Background Statement for SEMI Draft Document #4712B New Standard: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and Reduction Notice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this Document. Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided. Background This is a technical ballot as Doc. #4712B. We, the GHG Emission Characterization Task Force, have prepared this draft document after review of all the negatives and comments submitted to Doc. #4712A. Due to rapid progress of climate change, the demand of GHG emission reduction is greatly growing. Based upon following reasons which show necessity of an industry guide, the TF developed this guide as a SEMI standard. According to the 2006 Intergovernmental Panel on Climate Change (IPCC) Guidelines, default values for calculating efficiency of an abatement system are usable under a condition that the performance of the system is kept. Japanese Law Concerning the Promotion of Measures to Cope with Global Warming requires to report GHG emissions to an emission generator over a certain amount. According to Ministry of the Environment, a calculation method or an emission coefficient other than one shown on the legal instrument is usable, if data are based upon actual measurement of GHG. The US EPA introduced electronics industry a draft “Protocol for Measuring Destruction or Removal Efficiency (DRE) of Fluorinated Greenhouse Gas Abatement Equipment in Electronics Manufacturing” through the 15th ISESH and some opportunities. The US Government concluded to require reporting GHG emission over 25000CO2equivelant ton/ year from 2011, to entities having sites in the USA. Korean “Low Carbon Green Growth Law” which became mandatory in 2010 requires total GHG emission reduction. Taiwan is now discussing whether Taiwan should enact a GHG tax system. For the purpose, accurate emission characterization is strongly expected. For the ME or the abatement tool suppliers who deliver their products globally, the SEMI standard is useful to conduct their businesses smoothly. The voting results of Doc. #4712B will be reviewed by the GHG Emission Characterization Task Force on March 23, 2012, and will be adjudicated at the Japan EHS Committee meeting scheduled on April 19, 2012 at SEMI Japan office. i If you have any question, please contact the following Task Force co-leaders or SEMI staff: GHG Emission Characterization Task Force co-leaders: Shigehito Ibuka (Tokyo Electron); e-mail: shigehito.ibuka@tel.com Minoru Kagino (Toshiba); e-mail: minoru1.kagino@toshiba.co.jp SEMI staff: Akiko Yamamoto (SEMI Japan); e-mail: ayamamoto@semi.org ii Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 DRAFT SEMI Draft Document #4712B New Standard: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and Reduction 1 Purpose 1.1 This document provides guidance to characterize fluorinated greenhouse gas (F-GHG) emitted from manufacturing equipment (ME). 1.2 This document provides guidance to characterize F-GHG destruction or removal efficiency (DRE) of an abatement tool. 1.3 This document also addresses continuous improvement planning for emission reduction on ME or an abatement tool. NOTE 1: Because this SEMI standard is a “Guide”, all criteria using “should” may be considered optional. 2 Scope 2.1 Greenhouse gases (GHGs) to which this guide applies are CF4, C2F6, C3F8, c-C4F8, CHF3, SF6 and NF3. NOTE 2: In addition to above gases, this guide may be applicable to other F-GHGs . 2.2 This guide applies to F-GHG emission characterization from ME. 2.3 This guide applies to F-GHG emission characterization from an abatement tool. 2.4 This guide applies to characterization of consumption, residues, byproducts or recombination of F-GHG through chemical reaction in ME. 2.5 This guide applies to specification of F-GHG DRE on an abatement tool. 2.6 It is recommended to use this guide in semiconductor, TFT-LCD, photovoltaic industries at least. 