Electroplating Process
Name_______________
Date___________B____
1. Connect the _____ wire to the positive side and the black wire to the _______________ side
2. Connect the piece of Cu metal to the other end of the ______ wire and the black wire to the metal object
3. Clip the Cu metal so it hangs in the solution of ________________ (name or formula of the compound).
4. When the power supply is turned on it forces _______________ to leave the piece of copper.
5. Therefore, the copper metal loses electrons. This process is called ___________________.
6. This causes the Cu metal to _______________ into solution as Cu2+ cations.
7. The half-reaction for the is process is: _______________________________________________________
8.
The power supply forces e- (stolen from piece of Cu) along the wire over to the metal object
9.
Now, there are extra electrons built up on the surface of the metal object
10. Cu2+(aq) cations in the surrounding CuSO4 solution are ___________________ to the metal object
11. When the Cu2+(aq) cations touch the metal object they ____________ 2e- which is called _______________.
12. The half-reaction for the is process is: ____________________________________________
13. Now, the Cu0(s) metal is uncharged and plating as a solid onto the object’s surface
14. Cu2+(aq) in solution that are being used up are replaced by the dissolving piece of Copper metal
15. The electroplating can occur because ____________ in solution carry the electrons and make a circuit.