode Optical Polymeric Waveguide Fabrication. In Proceedings of the 57th IEEE
Electronic Components and Technology Conference, Reno, Nevada, USA, pp.17371741, ISBN: 1-4244-0985-3.
Liu, J, Liu, CC, Conway, PP (2007) Crystallographic Features of Copper Column
Growth by Reversible Pulse Current Electrodeposition. In Proceedings of the 57th IEEE
Electronic Components and Technology Conference, Reno, Nevada, USA, pp.892-897,
ISBN: 1-4244-0985-3.
Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2007) Crystallographic Structure and
Mechanical Behaviour of SnAgCu Solder Interconnects under a Constant Loading Rate.
In Proceedings of the 57th IEEE Electronic Components and Technology Conference,
Reno, Nevada, USA, pp.677-683, ISBN: 1-4244-0985-3.
Segura Velandia, DM, West, AA, Conway, PP, Whalley, DC (2007) A Modelling
Framework for the Reliability of Safety Critical Electronics, Keynote Paper. In
Proceedings of the 8th International Conference on Thermal, Mechanical and
Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems,
EuroSimE, London, UK, pp.2-6, ISBN: 1-4244-1106-8.
Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2007) Micromechanical modelling of
SnAgCu solder joint under cyclic loading: Effect of grain orientation, Computational
Materials Science, 39(1), pp.187-197, Full text:
http://dx.doi.org/doi:10.1016/j.commatsci.2006.02.020. DOI:
10.1016/j.commatsci.2006.02.020.
Huang, Z and Conway, PP (2007) A Comparative Study of numerical Methods and
Computational Tools for Phase Field Equations of Solidification. In Proceedings of the
136th TMS Annual Meeting, Advances in Computational Materials Science and
Engineering Methods, Orlando, Florida, USA, pp.1-9, ISBN: 978-0-873396677. Full text:
http://doc.tms.org/servlet/ProductCatalog?category=07-6677 .
Webb, DP, Liu, CC, Sarvar, F, Conway, PP, Williams, K (2007) Adhesion of Precision
Welded Lead-Free Electrical Interconnects Formed by Molten Droplet Deposition,
Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering
Manufacture, 221(2), pp.303-315, ISSN: 0954-4054. Full text:
http://dx.doi.org/10.1243/09544054JEM365. DOI: 10.1243/09544054JEM365.
Hutt, DA, Williams, K, Conway, PP, Khoshnaw, FM, Cui, X, Bhatt, D (2007) Challenges
in the manufacture of glass substrates for electrical and optical interconnect, CIRCUIT
WORLD, 33(1), pp.22-30, ISSN: 0305-6120. DOI: 10.1109/03056120710723689.
Hutt, DA, Williams, K, Conway, PP, Khoshnaw, FM, Cui, X, Bhatt, D (2007) Challenges
in the manufacture of glass substrates for electrical and optical interconnect, Circuit
World, 33(1), pp.22-30, ISSN: 0305-6120. Full text:
http://dx.doi.org/10.1108/03056120710723689. DOI: 10.1108/03056120710723689.
Tan, X, Chen, X, Conway, PP, Yan, XT (2007) Effects of plies assembling textile
composite cellular structures, Journal of Materials and Design, 28, pp.857-870, ISSN:
0261-3069. Full text: http://dx.doi.org/10.1016/j.matdes.2005.10.016. DOI:
10.1016/j.matdes.2005.10.016.
Segura Velandia, DM, West, AA, Conway, PP, Whalley, DC (2006) A Case-Based
Reasoning Approach for Low Volume, High Added Value Electronics. In Proceedings of
the 8th IEEE Electronics Packaging Technology Conference, Singapore, pp.843-848,
ISBN: 1-4244-0665-X.
Pourtafreshi Monfared, R, West, AA, Vera, DA, Conway, PP (2006) Flexible Soldering
Cells for Small Batch Productions. In Proceedings of the 8th IEEE Electronics
Packaging Technology Conference, Singapore, pp.249-254, ISBN: 1-4244-0665-X.
Liu, C, Hendriksen, MW, Hutt, DA, Conway, PP, Whalley, DC (2006) Materials and
Processes Issues in Fine Pitch Eutectic Solder Flip Chip Interconnection, IEEE
Transactions on Components and Packaging Technologies, 29(4), pp.869-876, ISSN:
1521-3331. Full text: http://dx.doi.org/10.1109/TCAPT.2006.885973. DOI:
10.1109/TCAPT.2006.885973.
Vera, DA, Pourtafreshi Monfared, R, West, AA, Conway, PP (2006) Novel Approach to
Reflow Oven Design to Control and Optimise Lead Free Soldering Process. In
Proceedings of the 8th IEEE Electronics Packaging Technology Conference, Singapore,
pp.512-517, ISBN: 1-4244-0665-X.
Li, D, Liu, C, Conway, PP (2006) Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder
joints with different connection pads, 2006 Conference on High Density Microsystem
Design and Packaging and Component Failure Analysis, HDP'06, pp.108-114.
Hutt, DA, Williams, K, Conway, PP, Khoshnaw, FM, Cui, X, Bhatt, D (2006) Challenges
in the Manufacture of Glass Substrates for Electrical and Optical Interconnect. In
Proceedings of the 1st IEEE Electronics Systemintegration Technology Conference,
Dresden, Germany, pp.1279-1285, ISBN: 1-4244-0552-1.
Sarvar, F, Whalley, DC, Conway, PP (2006) Thermal Interface Materials - A Review of
the State of the Art. In Proceedings of the 1st IEEE Electronic Systemintegration
Technology Conference, Dresden, Sept 5 - 7, 2006, Dresden, pp..p. 1292-1302, ISBN:
1-4244-0553-X.
Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2006) Modelling of Ag3Sn coarsening
and its effect on creep of Sn-Ag eutectics, Journal of Materials Science and Engineering
A, 427(1-2), pp.60-68, ISSN: 0921-5093. Full text:
http://www.sciencedirect.com/science/article/B6TXD-4K4PSRS2/2/357080144405d4597e6746a3d2c8d612. DOI: 10.1016/j.msea.2006.04.034.
Li, D, Liu, C, Conway, PP (2006) Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder
joints with different connection pads. In Proceedings of the 2006 IEEE High Density
Microsystem Design and Packaging and Component Failure Analysis (HDP, 2006),
Shanghai, China, pp.159-165, ISBN: 1-4244-0488-6.
Li, D, Liu, C, Conway, PP (2006) Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder
joints with different connection pads,, ISBN: 1-4244-0488-6.
Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2006) Grain features of SnAgCu solder
and their effect on mechanical behaviour of microjoints. In Proceedings of the IEEE
Electronics Components and Technology Conference (ECTC'56), San Diego, CA, USA,
pp.250-257.
Huang, Z, Conway, PP, Thomson, RC (2006) Microstructural considerations for
ultrafine lead free solder joints. In Proceedings of the 7th International Conference on
Thermal, Mechanical and Multi-Physics Simulation and Experiments in MicroElectronics and Micro-Systems (EuroSimE 2006), Como (Milan), Italy, pp.740-747,
ISBN: 1-4244-0275-1.
Huang, Z, Conway, PP, Thomson, RC (2006) Microstructural considerations for
ultrafine lead free solder joints,, ISBN: 1-4244-0276-x.
Li, DZ, Liu, CQ, Conway, PP (2006) Microstructure and shear strength evolution of SnAg-Cu solder bumps during aging at different temperatures, JOURNAL OF
ELECTRONIC MATERIALS, 35(3), pp.388-398, ISSN: 0361-5235. DOI:
10.1007/BF02690524.
Li, D, Liu, C, Conway, PP (2006) Microstructure and Shear Strength Evolution of SnAg-Cur Solder Bumps during Aging at Different Temperatures, Journal of Electronic
Materials, 35(3), pp.388-398.