2.7 This guide contains the following sections: Purpose Scope Limitations Referenced Standards and Documents Terminology General Provisions Baseline Recipe(s) Measurement Instruments Measurement and Characterization of F-GHG Emission Timing and Frequency of F-GHG Emission Characterization Reporting Record Keeping of Data Characterized Roadmap and Continuous Improvement NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use. This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 1 Doc. 4712B SEMI LETTER (YELLOW) BALLOT Document Number: 4712B Date: 2/12/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 DRAFT 3 Limitations 3.1 This guide is not intended to supersede the applicable codes and regulations of the region where the characterization is conducted, or the region where the information developed may be used. 3.2 This guide is not intended to restrict characterization method of F-GHG emission, utilization, or DRE. 3.3 This guide is not intended to restrict data management of F-GHG emission, utilization, or DRE. 4 Referenced Standards and Documents 4.1 SEMI Standards and Safety Guidelines SEMI S2 ― Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment SEMI S23 ― Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment 4.2 IPCC Document1 2006 IPCC Guidelines for National Greenhouse Gas Inventories - Volume 3 Industrial Processes and Product Use - Chapter 6 Electronics Industry Emissions 4.3 ISMI Document2 #01104197A-XFR ― Guideline for Environmental Characterization of Semiconductor Equipment #06124825B-ENG Guideline for Environmental Characterization of Semiconductor Process Equipment, Revision 2 4.4 Seiko Epson Document3 Simple Method for PFC Characterization using FT-IR 4.5 US EPA Protocol4 EPA 430-R-10-003 ― Protocol for Measuring Destruction or Removal Efficiency (DRE) of Fluorinated Greenhouse Gas Abatement Equipment in Electronics Manufacturing NOTE 3: JEITA5 is developing “JEITA Guideline for F-GHG Characterization and Management”. NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions. 5 Terminology 5.1 Abbreviations & Acronyms 5.1.1 DRE Destruction or Removal Efficiency 5.1.2 FCs Fluorinated Compounds 5.1.3 F-GHG Fluorinated Greenhouse Gas 5.1.4 FT-IR Fourier Transform-InfraRed 5.1.5 GC-MS Gas Chromatography-Mass Spectrometry 1 Intergovernmental Panel on Climate Change (IPCC), IPCC Secretariat: C/O World Meteorological Organization, 7bis Avenue de la Paix, C.P. 2300, CH- 1211 Geneva 2, Switzerland; Telephone: +41-22-730-8208/54/84; Fax: +41-22-730-8025/13; http://www.ipcc.ch/ 2 International SEMATECH Manufacturing Initiative, 257 Fuller Road, Albany, NY 12203, U.S.A.; Telephone: (518) 649-1000; http://ismi.sematech.org 3 Seiko Epson Corporation, 3-3-5 Owa, Suwa, Nagano, Japan; http://global.epson.com/SR/environment/method.html 4 United States Environment Protection Agency, 1200 Pennsylvania Avenue Northwest, Washington D.C., DC, U.S.A.; Telephone: +1 202-2602010; http://www.epa.gov 5 Japan Electronics and Information Technology Industries Association (JEITA), Ote Center Bldg., 1-1-3, Otemachi, Chiyoda-ku, Tokyo 1000004, Japan; http://www.jeita.or.jp This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 2 Doc. 4712B SEMI LETTER (YELLOW) BALLOT Document Number: 4712B Date: 2/12/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 DRAFT 5.1.6 GHG ― Greenhouse Gas 5.1.7 GWP Global Warming Potential 5.1.8 HTF ― Heat Transfer Fluide 5.1.9 IPCC Intergovernmental Panel on Climate Change 5.1.10 ISMI International SEMATECH Manufacturing Initiative 5.1.11 ME Manufacturing Equipment [such as semiconductor, FPD (Flat Panel Display) or photovoltaic manufacturing equipment] 5.1.12 MFC Mass Flow Controller 5.1.13 PFCs PerFluoro Compounds 5.1.14 QMS Quadrupole Mass Spectrometer 5.1.15 SEMATECH Semiconductor Manufacturing Technology Institute 5.2 Definitions 5.2.1 baseline operating conditions, including process chemistry, for which the equipment was designed and manufactured. [SEMI S2] 5.2.2 environmental impact positive and negative effects to the earth environment from a variety of sources including people and their activities, and the operation of manufacturing equipment and facilities. 5.2.3 recombination other material to which is joined after an original material is broken. 5.2.4 roadmap a sequence for the incremental introduction or improvement of technology over time with month or year milestones and supporting information. [SEMI S23] 5.2.5 source gas residue F-GHG unreacted F-GHG after processing such as chamber cleaning or dry etching of substrates. 5.2.6 system integrator party that integrates manufacturing equipment and an abatement system. A system integrator can be a user of manufacturing equipment and an abatement system, or a supplier who is named to be a system integrator by contract. 5.2.7 utilization fraction of a gas destroyed or transformed by reaction process such as CVD or etching (socalled “use rate” in “2006 IPCC Guidelines for National Greenhouse Gas Inventories”) 6 General Provisions 6.1 The document reader is recommended to understand the meaning of GHG emission characterization and DRE of abatement tool written in Chapter 6 “Electronics Industry Emissions” of “2006 IPCC Guidelines for National Greenhouse Gas Inventories - Volume 3 Industrial Processes and Product Use.” 7 Baseline Recipe(s) 7.1 The measurement, monitoring, improvement, and reporting methods should be conducted using one or several supplier baseline recipe(s). NOTE 4: The ME or the abatement tool supplier is encouraged to consider baseline recipe(s) which also meet the needs of the users. 