Magnetic Anisotropy Studies on Pulsed
Electrodeposited Ni/Cu/Ni Trilayer
K. Dhanapal1, D. Prabhu2, R. Gopalan2 V. Narayanan3, A. Stephen1*
1
Materials Science Centre, Department of Nuclear Physics, University of Madras, Guindy Campus,
Chennai 600 025, India
2
Centre for Automotive Energy Materials, ARCI, Taramani, Chennai-600113
3
Department of Inorganic Chemistry, University of Madras, Guindy Campus,
Chennai-600 025, India
*
Corresponding author’s e-mail: stephen_arum@hotmail.com, Tel.: +91-4422202802; Fax: +91-4422353309
Abstract
Results and Discussion
The prediction of Neels about the surface anisotropy
increases great interest on preparation of multilayers with
magnetic and non-magnetic layer. The pulsed
electrodeposition method was employed for the deposition
of pure Ni, Ni/Cu and Ni/Cu/Ni films. This pulsed
electrodepostion method has greater advantages while
comparing with other methods. The X-ray diffraction
pattern confirms the formation of fcc structure for both
nickel and copper. The cross sectional scanning electron
microscopy shows the layer formation in Ni/Cu and
Ni/Cu/Ni films in layered nature. The vibrating sample
magnetometer was employed to determine magnetic
anisotropy behaviour of the layered films. It is observed
that the easy axis is in plane of the film for all the films.
The XRD pattern of pure Ni, Ni/Cu and
Ni/Cu/Ni is shown in the Fig 1. The pattern clearly shows
the formation of nickel and copper in bulk nature along
with high crystallinity. The cross sectional view of pure
Ni, Ni/Cu and Ni/Cu/Ni layered films shows that pure Ni
have smooth surface and having 13µm thickness. The
hysteresis loop is taken for two different orientation. The
hysteresis loop for all the three films show the anisotropy
behavior and maximum of -2.04X103 J/m3 anisotropy
energy is obtained for Ni/Cu/Ni layer
Keywords: Pulsed Electrodeposition, magnetic anisotropy,
metallic copper, trilayer film, polycrystalline anisotropy
Introduction
The multilayer with magnetic and non-magnetic
layers has greater advantage and greater application like
magnetic storage. The layer thickness determines the
perpendicular anisotropy in the multilayer systems. The
perpendicular anisotropy is defined as, when the easy
magnetization axis of the multilayers is perpendicular to
the plan of the multilayers so that the saturation
magnetization attained for less field. Sputter deposited
Co/Pd multilayer was the first reported material which
have perpendicular anisotropy. The possible mechanism
for the occurrence of perpendicular anisotropy is reduced
symmetry at the interface, shape anisotropy and
magnetostriction.
Materials and Methods
The pure Ni, Ni/Cu and Ni/Cu/Ni layered films
were prepared using pulsed electrodeposition method.
The stainless steel of grade 316L was used as a cathode
in conventional two electrode system. Nickel is deposited
from nickel sulphate bath and copper from copper
chloride bath. The deposited film were subjected to
various characterization like XRD, Cross sectional SEM
and VSM.
Fig. 1: XRD pattern of pure Ni, Ni/Cu and Ni/Cu/Ni
layered films.
Conclusion
The Ni/Cu and Ni/Cu/Ni layered films where
successfully deposited using pulsed electrodeposition
method. The XRD pattern confirms the formation of
nickel and copper in bulk nature with high crystallinity.
The layered nature along with rough interface between
the layers was studied from SEM. The anisotropy
behavior of the magnetic and non-magnetic layer was
studied using VSM.
Acknowledgment
Author acknowledge National Centre for
Nanoscience and Nanotechnology, University of Madras
for financial support.