Huang, Z, Conway, PP, Liu, C, Thomson, RC (2006) Modeling the interdependence of
processing and alloy composition on the evolution of microstructure in Sn-based leadfree solders in fine pitch flip chip, IEEE Transactions on Components and Packaging
Technologies, 29(1), pp.98-104, ISSN: 1521-3331. Full text:
http://dx.doi.org/10.1109/TCAPT.2005.850538. DOI: 10.1109/TCAPT.2005.850538.
Gong, J, Liu, C, Conway, PP, Silberschmidt, VV (2006) Anaiysis of stress distribution in
SnAgCu solder joint. In Keogh, PS (ed) 6th International Conference on Modern
Practice in Stress and Vibration Analysis, Modern Practice in Stress and Vibration
Analysis VI, Proceedings, Univ Bath, Bath, ENGLAND, pp.359-366, ISBN: 0-87849418-9.
Gong, J, Liu, C, Conway, PP, Silberschmidt, VV (2006) Mechanical behaviour of grains
in SnAgCu solder joints. In International Conference on Electronic Materials and
Packaging, 2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS
AND PACKAGING, VOLS 1-3, Kowloon, PEOPLES R CHINA, pp.230-250, ISBN: 9781-4244-0833-7.
Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2006) Analysis of Stress Distribution in
SnAgCu Solder Joint, Applied Mechanics and Materials, 5-6, pp.359-366, ISSN: 16609336.
Conway, PP (2006) Associate Editor, IEEE Transactions on Electronic Packaging
Manufacturing. Full text: http://www.cpmt.org/trans/tans-epm.html .
Webb, DP, Hutt, DA, Hopkinson, N, Palmer, PJ, Conway, PP (2006) Integration and
packaging of microsystems by polymer overmoulding. In Proceedings of the 1st
Electronics Systemintegration Technology Conference, Dresden, Germany, pp.567-574.
Huang, Z, Conway, PP, Jung, E, Thomson, RC, Liu, C, Loeher, T, Minkus, M (2006)
Reliability Issues in Pb-Free Solder Joint Miniaturization, Journal of Electronic Materials,
35(9), pp.1761-1772, ISSN: 0361-5235.
Li, D, Liu, C, Conway, PP (2005) Interfacial reactions between Pb-free solders and
metallised substrate surfaces, 2005 6th International Conference on Electronics
Packaging Technology, 2005, DOI: 10.1109/ICEPT.2005.1564636.
Webb, DP, Hsu, CC, Hutt, DA, Hopkinson, N, Conway, PP, Palmer, PJ (2005) Polymer
overmoulding for microfluidic device packaging and system integration. In Proceedings
of the 5th International Conference on Polymers and Adhesives in Microelectronics and
Photonics, Wroclaw, Poland, pp.134-139, ISBN: 0-7803-9553-0.
Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2005) Micromechanical modelling of
Sn-Ag-Cu solder joint under cycling loading. In Proceedings of the 15th International
Workshop on Computational Mechanics of Materials (IWCMM15), Dussledorf,
Germany.
Tan, X, Conway, PP, Sarvar, F (2005) Thermo-mechanical properties and regression
models of alloys: AISI 305, CK 60, CuBe2 and Laiton MS 63, Journal of Materials
Processing Technology, 168(1), pp.152-163, ISSN: 0924-0136. Full text:
http://dx.doi.org/10.1016/j.jmatprotec.2004.11.011. DOI:
10.1016/j.jmatprotec.2004.11.011.
Li, J, Mannan, SH, Clode, MP, Liu, C, Chen, K, Whalley, DC, Hutt, DA, Conway, PP
(2005) Molten Solder Interconnects I: Evaluation of Sn-Bi-X/Cu systems and failure
mechanisms of LGA assemblies. In Proceedings of The International Conference on
High Temperature Electronics, Paris, France.
Chen, K, Li, J, Liu, C, Whalley, DC, Hutt, DA, Conway, PP, Mannan, SH, Clode, MP,
Lobato, HM (2005) Molten Solder Interconnects II: Reactions between Ni-P substrates
and Sn-Bi based solders. In Proceedings of The International Conference on High
Temperature Electronics, Paris, France.
Li, D, Liu, C, Conway, PP (2005) Interfacial reactions between Pb-free solders and
metallised substrate surfaces, IEEE Catalog No 05EX1194. In Proceedings of
International Conference on Electronics Packaging Technology (ICEPT'05), Shenzhen,
China, pp.360-365, ISBN: 0-7803-9449-6.
Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2005) Modelling of Ag3Sn coarsening
and its effect on creep of Sn-Ag eutectics. In Proceedings of EUROMECH 466
Computational and Experimental Mechanics of Advanced Materials, Loughborough, UK.
Liu, C, Hutt, DA, Li, D, Conway, PP (2005) Effect of microstructural characteristics of
electroless nickel metallization on solderability to Pb-free solder alloys. In ASME
InterPACK2005, Proceedings of the Pacific Rim Technical Conference and Exhibition
on Integration and Packaging of MEMS, NEMS adn Electronic Systems, San Francisco,
USA, pp.-, ISBN: 0-7918-3762-9.
Conway, PP and Huang, Z (2005) Impacts of Pb-free legislation on European HDP. In
Proceedings of the 7th IEEE CPMT Conference on High Density Microsystem Design,
Packaging and Failure Analysis, Keynote Lecture, Shanghai, P.R. China, pp.18-24,
ISBN: 0-7803-9292-2.
Conway, PP and Huang, Z (2005) Impacts of Pb-free legislation on European HDP,,
ISBN: 0-7803-9293-0.
Li, D, Liu, C, Conway, PP (2005) Solderability of electroless deposited Ni-P coatings
with Sn-3.8Ag-0.7Cu and Sn-3.5Ag lead-free solder alloys, Circuit World, 31(3), pp.3239, ISSN: 0305-6120. DOI: 10.1108/03056120510585054.
Kay, RW, de Gouruff, E, Desmulliez, MPY, Jackson, GJ, Steen, HAH, Liu, C, Conway,
PP (2005) Stencil printing technology for wafer level bumping at sub-100 micron pitch
using Pb-free alloys. In ECTC, Proceedings of the 55th Electronics Components and
Technology Conference (ECTC'55), Lake Buena Vista, FL, USA, pp.848-854.
Kay, RW, de Gouruff, E, Desmulliez, MPY, Jackson, GJ, Steen, HAH, Liu, C, Conway,
PP (2005) Stencil printing technology for wafer level bumping at sub-100 micron pitch
using Pb-free alloys,.
Palmer, PJ, Sarvar, F, Conway, PP, Jaggernauth, WA, Olseger, M (2005) A Roadmap
for an Efficient Urban Delivery System - A case study of a technical project in a rapidly
developing market. In Proceedings of the Japanese Society of Automotive Engineers
Conference, JSAE 2005, Tokyo, Japan, pp.25-27.
Kay, RW, de Gourff, E, Abraham, E, Desmulliez, MPY, Jackson, GJ, Steen, HAH, Liu,
C, Conway, PP (2005) Stencil printing for fine pitch wafer level bumping. In
Proceedings of the SEMICON Europa 2005 : Advanced Packaging Conference,
Munich, Germany.
Kay, RW, de Gourff, E, Abraham, E, Desmulliez, MPY, Jackson, GJ, Steen, HAH, Liu,
C, Conway, PP (2005) Stencil printing for fine pitch wafer level bumping,.
Huang, Z, Conway, PP, Liu, C, Thomson, RC (2005) Effect of solder bump geometry
on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during
solder dipping, Journal of Materials Research, 20(3), pp.649-658, ISSN: 0884-2914. Full
text: http://dx.doi.org/10.1557/JMR.2005.0078. DOI: 10.1557/JMR.2005.0078.