7.2 Recipe(s) should include gas species, process time, vacuum pressure, process temperature, idle time, etc. 8 Measurement Instruments NOTE 5: Outlines of FT-IR and QMS are shown in Related Information 1. 8.1 Measurement instrument should be appropriately calibrated prior to measurement. 8.1.1 Calibration of measurement instrument should be conducted for each F-GHG to be characterized. This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 3 Doc. 4712B SEMI LETTER (YELLOW) BALLOT Document Number: 4712B Date: 2/12/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 DRAFT 9 Measurement and Characterization of F-GHG Emission NOTE 6: Following documents may be useful to characterize F-GHG emissions. 01104197A-XFR and #06124825A-ENG of ISMI Simple Method for PFC Characterization using FT-IR 9.1 Total volume of each F-GHG is defined as sum of time integration of values calculated based upon “F-GHG concentration multiply gas flow rate”. T Vi C t F t dt i (1) i 0 Vi: Gas volume for ith gas (ith: 1st, 2nd, 3rd, 4th, 5th…) t : Measurement timing T : Total time for measurement Ci(t): Concentration for ith gas Fi(t): Gas flow rate for ith gas 9.2 Following shows how to measure F-GHGs including byproducts, the emitted gas flow rate, and measurement time. Based upon such data, mass balance between the input and the output of the ME, or the DRE of the abatement tool can be specified. 9.2.1 Measurement of F-GHG Concentration 9.2.1.1 Measure emissions including gas phase byproducts. 9.2.1.2 Measurement should be conducted by a qualified method such as FT-IR, which is described on “Guideline for Environmental Characterization of Semiconductor Process Equipment – Revision 2 (ISMI Technology Transfer #06124825B-ENG)”. NOTE 7: For use of FT-IR, the simplified FT-IR is shown in Related Information 1. 9.2.2 Identification of F-GHG Flow Rate 9.2.2.1 Sum each flow rate of input gases. 9.2.2.2 A gas, for which the concentration is already known should be used for the reference. 9.2.3 Identification of Measurement Time 9.2.3.1 Identification of F-GHG measurement time can be calculated from time which input gases are flowing other than identifying actual measurement time. 9.2.4 Emission Characterization 9.2.4.1 It should be conducted at a certain change such as process recipe change of the ME, the ME configuration change, or the abatement tool configuration change. 9.2.4.2 If repeatability of each measurement or linearity of concentration to absorbance is not shown, any malfunction of the ME, the abatement tool or the measurement instrument should be investigated. NOTE 8: Repeatability and/or linearity shoud be defined by a suppler. 9.2.4.3 Emission from the ME 9.2.4.3.1 Emission from the ME should be characterized for one or several supplier baseline recipe(s). 9.2.4.3.2 Utilization, recombination, gas consumption, and source gas residue F-GHG can be characterized by analysis of the emission data. 9.2.4.4 Utilization in the ME 9.2.4.4.1 It should be calculated from each input F-GHG to the ME and each emitted F-GHG from the ME. The following formula should be used. This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 4 Doc. 4712B SEMI LETTER (YELLOW) BALLOT Document Number: 4712B Date: 2/12/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 DRAFT F-GHG utilization = (each input F-GHG volume – each emitted F-GHG volume)/ each input F-GHG volume (2) 9.2.4.4.2 Each baseline recipe should be used to identify each utilization. 9.2.4.4.3 When determining the reaction rate, at least five process runs should be measured for each recipe. 9.2.4.5 Input F-GHG to the Abatement Tool and Emitted F-GHG from the Abatement Tool 9.2.4.5.1 Total input F-GHG volume should be identified based upon actual measurement. NOTE 9: When an abatement tool such as combustion type or plasma type is turned off, measurement result at the outlet of the abatement can be considered equivalent to measurement result at the inlet of it. 9.2.4.5.2 Total emitted F-GHG volume should be identified based upon actual measurement. 