Numerical solution for diffusion of solid copper
into liquid solder alloys
Nader Biglarijoo, Seyed Ahmad Mirbagheri
Abstract— Typically in soldering process, atoms of a solid diffuses into
liquid solder. In this paper the diffusion of copper into liquid Sn-Cu is
considered. Based on the previous studies, experimental results are gained for
this diffusion by evaluating the diffusion coefficient equal to D = 2.74 * 10 -10
m2/s. Using the finite difference method, the equation is solved and then drawn
to compare numerical and experimental results. Results show that finite
difference method can efficiently predict the diffusion values of copper into
liquid solder.
Keywords— diffusion, finite difference method, copper.