Li, D, Liu, C, Conway, PP (2005) Characteristics of intermetallics and micromechanical
properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects, Materials
Science & Engineering A, 391(1-2), pp.95-103, ISSN: 0921-5093. Full text:
http://dx.doi.org/10.1016/j.msea.2004.10.007. DOI: 10.1016/j.msea.2004.10.007.
Liu, C, Hutt, DA, Li, D, Conway, PP (2005) Effect of microstructural characteristics of
electroless nickel metallisation on solderability to Pb-free solder alloys. In ASME/Pacific
Rim Technical Conference on Integration and Packaging of MEMS, NEMS, and
Electronic Systems, ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C, San
Francisco, CA, pp.1819-1825, ISBN: 0-7918-4200-2. DOI: 10.1115/IPACK2005-73160.
Conway, PP (2005) Associate Editor, IEEE Transactions on Electronics Packaging
Manufacturing. Full text: http://www.cpmt.org/trans/trans-epm.html .
Conway, PP, Smith, PR, Summers, R, Conway, J, Price, R (2005) e-Medic: Integrated
Drug Delivery, p.21, ERSRC.
Webb, DP, Hutt, DA, Hopkinson, N, Palmer, PJ, Conway, PP (2005) Robust, massmanufacture friendly fluidic interconnects for microfluidic packaging and system
integration. In Reichl, HE (ed) Proceedings of Micro System Technologies 2005,
Munich, Germany, pp.260-267, ISBN: 3-7723-7040-3.
Li, D, Liu, C, Conway, PP (2005) Solderability of electroless deposited Ni-P coatings
with Sn-3.8Ag-0.7Cu and Sn-3.5Ag lead-free solder alloys, Circuit World, 13(3), pp.3239, ISSN: 0305-6120.
Webb, DP and Conway, PP (2004) FFD Copper Plating Process Phase 2, Part 2.2:
Completion of Alternating Polarities and Plate-etch Processing, p.8, Consultancy
Report, TDAO Ltd, Project No: WS/TDA/528.
Huang, Z, Conway, PP, Liu, C, Thomson, RC (2004) The effect of microstructural and
geometrical features on the reliability of ultrafine flip chip microsolder joints, Journal of
Electronic Materials, 33(10), pp.1227-1235, ISSN: 1543-186X. Full text:
http://dx.doi.org/10.1007/s11664-004-0126-6. DOI: 10.1007/s11664-004-0126-6.
Liu, C, Conway, PP, Li, D, Hendriksen, M (2004) Analysis of the micro-mechanical
properties in aged lead-free, fine pitch flip chip joints, Journal of Electronic Packaging,
126(3), pp.359-366, ISSN: 1043-7398. Full text: http://dx.doi.org/10.1115/1.1773391.
DOI: 10.1115/1.1773391.
Webb, DP, Jaggernauth, WA, Cottrill, MCW, West, AA, Conway, PP, Palmer, PJ (2004)
Electromagnetic Compatibility Performance of Large Area Flexible Printed Circuit
Automotive Harness, Proceedings of the Institution of Mechanical Engineers, Part D:
Journal of Automobile Engineering, 218(7), pp.667-673, ISSN: 0954-4070. Full text:
http://dx.doi.org/10.1243/0954407041580102. DOI: 10.1243/0954407041580102.
Huang, Z, Liu, C, Conway, PP, Thomson, RC (2004) Characterisation of Intermetallics
and Mechanical Behaviour in the Reaction between SnAgCu and Sn-Pb Solder Alloys.
In IEE Catalog No. 04EX905C, Proceedings of 6th Conference on High Density
Microsystem Design and Packaging and Component Failure Analysis (HDP'04),
Shanghai, China, pp.667-673, ISBN: 0-7803-8621-3.
Liu, C, Hendriksen, MW, Hutt, DA, Conway, PP, Whalley, DC (2004) Materials and
Processes Issues in Fine Pitch Eutectic Solder Flip Chip Interconnection. In IEE Catalog
No 04EX905C, Proceedings of 6th Conference on High Density Microsystem Design
and Packaging and Component Failure Analysis (HDP'04), Shanghai, China, pp.667673, ISBN: 0-7803-8621-3.
Liu, C, Huang, Z, Conway, PP, Thomson, RC (2004) Materials Behaviour and
Intermetallics Characteristics in the Reaction Between SnAgCu and Sn-Ph Solder
Alloys. In Proceedings of the 54th Electronics Components and Technology Conference
(ECTC'54), Las Vegas, Nevada, USA, pp.1347-1353.
Li, D, Liu, C, Conway, PP (2004) Micromechanical Characterisation of Sn-Ag-Cu Solder
FCOB Interconnects at Ambient and Elevated Temperatures. In Proceedings of the 54th
Electronics Components and Technology Conference (ECTC'54), Las Vegas, Nevada,
USA, pp.128-133.
Gwyer, D, Misselbrook, P, Philpott, D, Bailey, C, Conway, PP, Williams, K (2004)
Thermal, mechanical and optical modelling of VCSEL packaging. In Ramakrishna, K
and Sammakia, BGEAV2 (ed) 9th Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems (ITHERM 2004), Las Vegas, NV,
pp.405-410, ISBN: 0-7803-8357-5.
Gwyer, D, Misslebrook, P, Bailey, P, Conway, PP, Williams, K (2004) Polymer
waveguide and VCSEL array multi-physics modelling for OECB based optical
backplanes. In Ernst, LJ and Zhang, GQEA (ed) 5th International Conference on
Thermal and Mechanical Simulation and Experiemtns in Microelectronics and
Microsystems, Brussels, Belguim, pp.399-406, ISBN: 0-7803-8420-2.
Price, S, Summers, R, Conway, PP, Palmer, PJ (2004) Technology Roadmapping: A
New Perspective. In Scapolo, F and Cahill, EE (ed) EU-US Scientific Seminar on New
Technology Foresight, Forecasting and Assessment Methods, Seville, Spain, pp.67-76.
Misselbrook, P, Gwyer, D, Philpott, D, Bailey, C, Conway, PP, Williams, K (2004)
Interconnection Technology for Opto-electrical Circuit Board Applications. In
Proceedings of I-MAPS MicroTech 2004, Interconnection and Packaging, Cambridge,
UK, p.9.
Liu, C, Hendriksen, MW, Hutt, DA, Conway, PP, Whalley, DC (2004) Materials and
processes issues in fine pitch eutectic solder flip chip interconnection. In 6th IEEE
CPMT Conference on High Density Microsystem Design and Packaging and
Component Failure Analysis (HDP 04), PROCEEDINGS OF THE SIXTH IEEE CPMT
CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING
AND COMPONENT FAILURE ANALYSIS (HDP'04), Shanghai, PEOPLES R CHINA,
pp.213-220, ISBN: 0-7803-8620-5. DOI: 10.1109/HPD.2004.1346700.
Conway, PP (2004) Associate Editor, IEEE Transactions on Electronics Packaging
Manufacturing. Full text: http://www.cpmt.org/trans/trans-epm.html .
Smith, PR, Kusmartseva, OE, Conway, J, Price, R, Morton David, AV, Conway, PP,
Summers, R (2003) E-Medic: Linking Informatics to a Dry Powder Inhalation System. In
DDL14, Drug Delivery to the Lungs XIV, London, pp.4-7.
Gwyer, D, Misselbrook, P, Philpott, D, Bailey, C, Conway, PP, Williams, K (2003)
VCSEL to waveguide coupling for optical backpanes. In Iyer, MK, Chaun, TK, Cheong,
MY (ed) Proceedings of the 5th Electronics Packaging Technology Conference (EPTC
2003), Singapore, pp.641-646, ISBN: 0-7803-8205-6.