9.2.4.6 DRE of the Abatement Tool 9.2.4.6.1 It should be calculated from each input F-GHG to the abatement tool and each emitted F-GHG from the abatement tool. The following formula should be used. F-GHG DRE = (each input F-GHG volume – each emitted F-GHG volume) / each input F-GHG volume (3) NOTE 10: The EPA protocol should be referred for appropriate characterization using tracer gas on an abatement tool. 9.2.4.7 Performance Verification of the Abatement Tool 9.2.4.7.1 The abatement tool supplier should review the abatement tool performance before the delivery. 9.2.4.7.2 For some abatement tool, comparison with measurement result of outlet gases on non-activation and activation of an abatement tool may be used to measure the tool performance. 9.2.4.8 Combined Operation of ME and Abatement Tool 9.2.4.8.1 When F-GHG volume of the outlet of the ME is equivalent to the inlet of the abatement tool, DRE is calculated with the emission data from the abatement tool and total F-GHG volume measured by MFCs of the ME. NOTE 11: Related Information 2 shows the measurement methods of some abatement tool. 10 Timing and Frequency of F-GHG Emission Characterization 10.1 Some characterizations may be conducted from the following cases based upon an agreement between the user and the supplier. Brand-new ME and abatement tool Just before in-situ dry cleaning of the ME Just after in-situ dry cleaning of the ME Just before wet chamber cleaning of the ME Just after wet chamber cleaning of the ME Just before maintenance of the abatement tool Just after maintenance of the abatement tool 10.2 Personnel or a party to conduct initial characterization of the new ME and the characterization before the first chamber cleaning of the ME should show the reason of reliability of data characterized. 11 Reporting 11.1 The supplier of the ME and the abatement tool, and the system integrator should provide following information to the user as a principle. 11.1.1 Information of the ME or the abatement tool (ME or abatement tool name and number, manufacturer’s name and abatement method) This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 5 Doc. 4712B SEMI LETTER (YELLOW) BALLOT Document Number: 4712B Date: 2/12/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 DRAFT 11.1.2 Process information 11.1.2.1 Recipe used at the time of data characterization 11.1.2.2 Total process run numbers or hours after the previous dry cleaning of process chamber 11.1.3 Measurement information (measurement instrument name, manufacturer’ name, measurement method and calibration data) 11.1.4 All data characterized in accordance with §9 11.1.5 Recommended methods to verify reliability of F-GHGs emission characterization data as to the ME, the abatement tool, the measurement instrument or the measurement condition 11.1.6 Contact information for an inquiry 11.2 As the report may be submitted to a jurisdiction by the user, the supplier of ME or an abatement tool, or the system integrator should notify the user that he has to obtain the permission from the supplier (or system integrator) before submission of it. 12 Record Keeping of Data Characterized 12.1 The records of the data and the measurement conditions should be kept by the supplier for the period specified by the contract with the user. 12.2 If no contract is prepared, the document submitted to the user should be kept during the ME or the abatement tool warranty period after submission. 13 Roadmap and Continuous Improvement 13.1 Through evaluation using the supplier baseline process recipes, the ME or the abatement tool supplier should set target emission reduction and develop roadmap for achieving it. The ME or the abatement tool supplier should also present a clear justification for each target. 13.2 The ME or the abatement tool supplier should discuss emission reduction plans with the users before implementing them so that the cost-benefit balance and its related assumptions can be more fully understood by all both parties. 13.3 The ME or the abatement tool supplier should prepare an improvement roadmap. 13.4 The following considerations may be applicable in developing an emission reduction roadmap. The type of equipment (model, options, configuration) Alternative gas having lower GWP Process optimization Low energy consumption No re-generation of other GHGs Information describing why a target seems achievable and, generally speaking, how it will be achieved A cost/benefit analysis on the equipment upgrade 13.5 The ME or abatement tool supplier should review the improvement status periodically and update the roadmap to monitor the emission reduction progress. It is recommended that a period of the update be identified by a supplier. 