Material Solutions for Consumer Electronics Dr. Kuzhichalil P. Surendran Materials Science and Technology Division, CSIR-National Institute for Interdisciplinary Science and Technology, Thiruvananthapuram - 695019 Email: firstname.lastname@example.org Consumer electronics in general, comprises of electronic equipments intended for everyday use, most often in entertainment, communications and office productivity. At the heart of every electronic gadgets, there sits a microprocessor which is essentially a semiconductor chip that can be programmed to perform various functions. According to Moore's Law, for a given price, the semiconductor functionality doubles every two years. The unprecedented miniaturisation demands at the integrated chip level pose uphill tasks before a Material Scientist like say, develop a chip interconnect more efficient than copper, develop an inter-dielectric with as low K as possible, and develop a high K gate dielectric better than silica and so for. On top of this, we will reach a point where the very existence of silicon itself is at stake due to the internal heat and leakage current at atomic level. On the other hand, the storage capacity of the memory devices are also tremendously expanding. Hence more energy efficient devices based on spintronics and magnetoelectric phenomena are actively pursued. The size shrinkage in consumer electronic gadgets have to deal with several unseen problems also. For example, placing a large amount of electrical and electronic systems into a very confined space poses the problem of keeping the Electromagnetic Interference (EMI) of these systems from interfering with each other through radiated and conducted emissions, that sometimes referred to as crosstalk. Tailor made composites and metamaterials have to be developed in order to mitigate the EMI in hand held gadgets. Of late, Printed Electronics (PE) has emerged as a new trend of electronics, in which electronically active components (semiconducting layers, electrodes, dielectrics, etc.) can be printed on flexible substrates, and thereby eliminating the cumbersome photolithographic process of silicon electronics.