Li, D, Liu, C, Conway, PP (2003) Direct Soldering onto the UBM of Electroless
Deposited Ni-Pb-free Alloys. In Proceedings of EMAP 2003 (International Symposium
on Electronic Materials and Packaging), Singapore, pp.269-276, ISBN: 981-05-0078-5.
Huang, Z, Conway, PP, Liu, C, Thomson, RC (2003) Thermodynamic and Kinetic
Behaviour of Materials in Micro Joints Formed with Sn-Pb and Pb free Solders. In
Proceedings of EMAP 2003 (International Symposium on Electronic Materials and
Packaging), Winner of Cookson Electronics Paper Award, Singapore, pp.33-40, ISBN:
981-05-0078-5.
Teh, NJ, Jones, MD, Bevan, D, Cleathero, IC, Kioul, A, Schmidt, O, Conway, PP,
Prosser, S, Palmer, PJ (2003) Re-engineering of Thermoplastic Injection Moulding
Process for Electronics Encapsulation in Automotive Applications. In Proceedings of the
5th International Conference on Electronics Materials and Packaging (EMAP 2003),
Singapore, pp.46-53, ISBN: 981-05-0078-5.
Carrott, AJ, West, AA, Conway, PP, Cottrill, MCW (2003) Business Case Modelling of
Large Area Flexible Circuits in the Foresight Vehicle Program, SAE Transactions 2002:
Journal of Passenger Cars - Electronic and Electrical Systems, Paper No 2002-011128, pp.627-632.
Teh, NJ, Sarvar, F, Conway, PP (2003) Design of a Turbulence-enhanced
Deaggregation System for Dry Powder Formulations. In Proceedings of the 25th IEEE
Engineering in Medical and Biological Sciences Annual International Conference,
Cancun, Mexico, pp.3866-3869, ISBN: 0-7803-7790-7.
Teh, NJ, Sarvar, F, Conway, PP (2003) Design of a Turbulence-enhanced
Deaggregation System for Dry Powder Formulations,, ISBN: 0-7803-7790-7.
Cottrill, MCW, Jaggernauth, WA, Webb, DP, Palmer, PJ, Conway, PP, West, AA (2003)
Foresight Vehicle: Large Area Flexible Circuits for Automotive Applications
Manufacturing Technology, A Review of Process Options, SAE Transactions 2002:
Journal of Passenger Cars - Electronic and Electrical Systems, Paper No 2002-011127, pp.618-626, Full text: http://www.sae.org/technical/papers/2002-01-1127 .
Webb, DP, Cottrill, MCW, Jaggernauth, WA, West, AA, Palmer, PJ, Conway, PP (2003)
Foresight Vehicle: Physical Media for Automotive Multiplex Networks Implemented on
Large Area Flexible Printed Circuit Boards, SAE Transactions 2002: Journal of
Passenger Cars - Electronic and Electrical Systems, Paper No 2002-01-1130, pp.638642, Full text: http://www.sae.org/technical/papers/2002-01-1130 .
Jaggernauth, WA, Webb, DP, Cottrill, MCW, Palmer, PJ, Conway, PP, West, AA (2003)
Foresight Vehicle: Specification and Acceptability Criteria for Copper-Clad Dielectric
Materials Used in Large Automotive Flexible Printed Circuits, SAE Transactions 2002:
Journal of Passenger Cars - Electronic and Electrical Systems, Paper No 2002-011129, pp.633-637, Full text: http://www.sae.org/technical/papers/2002-01-1129 .
Liu, C, Conway, PP, Li, D, Hendriksen, M (2003) Analysis of the Micro-Mechanical
Properties in Aged Lead-Free Fine Pitch Flip Chip Joints. In Proceedings of the
ASME/JSME IPACK03 International Electronic Packaging Technical Conference, ASME
Catalogue No I644CD, Maui, Hawaii, USA, p.7, ISBN: 0-7918-3674-6.
Liu, C, Conway, PP, Li, D, Hendriksen, M (2003) Analysis of the Micro-Mechanical
Properties in Aged Lead-Free Fine Pitch Flip Chip Joints,, ISBN: 0-7918-3674-6.
Yi, S, Whalley, DC, Conway, PP (2003) Foreword, IEEE TRANSACTIONS ON
ELECTRONICS PACKAGING MANUFACTURING, 26(3), pp.198-199, ISSN: 1521334X. DOI: 10.1109/TEPM.2003.822298.
Huang, Z, Conway, PP, Liu, C, Thomson, RC (2003) Inter-dependence of Processing
and Alloy Composition on the Reliability of Sn-based Lead Free Solders in Fine Pitch
FCOB Interconnection. In Proceedings of the IEEE 28th International Electronics
Manufacturing Technology Symposium, Winner of an IEEE/CPMT/SEMI Best Paper
Award, San Jose, California, USA, p.7, ISBN: 0-7803-7933-0.
Huang, Z, Conway, PP, Liu, C, Thomson, RC (2003) Inter-dependence of Processing
and Alloy Composition on the Reliability of Sn-based Lead Free Solders in Fine Pitch
FCOB Interconnection,, ISBN: 0-7803-7933-0.
Liu, C, Li, D, Conway, PP (2003) Characterisation of Intermetallic Ageing in Flip Chip
Solder Bumps. In Proceedings of the IEEE 53rd Electronic Components and
Technology Conference, IEEE Catalog No 03CH37438, New Orleans, Louisiana, USA,
pp.1767-1771, ISBN: 0-7803-7430-4.
Liu, C, Li, D, Conway, PP (2003) Characterisation of Intermetallic Ageing in Flip Chip
Solder Bumps,.
Conway, PP, West, AA, Palmer, PJ, Webb, DP, Jaggernauth, WA, Cottrill, MCW (2003)
Challenges in Adopting Flexible Circuits for Wiring Harness Applications.
Webb, DP, Conway, PP, Carpenter, ND, Hutt, DA, Palmer, PJ, Sandaver, AP (2003)
FFD Copper Plating Phase 2: Derivation of Process Understanding for Optimisation
Strategies, p.19, Consultancy Report, TDAO Ltd, Project No: WS/TDO/513.
Gwyer, D, Misselbrook, P, Philpott, D, Bailey, C, Conway, PP, Williams, K (2003) An
investigation into the coupling between a VCSEL and a polymer waveguide that will
enable future OECB based optical backplanes. In Proceedings of I-MAPS MicroTech
2003, Interconnection and Packaging, Stratford-upon-Avon, UK, p.9.
Cottrill, MCW, Conway, PP, Palmer, PJ, Astill, JT (2003) Large Area Flexible Circuits
and Through Hole Interconnection.
Webb, DP, Jaggernauth, WA, Cottrill, MCW, West, AA, Conway, PP, Palmer, PJ (2003)
EMC Performance of Large Area Flexible Printed Circuit Automotive Harnesses. Full
text: http://dx.doi.org/10.1243/0954407041580102 .
Conway, PP (2003) Associate Editor, IEEE Transactions on Electronics Packaging
Manufacturing. Full text: http://www.cpmt.org/trans/trans-epm.html .
Conway, PP, Fu, EKY, Liu, C, Sarvar, F, Webb, DP, Williams, K (2002) Droplet Weld:
Low Cost Lead Free Joining with Droplet Technology, Final Report, Contract G1RD-CT2000-00209.
Liu, C, Geggel, M, Conway, PP, Hendriksen, M (2002) Micro-scale Mechanical
Properties of Fine Feature Flip Chip with Lead Free Solders. In Proceedings of the 4th
International IEEE Symposium on Electronics Materials and Packaging (EMAP2002),
IEEE Catalogue 02EX634, Kaohsiung, Taiwan, pp.259-266, ISBN: 0-7803-7682-X.
Conway, PP, Fu, EK, Williams, K (2002) Precision High Temperature Lead-Free Solder
Interconnections by Means of High-Energy Droplet Deposition Techniques, Annals of
the CIRP, 51(1), pp.177-180.