13.6 If the review indicates that targets have not been (or will not be) achieved, it is useful to document the reasons as part of the roadmap data and to re-adjust the target dates and achievement strategy based on the most recent information. This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 6 Doc. 4712B SEMI LETTER (YELLOW) BALLOT Document Number: 4712B Date: 2/12/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 DRAFT RELATED INFORMATION 1 Outlines of FT-IR and QMS NOTICE: This Related Information is not an official part of SEMI [designation number] and was derived from the work of the global [committee name] Technical Committee. This Related Information was approved for publication by full letter ballot procedures on [A&R approval date]. R1-1 Fourier Transform Infrared Spectrometer (FT-IR) R1-1.1 FT-IR is comprised of a light source, a sample stage, spectral photometry (an interferometer, a detector, an amplifier, and an A/D converter), a Fourier transform unit, a data processor, and a display and recorder. Spectral photometry Light Source Interferometer A/D Converter Sample Amplifier Detector Data processor Fourier transform unit Display and recorder Figure R1-1 FT-IR Configuration R1-1.2 FT-IR measures the interferogram of the sample transmitted light in a Michelson interferometer and gets the absorption spectrum of the sample by Fourier transforming the interferogram. Each GHG concentration in the sample is estimated by analyzing the spectrum data. Table R1-1 Length of Gas Cell and Measurable Range under Atmospheric Pressure (ppm) Gas Name CF4 CHF3 C2F6 C3F8 C4F8 SF6 NF3 CO CO2 COF2 OF2 HF SiF4 SO2 NO NO2 N2O Cell Length: 1 cm Cell Length: 10 cm Cell Length: 4 m Lower limit Upper limit Lower limit Upper limit Lower limit Upper limit 3 14 10 5 25 4 27 500 10 100 2550 125 45 15 1100 140 360 40000 40000 40000 50000 18000 3400 30000 30000 13500 10000 80000 72000 5700 12600 50000 14000 15000 0.3 1.4 1.0 0.5 2.5 0.4 2.7 50 1.0 10 255 12.5 4.5 1.5 110 14 36 4000 4000 4000 5000 1800 340 3000 3000 1350 1000 8000 7200 570 1260 5000 1400 1500 0.008 0.035 0.025 0.013 0.063 0.01 0.068 1.25 0.025 0.25 6.375 0.313 0.113 0.038 2.75 0.35 0.9 100 100 100 125 45 8.5 75 75 33.75 25 200 180 14.25 31.5 125 35 37.5 This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 7 Doc. 4712B SEMI LETTER (YELLOW) BALLOT Document Number: 4712B Date: 2/12/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 DRAFT #1 Relation between factors other than gas cell length, such as sample pressure, measurement time or instrument characteristics, and measurable range is specified in Simple Method for PFC Characterization using FT-IR. R1-1.3 Appropriate gas cell length should be selected at measuring referring to the Table R1-1. NOTE 12: A person may be able to select an appropriate gas cell length based upon F-GHG concentration in total input gas volume, without actual measurement of outlet gas from the ME when total gas volume change of inlet and outlet is estimated negligible. Because total volume of process gases is typically very little in comparison to the dilution gas volume. However the dilution gas volume characterization is recommended to validate the previous sentence. R1-1.4 Some spectra may interfere mutually in the measurement of gases containing multiple F-GHGs. For minimizing quantification error, absorption spectrum for quantification should be selected to prevent mutual interference. Measurement should be conducted within the range in which absorption and concentration are related linearly. R1-1.4.1 A simplified method for PFC measurement by FT-IR (Simple Method for PFC Characterization using FTIR Rev 2.20, Seiko Epson) is recommended for easy selection of an appropriate spectrum and linearity range. NOTE 13: The method is especially effective for use of “Classical Least Squares” by FT-IR. R1-1.4.2 The simplified method cited from “Simple Method for PFC Characterization using FT-IR” enables to set appropriate conditions for highly accurate measurement. Because it provides information of byproduct gas, an appropriate IR absorption spectrum for measurement and linearity range based upon input of a process gas to be used. R1-2 Quadrupole Mass Spectrometer (QMS) R1-2.1 QMS is comprised of an ionization power supply, an ion source, electrodes, a quadrupole power supply, a quadrupole electrode, a vacuum exhaust, a detector, an amplifier, an A/D converter, a data processor, and a display and recorder. Ionization unit Mass analysis unit Quadrupole power supply Ionization power supply Sample Ion Source