Conway, PP and Williams, K (2002) Precision high tempreature lead-free solder
interconnections by means of high-energy droplet deposition techniques. In 52nd
General Assembly of CIRP, CIRP Annals-Manufacturing Technology - IDSN 570QM,
San Sebastian, Spain, pp.177-180.
Webb, DP, Conway, PP, Palmer, PJ, Hutt, DA, Carpenter, ND (2002) FFD Copper
Plating - Proof of Principle and Proof of Concept, p.14, Consultancy Report, TDAO Ltd,
Project No: WS/TDA/501.
Carrott, AJ, West, AA, Conway, PP, Cottrill, MCW (2002) Business Case Modelling of
Large Area Flexible Circuits in the Foresight Vehicle Programme. In Proceedings of the
Society of Automotive Engineers World Congress and Exposition, SAE Paper No 200201-1128, Detroit, USA, pp.1-9.
Hutt, DA, Liu, C, Conway, PP, Whalley, DC, Mannan, SH (2002) Electroless Nickel
Bumping of Aluminium Bondpads. I. Surface Pre-treatment and Activation, IEEE
Transactions on Components and Packaging Technologies, 25(1), pp.87-97, ISSN:
1521-3331. Full text: http://dx.doi.org/10.1109/6144.991180. DOI:
10.1109/6144.991180.
Hutt, DA, Liu, C, Conway, PP, Whalley, DC, Mannan, SH (2002) Electroless Nickel
Bumping of Aluminium Bondpads. II. Electroless Nickel Plating, IEEE Transactions on
Components and Packaging Technologies, 25(1), pp.98-105, ISSN: 1521-3331. Full
text: http://dx.doi.org/10.1109/6144.991181. DOI: 10.1109/6144.991181.
Cottrill, MC, Jaggernauth, WA, Webb, DP, Palmer, PJ, Conway, PP, West, AA (2002)
Foresight Vehicle: Large Area Flexible Circuits for Automotive Applications
Manufacturing Technology - A Review of Process Options. In Proceedings of the
Society of Automotive Engineers World Congress and Exposition, SAE Paper No 200201-1127, Detroit, USA, pp.1-9.
Webb, DP, Cottrill, MC, Jaggernauth, WA, West, AA, Palmer, PJ, Conway, PP (2002)
Foresight Vehicle: Multiplex Networks Implemented on Large Area Flexible Printed
Circuit Boards. In Proceedings of the Society of Automotive Engineers World Congress
and Exposition, SAE Paper No 2002-01-1130, Detroit, USA, p.5.
Jaggernauth, WA, Webb, DP, Cottrill, MC, Palmer, PJ, Conway, PP, West, AA (2002)
Foresight Vehicle: Specification and Acceptability Criteria for Copper-Clad Dielectric
Materials Used in Large Automotive Flexible Printed Circuits. In Proceedings of the
Society of Automotive Engineers World Congress and Exposition, SAE Paper No 200201-1129, Detroit, USA, pp.1-5.
Conway, PP (2002) Editor-in-Chief, Journal of Electronics Manufacturing. Full text:
http://www.worldscinet.com/jem/jem.shtml .
Fu, EK, Williams, K, Conway, PP (2001) Welding Physics Deliverable 6.4. Model:
Droplet Formation and Impact, Part 2: Impact.
Teh, NJ, Conway, PP, Palmer, PJ, Kioul, A, Prosser, S (2001) Statistical Optimisation
of Thermoplastic Injection Moulding Process for the Encapsulation of Electronic
Subassembly, Journal of Electronics Manufacturing, 10(3), pp.171-179, ISSN: 09603131. Full text: http://dx.doi.org/10.1142/S0960313100000150. DOI:
10.1142/S0960313100000150.
Fu, E, Williams, K, Conway, PP (2001) Welding Physics Deliverable 6.2. Model: Arc
Droplet Welding.
Fu, EK, Williams, K, Conway, PP (2001) Welding Physics Deliverable 6.2. Model: Arc
Droplet Welding.
Fu, EK, Williams, K, Conway, PP (2001) Welding Physics Deliverable 6.3. Model: Laser
Droplet Welding.
Conway, PP (2001) Clean and Low Distortion Accurate Welding of Microparts, p.207,
Final Report, Contract BRPR-CT98-0643.
Fu, EK, Conway, PP, Williams, K (2001) Short Report on Droplet Welding Trials Addendum.
Fu, EK, Conway, PP, Williams, K (2001) Short Report on Droplet Welding Trials, Part 3.
Conway, PP (2001) Editor-in-Chief, Journal of Electronics Manufacturing. Full text:
http://www.worldscinet.com/jem/jem.shtml .
Mannan, SH, Hutt, DA, Whalley, DC, Conway, PP (2001) Solder Paste Reflow
Modeling for Flip Chip Assembly, TAPtechnology, Third Edition, pp.107-113.
Fu, EK, Conway, PP, Williams, K (2000) Short Report on Laser Welding Trials at
Bayerische Laserzentrum (BLZ) - Materials Analysis.
Mannan, SH, Wheeler, E, Hutt, DA, Whalley, DC, Conway, PP, Bailey, C (2000) Solder
Paste Reflow Modeling for Flip Chip Assembly. In Proceedings of the 3rd Electronics
Packaging and Technology Conference (EPTC 2000), IEEE Catalog No. 00EX456,
Singapore, pp.103-109, ISBN: 0-7803-6644-1.
Fu, EK, Conway, PP, Williams, K (2000) Short Report on Droplet Welding Trials, Part 1.
Fu, EK, Conway, PP, Williams, K (2000) Short Report on Droplet Welding Trials, Part 2.
Mannan, SH, Hutt, DA, Whalley, DC, Conway, PP (2000) Observations of Solder Paste
Reflow by Means of Electrical Measurements. In Proceedings of the International
Symposium on Electronic Materials and Packaging 2000 (EMAP2000), IEEE Catalog
No 00EX458, Hong Kong, pp.175-180, ISBN: 0-7803-6654-9.
Liu, C, Hutt, DA, Whalley, DC, Conway, PP, Mannan, SH (2000) Under Bump
Metallisation of Fine Pitch Flip-chip Using Electroless Nickel Deposition. In Proceedings
of the International Symposium on Electronic Materials and Packaging 2000
(EMAP2000), IEEE Catalog No 00EX458, Hong Kong, pp.64-71, ISBN: 0-7803-6654-9.
Teh, NJ, Conway, PP, Palmer, PJ, Kioul, A, Prosser, S (2000) Embedding of
Electronics within Thermoplastic Polymers using Injection Moulding Technique. In
Proceedings from the 26th IEMT Symposium, Santa Clara, CA, USA, pp.10-18, ISBN:
0-7803-6482-1.
Hutt, DA, Webb, DP, Hung, KC, Tang, CW, Conway, PP, Whalley, DC, Chan, YC
(2000) Scanning Acoustic Microscopy Investigation of Engineered Flip-chip
Delamination. In Proceedings of the Twenty-Sixth IEEE/CPMT International Electronics
Manufacturing Technology (IEMT) Symposium, IEEE Catalog No 00CH37146, Santa
Clara, California, USA, pp.191-199.
Fu, EK, Conway, PP, Williams, K (2000) Welding Physics, Deliverable 6.1.
Tan, X, Conway, PP, Sarvar, F (2000) Effects of Clamping and Beam Position in Laser
Micro-Welding of Sensor, Advances in Manufacturing Technology XIV. In Perryman, R
and Ellis, CD (ed) Proceedings of the 16th National Conference on Manufacturing
Research, University of the East London, UK, pp.369-373, ISBN: 1-86058-267-2.
Teh, NJ, Palmer, PJ, Conway, PP (2000) Low-cost Embedding of Electronics within
Injection Moulded Polymers, Advances in Manufacturing Technology XIV. In
Proceedings of the 16th National Conference on Manufacturing Research, University of
the East London, pp.375-379, ISBN: 1-86058-267-2.
Teh, NJ, Conway, PP, Palmer, PJ, Prosser, S, Kioul, A (2000) Statistical optimisation of
thermoplastic injection moulding process for the encapsulation of electronic
subassembly, JOURNAL OF ELECTRONICS MANUFACTURING, 10(3), pp.171-179,
ISSN: 0960-3131. DOI: 10.1142/S0960313100000150.
Liu, C, Hutt, DA, Whalley, DC, Conway, PP, Mannan, SH (2000) Under Bump
Metallisation of Fine Pitch Flip-chip Using Electroless Nickel Deposition, Journal of
Electronics Manufacturing, 10(No 3), pp.161-170.
Hutt, DA, Rhodes, DG, Conway, PP, Mannan, SH, Whalley, DC, Holmes, AS (2000)
Investigation of a Solder Bumping Technique for Flip-Chip Interconnection, Soldering
and Surface Mount Technology, 12(1), pp.7-14, ISSN: 0954-0911.
Tan, X, Conway, PP, Sarvar, F (2000) Effects of clamping and beam position in laser
micro-welding of sensor. In Perryman, R and Ellis, CD (ed) 16th National Conference on
Manufacturing Research, ADVANCES IN MANUFACTURING TECHNOLOGY - XIV,
UNIV E LONDON, LONDON, ENGLAND, pp.369-373, ISBN: 1-86058-267-2.
Teh, NJ, Palmer, PJ, Conway, PP (2000) Low-cost automatic embedding of electronics
within injection moulded polymers. In Perryman, R and Ellis, CD (ed) 16th National
Conference on Manufacturing Research, ADVANCES IN MANUFACTURING
TECHNOLOGY - XIV, UNIV E LONDON, LONDON, ENGLAND, pp.375-379, ISBN: 186058-267-2.
Conway, PP (2000) Editor-in-Chief, Journal of Electronics Manufacturing. Full text:
http://www.worldscinet.com/jem/jem.shtml .
Hutt, DA, Mannan, SH, Whalley, DC, Conway, PP (1999) Maskless low-cost, multichip-module assembly process. In , American Society of Mechanical Engineers, EEP,
2/-.
Hutt, DA, Rhodes, DG, Conway, PP, Mannan, SH, Whalley, DC, Holmes, AS (1999)
Investigation of a Low-Cost Solder Bumping Technique for Flip-Chip Interconnection. In
Proceedings of the Twenty-Fourth IEEE/CPMT International Electronics Manufacturing
Technology (IEMT) Symposium, Austin, Texas, pp.334-342.
Tan, X, Sarvar, F, Conway, PP (1999) Characterisation of Materials Properties for
Laser Welding Simulation.
Sarvar, F and Conway, PP (1999) Qualitative Model of the Hybrid Laser Arc Welding
Process.
Conway, PP, Hyslop, SM, Williams, DJ (1999) Development of a Closed-Loop
Controlled Reflow Soldering Process, Annals of the CIRP, 48(1), pp.4-8.
Hutt, DA, Mannan, SH, Whalley, DC, Conway, PP (1999) A Maskless, Low-Cost, MultiChip-Module Assembly Process. In Proceedings of the Pacific Rim/ASME International
Intersociety Electronic and Photonic Packaging Conference, InterPACK '99, Advances
in Electronic Packaging 1999, Maui, Hawaii, USA, pp.1705-1711, ISBN: 0-7918-1612-5.
Conway, PP, Hyslop, SM, Williams, DJ (1999) Development of a closed-loop controlled
reflow soldering process. In 49th General Assembly of CIRP, CIRP ANNALS 1999 MANUFACTURING TECHNOLOGY, MONTREUX, SWITZERLAND, pp.5-8, ISBN: 3905277-31-X.
Conway, PP (1999) Editor-in-Chief, Journal of Electronics Manufacturing. Full text:
http://www.worldscinet.com/jem/jem.shtml .
Sarvar, F and Conway, PP (1998) A Modelling Tool for the Thermal Optimisation of the
Reflow Soldering of Printed Circuit Assemblies, Journal of Finite Elements in Analysis
and Design, 30(1-2), pp.47-63, ISSN: 0168-874X.
Sarvar, F and Conway, PP (1998) Effective Modelling of the Reflow Soldering Process:
Use of a Modelling Tool for Product and Process Design, IEEE Transactions on
Components, Packaging and Manufacturing Technology, Part C: Manufacturing, 21(3),
pp.165-171, ISSN: 1083-4400.
Sarvar, F and Conway, PP (1998) Effective modeling of the reflow soldering process:
use of a modeling tool for product and process design, IEEE transactions on
components, packaging and manufacturing technology. Part C. Manufacturing, 21(3),
pp.165-171, ISSN: 1083-4400. DOI: 10.1109/3476.720413.
Sarvar, F and Conway, PP (1998) Effective modeling of the reflow soldering process:
Basis, construction, and operation of a process model, IEEE transactions on
components, packaging and manufacturing technology. Part C. Manufacturing, 21(2),
pp.126-133, ISSN: 1083-4400. DOI: 10.1109/3476.681389.
Sarvar, F and Conway, PP (1998) Effective Modelling of the Reflow Soldering Process:
Basis, Construction and Operation of a Process Model, IEEE Transactions on
Components, Packaging and Manufacturing Technology Part C: Manufacture, 21(2),
pp.126-133, ISSN: 1083-4400.
Conway, PP (1998) Recent Work in the Interconnection Group, Loughborough
University. In Invited paper, 1st International Academic Conference on Electronics
Packaging Research and Education for the 21st Century, Georgia Institute of
Technology, USA, p.6.
Conway, P, Whalley, D, Wilkinson, M, Hyslop, SM (1998) The application of in
thermography to process monitoring and control of reflow soldering, SOLDERING &
SURFACE MOUNT TECHNOLOGY, 10(1), pp.13-+, ISSN: 0954-0911. DOI:
10.1108/09540919810203766.
Conway, PP, Whalley, DC, Wilkinson, M, Hyslop, SM (1998) The Application of IR
Thermography to Process Monitoring and Control of Reflow Soldering, Soldering and
Surface Mount Technology, 10(1), pp.13-18, ISSN: 0954-0911.
Conway, PP and Williams, DJ (1998) Challenges in Solder Assembly Technologies. In
Lee, YC and eds, WTC (ed) Manufacturing Challenges in Electronic packaging,
Chapman and Hall, pp.82-113, ISBN: 0-412-62030-8.
Conway, PP (1997) Flip Chip Bumping Processes.
Conway, PP, Whalley, DC, Wilkinson, M, Williams, DJ (1997) Automated Adaptive
Control of the Reflow Soldering of Electronic Assemblies. In Proceedings of the 21st
IEEE International Electronic Manufacturing Technology Symposium, Austin, Texas,
pp.229-236, ISBN: 0-7803-3929-0.
Tilley, KJ, Williams, DJ, Conway, PP (1997) Development and R&D capability at
manufacturing sites: Electronics multi-nationals in Singapore and Taiwan, Production
and Operations Management, 6(2), pp.131-149, ISSN: 1059-1478.
Conway, PP (1997) Adaptive Intelligent Reflow Closes the Production Control Loop,
Electronics Manufacturing Products, p.18.
Conway, PP (1997) Simulation Improves Reflow Yield, Electronics Manufacturing
Products, pp.10-11.
Tilley, KJ, Williams, DJ, Conway, PP (1997) Development and R&D Capability at
Offshore Sites: Electronics Multi-Nationals in Singapore and Taiwan, International
Journal of Production and Operations Management, 6(2), pp.131-149, ISSN: 10591478.