Detecting unit Electrodes Quadrupole electrode A/D converter Detector Amplifier Data processor Display and recorder Vacuum exhaust Figure R1-2 Configuration of the Quadrupole Mass Spectrometer R1-2.2 QMS Mechanism R1-2.2.1 Sample gas is ionized. R1-2.2.2 The ion beam is separated depending on mass/electric charge ratio by an electric field and a magnetic field. R1-2.2.3 The ratio of each molecule of the whole sample gas is estimated. This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 8 Doc. 4712B SEMI LETTER (YELLOW) BALLOT Document Number: 4712B Date: 2/12/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 DRAFT RELATED INFORMATION 2 DRE Calculation Methods for Some Abatement Tools NOTICE: This Related Information is not an official part of SEMI [designation number] and was derived from the work of the global [committee name] Technical Committee. This Related Information was approved for publication by full letter ballot procedures on [A&R approval date]. R2-1 Plasma Type Abatement Tool R2-1.1 DRE is calculated from the emitted F-GHG volumes, at the outlet of the abatement tool, with the plasma on and off. DRE = (emitted F-GHG volume at the plasma off - emitted F-GHG volume at the plasma on) / emitted F-GHG volume at the plasma off (R2-1) R2-2 Combustion Type Abatement Tool R2-2.1 F-GHG characterization should be conducted at inlet and outlet of the abatement tool under combustion. NOTE 14: Since total volume of gases such as fuel, oxygen and air, supplied to combustion unit is large, F-GHG concentration is relatively low due to dilution effect. It is necessary to take care of selecting an appropriate gas cell length. NOTE 15: When the tool is connected to a wet scrubber, water spectrum on FT-IR should be deleted for accurate characterization. R2-3 Heater Type or Catalyst Type Abatement Tool R2-3.1 DRE is calculated from the emitted F-GHG volumes at the outlet of the abatement equipment with the heater on and off. DRE = (emitted F-GHG volume at the heater off - emitted F-GHG volume at the heater on) / emitted F-GHG volume at the heater off (R2-2) R2-3.2 DRE is also calculated from the emitted F-GHG volumes at inlet and outlet of the abatement tool. R2-4 Adsorption Type or Filtration Type Abatement Tool R2-4.1 F-GHG characterization should be conducted at inlet and outlet of the abatement tool. This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 9 Doc. 4712B SEMI LETTER (YELLOW) BALLOT Document Number: 4712B Date: 2/12/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 DRAFT RELATED INFORMATION 3 An Example of F-GHG Emission Characterization Survey Sheet from an Abatement Tool NOTICE: This Related Information is not an official part of SEMI [designation number] and was derived from the work of the global [committee name] Technical Committee. This Related Information was approved for publication by full letter ballot procedures on [A&R approval date]. R3-1 Survey Sheet R3-1.1 The following table is an example of F-GHG Emission Characterization Survey Sheet from an Abatement Tool. This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 10 Doc. 4712B SEMI LETTER (YELLOW) BALLOT Document Number: 4712B Date: 2/12/2016 Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 DRAFT Document Number: 4712B Date: 2/12/2016 LETTER (YELLOW) BALLOT Table R3-1 F-GHG Emission Characterization Survey Sheet Example This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 11 Doc. 4712B SEMI Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone: 408.943.6900, Fax: 408.943.7943 DRAFT NOTICE: Semiconductor Equipment and Materials International (SEMI) makes no warranties or representations as to the suitability of the Standards and Safety Guidelines set forth herein for any particular application. The determination of the suitability of the Standard or Safety Guideline is solely the responsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant literature, respecting any materials or equipment mentioned herein. Standards and Safety Guidelines are subject to change without notice. By publication of this Standard or Safety Guideline, SEMI takes no position respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this Standard or Safety Guideline. Users of this Standard or Safety Guideline are expressly advised that determination of any such patent rights or copyrights, and the risk of infringement of such rights are entirely their own responsibility. This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited. Page 12 Doc. 4712B SEMI LETTER (YELLOW) BALLOT Document Number: 4712B Date: 2/12/2016