Whalley, DC and Conway, PP (1996) Simulation and interpretation of wetting balance
tests using The Surface Evolver, Transactions of the ASME: Journal of Electronic
Packaging, 118(3), pp.134-141, ISSN: 1043-7398.
Whalley, DC and Conway, PP (1996) Simulation and interpretation of wetting balance
tests using the surface evolver, JOURNAL OF ELECTRONIC PACKAGING, 118(3),
pp.134-141, ISSN: 1043-7398. DOI: 10.1115/1.2792143.
Conway, PP (1996) Solderability and Process Characterisation of Some Lead-free
Solders. In Invited paper, International IEEE/IVF Seminar on Lead Free Solders in
Electronics Manufacturing, Gothenburg, Sweden, pp.61-66.
Sarvar, F, Conway, PP, Whalley, DC (1996) A Process Modelling System for Reflow
Soldering of Surface Mount Assemblies.
Conway, PP, Whalley, DC, Williams, DJ (1996) Modelling and Experimental
Investigation of Reflow Soldering, EPSRC/CDP/EPDM.
Coleman, P, Conway, PP, Sarvar, F (1996) Investigation of Reflow Oven
Characteristics.
Conway, PP and Sarvar, F (1996) Process Modelling of Surface Mount Assemblies,
Video of Research Results.
Tilley, KJ, Williams, DJ, Conway, PP (1996) Design and Manufacture by Foreign
Electronics Multi-nationals in Singapore and Taiwan: Product Responsibilities in a
Global Environment, Proceedings of the IMechE, Part B Journal of Engineering
Manufacture, 210, pp.221-231, ISSN: 0954-4054.
Sarvar, F and Conway, PP (1996) Effective Transient Process Modelling of the Reflow
Soldering of Printed Circuit Assemblies. In Proceedings of the InterSociety IEEE/ASME
Conference on Thermal Phenomena in Electronic Systems, ITHER V, Orlando, Florida,
USA, pp.195-202, ISBN: 0 7803 3325 X.
Conway, PP, Kalantary, MR, Williams, DJ (1996) Experimental Investigation of the
Formation of Surface Mount Solder Joints, Transactions of the American Society of
Mechanical Engineers (ASME), Journal of Electronic Packaging, 118(3), pp.223-228,
ISSN: 1043-7398.
Conway, PP (1996) Modelling the Process to Improve the Product, Seminar
Presentation.
Williams, DJ, Conway, PP, Sarvar, F (1996) Using Process Simulation as a Product
and Process Design Tool, American Society of Mechanical Engineering's (ASME)
Singapore Chapter Yearbook, 3, pp.102-109.
Whalley, DC, Conway, PP, Sarvar, F, Williams, DJ (1995) Modelling of Solder Joint
Geometry for Quality and Reliability, Soldering and Surface Mount Technology, 21,
pp.10-12, ISSN: 0954-0911.
Kalantary, MR, Conway, PP, Williams, DJ (1995) Differential Scanning Calorimetry
Measurements of Solder Materials.
Whalley, DC, Conway, PP, Sarvar, F, Kalantary, MR (1995) The Globule Block Wetting
Balance Test. In INTERpack '95, Proceedings of the International Intersociety Electronic
Packaging Conference, Hawaii, pp.89-94.
Kalantary, MR and Conway, PP (1995) High Speed Video Observation of Convection
Reflow Soldering.
Charles, GP, Murgatroyd, IS, Conway, PP (1995) Report on Demonstrator System for
Automated Testing of Fibre Optic Components, Consultancy Contract Report.
Conway, PP, Kalantary, MR, Williams, DJ (1995) Experimental Investigation of the
Formation of Surface Mount Solder Joints. In Proceedings of the International
Intersociety ASME/JSME/IEEE Electronic Packaging Conference, Westin Mauii, Hawaii,
USA, pp.95-102, ISBN: 0-7918-1303-7.
Conway, PP and Williams, DJ (1995) Experiments to Improve the Understanding of
Process Defects Such as Partial Reflow and Solder Balling as Occurring in the
Soldering of Solder Paste Materials. In Proceedings of Productronica '95, Munich,
pp.53-60.
Kalantary, MR, Sarvar, F, Conway, PP, Williams, DJ (1995) Solder Paste as an
Interconnection Medium. In Proceedings of the Inst. Metal Finishing, Connectors 1995
Conference, Coventry, pp.63-74.
Conway, PP (1995) Solderability Testing of Alternate Component Termination Materials
with Lead Free Solder Alloys. In Proceedings of the 17th IEEE/IEMTS Conference,
Austin, Texas, USA, pp.245-251.
Kalantary, MR, Conway, PP, Williams, DJ (1995) Towards a Standard for Differential
Scanning Calorimetry Measurement of Solder Paste Products. In Proceedings of the
17th IEEE/IEMTS Conference, Austin, Texas, USA, pp.337-343.
Whalley, DC, Conway, PP, Sarvar, F, Williams, DJ (1994) Modelling of Solder Joint
Geometry for Quality and Reliability. In Proceedings of the European Surface Mount
Conference, Brighton, pp.C5.1-8.
Conway, PP (1994) The Use of Integrating Spheres in Fibre Optic Component Test
Operations, Consultancy Report.
Kalantary, MR, Sarvar, F, Conway, PP, Williams, DJ, Whalley, DC (1994) Observed
Phenomenology of the Interaction Between Solder Paste and Soldering Processes,
Soldering and Surface Mount Technology, 18, pp.8-11, ISSN: 0954-0911.
Conway, PP (1994) Characterisation of the Formation of Surface Mount Solder Joints.
Sarvar, F, Kalantary, MR, Conway, PP, Williams, DJ, Whalley, DC (1994) Effects of
Ground Planes and Tracks on the Simulation of the Reflow Process for Surface Mount
Technology. In Proceedings of the First International Symposium on Microelectronic
Package and PCB Technology, Beijing, pp.35-40.
Tilley, KJ, Williams, DJ, Conway, PP (1994) R & D in the Off-Shore Sites of Electronics
Multi Nationals: Evidence from Singapore and Taiwan on Development and
Capabilities.
Tilley, KJ, Williams, DJ, Conway, PP (1994) Offshore development of electronic
products, Engineering Management Journal, 4(4), pp.185-192, ISSN: 0960-7919.
Tilley, KJ, Williams, DJ, Conway, PP (1994) Offshore Development of Electronics
Products, Engineering Management Journal, 4(4), pp.185-192, ISSN: 0960-7919.
Gibbons, R, Williams, DJ, Conway, PP, West, AA, Pinpin, K (1994) Inspection Project
Feasibility Study for ICL Kidsgrove.
Kalantary, MR, Sarvar, F, Conway, PP, Williams, DJ, Whalley, DC (1994)
Understanding the Interaction Between Solder Pastes and the Soldering Process. In
Proceedings of the ISHM International Conference on Electronics Technologies,
Windsor, pp.123-130.
Tilley, KJ, Conway, PP, Williams, DJ, DeSouza, R (1994) Far East Manufacturing Cost
Reduction by Adjacent Country Production. In Proceedings of the 16th IEEE/CPMT
International Electronics Manufacturing Technology Symposium, La Jolla, CA, USA,
pp.325-332, ISBN: 0 7803 2037 9.
Williams, DJ and Conway, PP (1994) Globalisation of Electronics Manufacture, The
Growth of an Electronics Industry, 6 plus aendices, SERC Final Report.
Conway, PP, Kalantary, MR, Sarvar, F (1994) High Speed Video of Solder Paste
Reflow Processes, Video Recording of Soldering Processes.
Tilley, KJ, Conway, PP, Williams, DJ (1994) Hong Kong, Singapore and Taiwan Electronics Industry Capabilities, A View from the United Kingdom, Journal of the
Institute of Industrial Engineers (HK), pp.31-34.
Tilley, KJ, Williams, DJ, Conway, PP (1994) Manufacturing to Design Transitions for
High Value Electronics Products in Multinational Companies in the Newly Industrialised
Countries of the Far East. In Goldring International Seminar on Emerging Paradigms in
Globalising Technology, Manufacturing and Service Organisations, New Orleans, USA,
p.16.
Conway, PP (1993) Environmental comparison of solder and conductive adhesives for
SMT interconnect, IEEE/CHMT European International Electronic Manufacturing
Technology Symposium, pp.171-176.
Conway, PP, Williams, DJ, Sarvar, F, Kalantary, MR (1993) Modelling and
Experimental Investigation of Reflow Soldering, p.87, SERC/ACME.
Williams, DJ, Conway, PP, Kalantary, MR (1993) The Effect of Particle Size on Surface
Energy, Working Note.
Conway, PP (1993) An Environmental Comparison of Solder and Conductive
Adhesives for SMT Interconnect. In Proceedings of 15th IEEE/CHMT EMTS
Conference, Santa Cruz, California, USA, pp.198-202.
Williams, DJ and Conway, PP (1993) Technology Development and Evolution:
Electronic Interconnection. In Proceedings of the ACME Research Conference,
Sheffield, pp.74-79.
Tilley, KJ, Williams, DJ, Conway, PP (1993) The Globalisation of Electronics
Manufacture - The Growth of an Electronics Manufacturing Industry, p.32,
SERC/ACME.
Conway, PP (1993) Electronics Manufacturing in the Far East.
Williams, DJ and Conway, PP (1993) Technology Development and Evolution:
Electronics Packaging and Interconnection, p.6, SERC.
Jahn, JR and Conway, PP (1993) Multichip Modules (MCMs): A Review of the Status
Quo, Journal of Electronics Manufacturing, 3(1), pp.1-12, ISSN: 0960-3131.
Whalley, DC, Conway, PP, Williams, DJ (1993) A Process Model of the Infra-red
Reflow Soldering of Printed Circuit Assemblies. In IEE Colloquium on CAD Tools for
Thermal Management, CAD Tools for Thermal Management, London, pp.3/1-3/3.
CONWAY, PP (1993) AN ENVIRONMENTAL COMPARISON OF SOLDER AND
CONDUCTIVE ADHESIVES FOR SMT INTERCONNECT. In 15th IEEE/CHMT
International Electronics Manufacturing Technology (IEMT) Symposium: Electronics
Manufacturing for the year 2000, FIFTEENTH IEEE/CHMT INTERNATIONAL
ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, SANTA CLARA,
CA, pp.171-176, ISBN: 0-7803-1424-7.
Williams, DJ, Conway, PP, Whalley, DC (1993) Making Circuits More Than Once: The
Manufacturing Challenges of Electronics Intensive Products, Proceedings of the
Institution of Mechanical Engineers, 207, pp.83-90.
Conway, PP (1992) Single Surface Mount Termination Modelling, Part 1: Model
Construction and Evolution.
Conway, PP (1992) Transcripts: Singaporean Based Electronics Manufacturing
Enterprises.
Whalley, DC, Ogunjimi, AO, Conway, PP, Williams, DJ (1992) The Process Modelling
of the Infra-red Reflow Soldering of Printed Circuit Board Assemblies, Journal of
Electronics Manufacturing, 2(1), pp.23-29, ISSN: 0960-3131.
WILLIAMS, DJ, CONWAY, PC, WHALLEY, DC (1992) CHALLENGES IN THE
MANUFACTURE OF ELECTRONIC PRODUCTS. In Eyada, OK and Ahmad, MM (ed)
2ND INTERNATIONAL CONF ON FLEXIBLE AUTOMATION AND INFORMATION
MANAGEMENT ( FAIM 92 ), FLEXIBLE AUTOMATION AND INFORMATION
MANAGEMENT 1992, FALLS CHURCH, VA, pp.47-58, ISBN: 0-8493-0138-6.
Williams, DJ and Conway, PP (1992) Technology Migration in Multinational
Enterprises.
Williams, DJ, Conway, PP, Whalley, DC (1992) Invited Keynote - Challenges in the
Manufacture of Electronic Products. In Eyada, K, O, Ahmad, eds, MM (ed) 2nd FAIM
Conference, Virginia, pp.47-58.
Williams, DJ and Conway, PP (1992) The Value Chain in Multinational Electronics
Manufacturing Enterprises Operating in Newly Industrialised Countries, Journal of
Electronics Manufacture, 2(4), pp.161-168, ISSN: 0960-3131.
Whalley, DC, Conway, PP, Ogunjimi, AO, Williams, DJ (1991) The Process Modelling
of Infra-red Reflow Soldering of Surface Mount Components.
Whalley, DC, Conway, PP, Ogunjimi, AO, Williams, DJ (1991) A Process Model of the
Infra-red Reflow Soldering of Printed Circuit Board Assemblies. In 11th International
IEEE CHMT International Electronic Manufacturing Technology Symposium
Conference, Proceedings of the 11th International IEEE IEMTS Conference, San
Francisco, USA, pp.122-125.
Williams, DJ, Whalley, DC, Conway, PP, Sargent, PM, Tang, ACT, Ogunjimi, AO
(1991) Modelling the Reflow Soldering Process, Poster Paper.
Conway, PP, Ogunjimi, AO, Sargent, PM, Tang, ACT, Whalley, DC, Williams, DJ
(1991) SMD Reflow Soldering: A Thermal Process Model, Annals of the CIRP,
40/1/1991, pp.21-24.
Conway, PP, Williams, DJ, Whalley, DC (1991) Joint-Level Thermal Modelling of Infra
Red Reflow for Different Termination Geometries. In Proceedings of the 1st Joint
International Conference on Factory Automation and Information Management,
Limerick, Ireland, pp.219-228.
Conway, PP, Williams, DJ, Whalley, DC (1991) Experiments to Allow the Interpretation
of a Computer Based Model of the Solder Paste Reflow Process, Journal of Processing
of Advanced Materials, 1(3), pp.175-180, ISSN: 0960-3158.
Conway, PP, Williams, DJ, Whalley, DC (1990) Experiments to Allow the Interpretation
of a Computer Based Model of the Solder Paste Reflow Process. In Proceedings of the
6th International Conference on Computer Aided Production Engineering, London,
pp.481-489.
Whalley, DC, Williams, DJ, Conway, PP (1990) The Development of a Thermal Model
of the Infra Red Reflow Soldering of Electronic Assemblies. In IDEAS-CAEDS Users
Conference, Proceedings of the IDEAS-CAEDS Users Conference, London, pp.9-19.
Conway, PP and Williams, DJ (1990) The Reduction of Image Ambiguity for Process
Control Using Product Knowledge". In Proceedings of Factory 2001, Cambridge, UK,
pp.139-143, ISBN: 0 86341704 3.
Conway, PP (1990) Solder Displacement and Wicking.
Conway, PP, Williams, DJ, Tang, ACT, Sargent, PM, Whalley, DC (1990) Process
Variables in the Reflow Soldering of Surface Mount. In 8th IEEE CHMT International
Electronic Manufacturing Technology Symposium, Proceedings of the 8th IEEE CHMT
Symposium, IEEE Cat.No. 90CH2833-2, Library of Congress No. 89-82530, Stresa,
Italy, pp.385-394.
Whalley, DC, Conway, PP, Williams, DJ (1990) Thermal Modelling of Temperature
Development During the Reflow Soldering of SMD Assemblies. In Proceedings of the
6th International Microelectronics Conference, Tokyo, Japan, pp.120-124.
Conway, PP, Williams, DJ, Tang, ACT, Sargent, PM, Whalley, DC (1990) Process
Variables in the Reflow Soldering of Surface Mount.